• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2011년도 춘계학술대회 논문집
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• pp.163-164
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• 2011

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.206-206
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• 2007

PCB기판 제작에 있어서 미세패턴을 형성하기 위한 차세대 공법으로 imprint공법을 이용하여 PCB기판제작에 대한 내용입니다. imprinting을 하기 위해서 미세때턴이 형성된 Tool-foil을 이용하여 imprinting시 Via hole을 동시 가공을 함으로서, 공정 비용 절감과 공정 프로세스 단축의 효과를 볼수 있다. 하지만 대면적(405*510size) imprint용 N-stamp제작이 쉽지 않으며, Ni-stamp가격 또한 만만치 않으며, 대면적 size일수록 이형처리 또한 쉽지 않다. 이형문제와 Stamp제작 비용을 줄이기 Cu-stamp를 제작 하여, Imprint후 이형처리 하지 않으며, Stamp제작 또한 쉬우며, 가격도 싸기 때문에 그에 따른 기대효과를 간략하게 소개 하고자 한다.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회A
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• pp.343-348
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• 2007

Molecular dynamics study of thermal NIL (Nano Imprint Lithography) process is performed to examine stamp-resist interactions. A layered structure consists of Ni stamp, poly-(methylmethacrylate) thin film resist and Si substrate was constructed for isothermal ensemble simulations. Imposing confined periodicity to the layered unit-cell, sequential movement of stamp followed by NVT simulation was implemented in accordance with the real NIL process. Both vdW and electrostatic potentials were considered in all non-bond interactions and resultant interaction energy between stamp and PMMA resist was monitored during stamping and releasing procedures. As a result, the stamp-resist interaction energy shows repulsive and adhesive characteristics in indentation and release respectively and irregular atomic concentration near the patterned layer were observed. Also, the spring back and rearrangement of PMMA molecules were analyzed in releasing process.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2008년도 춘계학술발표대회 및 제14회 신소재 심포지엄
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• pp.32.2-32.2
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• 2008

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2011년도 춘계학술대회 논문집
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• pp.475-476
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• 2011

• 대한금속재료학회지
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• 제46권6호
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• pp.377-381
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• 2008

Prism sheet of LCD BLU which depends on supply from Japan and U.S.A was studied by using Si anisotropic etching and injection molding technologies. First, the prism sheet was patterned on Si wafer through photolithography, and the best conditions of Si etching were determined through etching Si wafer with TMAH to obtain straight optimized zigzag patterns, and a cross pattern to provide light diffusion and concurrent focusing. The etch rate of TMAH was concluded to be constant for $25wt%-70^{\circ}C$ condition. Ni stamp of prism sheet was made by electrodeposition using patterned Si wafer, normal or fast H/C(Heating/Cooling) injections were carried out to fabricate prism sheet. It was known that fast H/C injection could fabricate prism sheet more accurately than normal injection. Zigzag patterns and the cross pattern showed higher transmissivity than the straight patterns because of light diffusion through diagonal direction. The fast H/C injection for zigzag patterns showed lower transmissivity than normal injection because there occurred more light diffusion through precise injection patterns, but the fast H/C injection for straight patterns showed only refraction without diffusion, causing lower transmissivity than normal injection.

• 한국재료학회지
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• 제16권4호
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• pp.225-230
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• 2006

Nanoimprint lithography (NIL) is a novel method of fabricating nanometer scale patterns. It is a simple process with low cost, high throughput and resolution. NIL creates patterns by mechanical deformation of an imprint resist and physical contact process. The imprint resist is typically a monomer or polymer formulation that is cured by heat or UV light during the imprinting process. Stiction between the resist and the stamp is resulted from this physical contact process. Stiction issue is more important in the stamps including narrow pattern size and wide area. Therefore, the antistiction layer coating is very effective to prevent this problem and ensure successful NIL. In this paper, an antistiction layer was deposited and characterized by PECVD (plasma enhanced chemical vapor deposition) method for metal stamps. Deposition rates of an antistiction layer on Si and Ni substrates were in proportion to deposited time and 3.4 nm/min and 2.5 nm/min, respectively. A 50 nm thick antistiction layer showed 90% relative transmittance at 365 nm wavelength. Contact angle result showed good hydrophobicity over 105 degree. $CF_2$ and $CF_3$ peaks were founded in ATR-FTIR analysis. The thicknesses and the contact angle of a 50 nm thick antistiction film were slightly changed during chemical resistance test using acetone and sulfuric acid. To evaluate the deposited antistiction layer, a 50 nm thick film was coated on a stainless steel stamp made by wet etching process. A PMMA substrate was successfully imprinting without pattern degradations by the stainless steel stamp with an antistiction layer. The test result shows that antistiction layer coating is very effective for NIL.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.1206-1209
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• 2005

In recent, injection molding process for features in sub-micron scale is under active development as patterning nano-scale features, which can provide the master or stamp for molding, and becomes available around the world. Injection molding has been one of the most efficient processes for mass production of the plastic product, and this process is already applied to nano-technology products successfully such as optical storage media like DVD or BD which is a large area plastic thin substrate with nano-scale features on its surface. Bio chip for like DNA sequencing may be another application of this plastic substrate. The DNA can be sequenced using order of 100 nm pore structure when making the DNA flow through the pore structure. Agarose gel and silicon based chip have been used to sequence the DNA, but injection molded plastic chip may have benefit in terms of cost. This plastic DNA sequencing chip has plenty of pillars in order of 100 nm in diameter on the substrate. When the usual features in case of DVD or BD have very low aspect ratio, even less than 0.5, but the DNA chip will have relatively high aspect ratio of about 2. It is not easy to injection mold the large area thin substrate with sub-micron features on its surface due to the characteristics of the molding process and it becomes much more difficult when the aspect ratio of the features becomes high. We investigated the effect of the molding parameters for injection molding with high aspect ratio nano-scale features and injection molded some plastic DNA sequencing chips. We also fabricated PR masters and Ni stamps of the DNA chip to be used for molding

• 청정기술
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• 제28권4호
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• pp.323-330
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• 2022

미세유체 종이-기반 분석 장치는 최근 현장 진단 및 환경 물질 감지를 포함한 다양한 적용가능성으로 주목을 받고 있다. 본 연구는 적은 비용과 간단한 검출 방법으로 중금속을 빠르게 검출할 수 있는 3D-μPAD를 제작하기 위해 PDMS 양면 인쇄 방법을 제안하였다. 3D-μPAD 디자인은 레이저 커팅으로 아크릴 스탬프에 적용할 수 있으며, 제작된 스탬프에 PDMS 고분자를 스핀 코팅 후 양면접촉인쇄 방식 도입을 통해 3차원 형태의 소수성 장벽 형성에 필요한 조건을 확인하였다. 구체적으로 소수성 장벽 형성 조건인 고분자 농도, 스핀 코팅 속도 및 접촉 시간에 따라 PDMS 소수성 장벽 면적과 친수성 채널의 면적 변화를 분석함으로써 3D-μPAD 제작 공정 조건 최적화를 수행하였다. 최적화된 μPAD로 니켈, 구리, 수은 이온, pH를 다양한 농도에서 검출하였고 이를 ImageJ 프로그램으로 분석하여 grayscale 값으로 정량화 하였다. 이를 통해 3D-μPAD를 제작함으로써 특별한 분석 기기 없이 다양한 중금속 비색 검출을 수행함으로써 조기진단 바이오 센서로의 응용 가능성을 증명하였다. 이 3D-μPAD는 휴대가 간편한 다중 금속이온 검출 바이오센서로서, 신속한 현장 모니터링이 가능하므로 개발도상국 같은 자원이 제한된 지역에서 유용하게 사용 가능하다.

• 한국정밀공학회지
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• 제25권4호
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• pp.134-139
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• 2008

A spirally arrayed nano-pattern is designed as a model pattern for the next generation optical storage media. The pattern consists off types of embossed rectangular dot, which are 50nm, 100nm, 150nm and 200nm in length and 50nm in width. The height of the dot is designed to be 50nm. The pitch of the spiral track of the pattern is 100nm. A ER(Electron resist) master for this pattern is fabricated by e-beam lithography process. The ER is first spin-coated to be 50nm thick on a Si wafer and then the model pattern is written on the coated ER layer by e-beam. After developing this pattern written wafer in the solution, a ER pattern master is fabricated. The most conventional e-beam machine can write patterns in orthogonal way, so we made our own pattern generator which can write the pattern in circular or spiral way. This program generates the patterns to be compatible with the e-beam machine from Raith(Raith 150). To fabricate 50nm pattern master precisely, a series of experiments were done including the design compensation for the pattern size, optimization of the dose, acceleration voltage, aperture size and developing. Through these experiments, we conclude that the higher accelerating voltages and smaller aperture size are better for mastering the nano pattern which is in order of 50nm. With the optimized e-beam lithography process, a spiral arrayed 50nm pattern master adopting PMMA resist was fabricated to have dimensional accuracy over 95% compared to the designed. Using this pattern master, a metal pattern stamp will be fabricated by Ni electro plating for injection molding of the patterned plastic substrate.