• 한국표면공학회지
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• 제30권1호
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• pp.33-43
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• 1997

The effects of process parameters substrate such as substrate current and substrate temperature on the corrosion resistance of ion plated TiN film were investigated. TiN fims were deposited on speed steel on which Ti or Ni hed been previously evaporated. Dense TiN films could be obtained under higher substrate current(1A) and substrate temperature($500^{\circ}C$), whereas TiN films deposited with lower substances current(0.5A) and substrate temperature($300^{\circ}C$) showed porous structure. The corrosion resistances of high speed steel was considerably increased when dense TiN films had been formed on it. The effect of Ti and Ni interlayer on the increase of the corrosion resistance was also significant with dense TiN films, while there was little effect of interlayer on the corrosion resistance when TiN films were porous. the effect of interlayer on the corrosion resistance was more outstanding with Ti then with Ni, because Ti reacts more easily with oxygen to form an oxide layer, and it also shows higher resistance against chlorine containing corrosion media.

• 한국세라믹학회지
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• 제38권6호
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• pp.506-508
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• 2001

The ferrite plating with applying power ultrasound waves of 19.5 kHz and 600W enabled us to encapsulate entirely MnZn ferrite cores for transformers with Ni$\sub$x/Zn$\sub$y/Fe$\sub$3-x-y/O$_4$coating. Supplying a NH$_4$OH solution during the plating broke the limit of the solubility of Ni ions to ferrite-plated films. The electrical resistivity of the NiZn ferrite coating increased with increasing the Ni and Zn content, reaching 2.3${\times}$10$\^$5/Ωcm at the composition of Ni$\sub$0.24/Zn$\sub$0.30/Fe$\sub$2.46/O$_4$. The saturation magnetization was 540 emu/㎤. As a result, the MnZn ferrite cores were successfully encapsulated with the NiZn ferrite coatings for an insulation layer.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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• pp.456-462
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• 2002

In the present work, a low cost and fine pitch bumping process by electroless Ni/immersion Au UBM (under bump metallurgy) and stencil printing for the solder bump on the Al pad is discussed. The Chip used this experimental had an array of pad 14x14 and zincate catalyst treatment is applied as the pretreatment of Al bond pad, it was shown that the second zincating process produced a dense continuous zincating layer compared to first zincating. Ni UBM was analyzed using Scanning electron microscopy, Energy dispersive x-ray, Atomic force microscopy, and X-ray diffractometer. The electroless Ni-P had amorphous structures in as-plated condition. and crystallized at 321 C to Ni and Ni$_3$P. Solder bumps are formed on without bridge or missing bump by stencil print solder bump process.

• Journal of the Optical Society of Korea
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• 제19권3호
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• pp.217-221
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• 2015

Developing a metallization that has low cost and high efficiency is essential in solar-cell industries, to replace expensive silver-based metallization. Ni/Cu two-step metallization is one way to reduce the cost of solar cells, because the price of copper is about 100 times less than that of silver. Alkaline electroless plating was used for depositing nickel seed layers on the front electrode area. Prior to the nickel deposition process, 2% HF solution was used to remove native oxide, which disturbs uniform nickel plating. In the subsequent step, a nickel sintering process was carried out in $N_2$ gas atmosphere; however, copper was plated by light-induced plating (LIP). Plated nickel has different properties under different bath conditions because nickel electroless plating is a completely chemical process. In this paper, plating bath conditions such as pH and temperature were varied, and the metal layer's structure was analyzed to investigate the adhesion of Ni/Cu metallization. Average adhesion values in the range of 0.2-0.49 N/mm were achieved for samples with no nickel sintering process.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.192-193
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• 2007

An evaporated Ti/Pd/Ag contact system is most widely used to make high-efficiency silicon solar cells, however, the system is not cost effective due to expensive materials and vacuum techniques. Commercial solar cells with screen-printed contacts formed by using Ag paste suffer from a low fill factor and a high shading loss because of high contact resistance and low aspect ratio. Low-cost Ni and Cu metal contacts have been formed by using electro less plating and electroplating techniques to replace the Ti/Pd/Ag and screen-printed Ag contacts. Ni/Cu alloy is plated on a silicon substrate by electro-deposition of the alloy from an acetate electrolyte solution, and nickel-silicide formation at the interface between the silicon and the nickel enhances stability and reduces the contact resistance. It was, therefore, found that nickel-silicide was suitable for high-efficiency solar cell applications. Cu was electroplated on the Ni layer by using a light induced plating method. The Cu electroplating solution was made up of a commercially available acid sulfate bath and additives to reduce the stress of the copper layer. In this paper, we investigated low-cost Ni/Cu contact formation by electro less and electroplating for crystalline silicon solar cells.

• Progress in Superconductivity
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• 제6권2호
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• pp.133-137
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• 2005

We fabricated the Au/Ni template for YBCO coated conductors and evaluated texture formation and the microstructural evolution. The cube textured Ni substrate was fabricated by rolling and recrystallization annealing, and subsequently Au layer formed on the substrate by electroless-plating method. The texture was evaluated by pole-figure with x-ray goniometer with orientation distribution function (ODF) analysis. The surface roughness and grain boundary morphology of template were characterized by atomic force microscopy (AFM) We observed that Au layer deposited epitaxially on Ni substrate and formed a strong cube texture when plating time was optimized. The full-width at half-maximum (FWHM) was $8.4^{\circ}$ for out-of-plane and $9.98^{\circ}$ for in-plane texture for plating time of 30 min. Microstructural observation showed that the Au layer was homogeneous and dense without formation of crack/microcrack. In addition, we observed that root-mean-square (RMS) and depth of grain boundary were 14.6 nm and 160 $\AA$ for the Au layer, respectively, while those were 27.0 nm and 800 $\AA$ for the Ni substrate, indicating that the electoless-plated Au layer had relatively smooth surface and effectively mollified grain groove.

• Corrosion Science and Technology
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• 제19권2호
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• pp.57-65
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• 2020

As competition among global automakers intensifies, demand for materials that are better in price and performance is increasing. While steel and plastic materials compete for automotive fuel tanks, plastic materials have advantages such as light weight for automobiles. However, they have high prices. Accordingly, in this paper, four types of Zn-X plated steel sheets, electroplating (X = none, Sn) and galvannealed (X = Fe, Fe-Mg), were manufactured and their applicability as a fuel tank material was evaluated. Nano-composite coating solution with good conductivity was treated on the surface of plated steels using a roll coater and then cured through induction furnace to improve corrosion resistance. Quality characteristics such as corrosion resistance, fuel resistance to diverse gasoline and diesel fuels, and seam weldability were evaluated for the above plated steels. Their properties were compared and analyzed with conventional Zn-Ni electroplating steels. Among the above plated steels, Zn-Fe-Mg galvannealed steels coated with nano-composite coating exhibited better properties than other steels. Detailed experimental results suggest that evenly distributed Mg elements on the coating layer play a key role in the enhanced quality performance.

• 한국재료학회지
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• 제7권1호
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• pp.76-80
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• 1997

용융탄산염 연료전지 분리판의 wet-seal부의 내식성 향상을 위한 NiAl 피복공정이 조사되었다. AlSl 316 스테인레스강위에 Ni과 Al를 순차적으로 피복한 후, $800^{\circ}C$에서 3시간 열처리하여 NiAl상이 형성됨을 확인할 수 있었다. NiAl상이 피복된 스테인레스강은 $650^{\circ}C$, 용융탄산염($62^{m}/_{o}Li_2CO_3-38^{m}/_{o}/K_{2}CO_{3}$)내에서 침지시험을 통해 내식성이 평가되었는데, AISI 316 스테인레스강에 비해 우수한 내식성을 보였다. 이는 표면에 치밀하게 형성된 AI 산화물층에 의한 것으로 판단되었다.

• 한국재료학회지
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• 제24권11호
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• pp.632-638
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• 2014

We investigated the effects of DMAB (Borane dimethylamine complex, C2H10BN) in electroless Ni-B film with addition of DMAB as reducing agent for electroless Ni plating. The electroless Ni-B films were formed by electroless plating of near neutral pH (pH 6.5 and pH 7) at $50^{\circ}C$. The electroless plated Ni-B films were coated on screen printed Ag pattern/PET (polyethylene terephthalate). According to the increase of DMAB (from 0 to 1 mole), the deposition rate and the grain size of electroless Ni-B film increased and the boron (B) content also increased. In crystallinity of electroless Ni-B films, an amorphization reaction was enhanced in the formation of Ni-B film with an increasing content of DMAB; the Ni-B film with < 1 B at.% had a weak fcc structure with a nano crystalline size, and the Ni-B films with > 5 B at.% had an amorphous structure. In addition, the Ni-B film was selectively grown on the printed Ag paste layer without damage to the PET surface. From this result, we concluded that formation of electroless Ni-B film is possible by a neutral process (~green process) at a low temperature of $50^{\circ}C$.

• 한국전기전자재료학회논문지
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• 제24권4호
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• pp.328-332
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• 2011

The formation of front metal contact silicon solar cells is required for low cost, low contact resistance to silicon surface. One of the front metal contacts is Ni/Cu plating that it is available to simply and inexpensive production to apply mass production. Ni is shown to be a suitable barrier to Cu diffusion into the silicon. The process of Ni electroless plating on front silicon surface is performed using a chemical bath. Additives and buffer agents such as ammonium chloride is added to maintain the stability and pH control of the bath. Ni deposition rate is found to vary with temperature, time, utilization of bath. The experimental result shown that Ni layer by SEM (scanning electron microscopy) and EDX analysis. Finally, plated Ni/Cu contact solar cell result in an efficiency of 17.69% on $2{\times}2\;cm^2$, Cz wafer.