• 연구논문집
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• s.33
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• pp.183-190
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• 2003

Today, We have used many electronic equipment such as computer, TV, cellular phone and so on. These equipment radiate a large amount of EMI(Electromagnetic interference) which is occurred trouble of airplane, medical equipment, communicate equipment, and especially, human health. So, Ni mesh fabrication for EMI shielding by continuous electroforming process was investigated. Continuous electroforming apparatus was made by means of rotating cathode drum. And We investigated the characteristics of two types of Ni electroforming solution. One was made by laboratory and the other was produced by M cooperation. The grain size increased with increasing current density and bath temperature, and decreasing rotating speed of cathode drum. EDX results indicate that the Ni mesh electroformed by the KIMM solution is composed of pure Ni. But the Ni mesh electroformed by the M cooperation solution has Ni and S element. The incorporation of S element in the Ni mesh has a profoundly effect on mechanical properties such as hardness, internal stress and so on.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.10a
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• pp.188-191
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• 2004

Electroforming is a process that employs technology similar to that used for electroplating but which is used for manufacturing metallic articles, rather than as a means of producing surface coatings. Electroforming provides a cost-effective means of producing alloys and fully dense nanocrystalline metals as foils, sheets and complex shapes. It was able to make Fe-Ni foil with $5{\mu}m$ thickness by electroforming. Electroformed Fe-Ni alloy was nanocrystalline and the yield strength was in the range $2000{\sim}2800\;MPa$. The magnetic permeability at high frequency of electroformed Fe-Ni foil was higher than that of thicker foils.

• Transactions of Materials Processing
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• v.14 no.2 s.74
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• pp.121-125
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• 2005

Electroforming is a process that employs technology similar to that used for electroplating but which is used for manufacturing metallic articles, rather than as a means of producing surface coatings. Electroforming provides a cost-effective means of producing alloys and fully dense nanocrystalline metals as foils, sheets and complex shapes. Fe-Ni nanocrystalline alloy foils with composition in the $36\~80wt\%$ Ni range were fabricated by electroforming. The thickness of electroformed foils was in the range of $5\~30{\mu}m$. TEM and XRD analysis was applied for measuring the grain size. Very fine grain size$(\~10nm)$ was obtained in alloy foils. The yield and tensile strength of electroformed Fe-Ni alloy were 2000-2800 MPa and 2500-3300 MPa respectively. The magnetic permeability at high frequency of electroformed Fe-Ni foil was higher than that of thicker foils.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.10a
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• pp.276-279
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• 2004

The factors affecting Ni-Co alloy electroforming were investigated to determine the optimum bath composition and electroplating parameters, like pH, temperature, and current density, suitable for high speed fabrication of a micro mold with longer lifetime. To obtain alloy deposits having uniform thickness and composition, electroplating parameters were finely tuned with home-made electroforming apparatus. Ni-Co alloy deposits had linearly increased Co with $Co^{2+}$ ion concentration in electroplating bath, and showing $412H_v$ of Victors hardness at $23wt\%$ of Co content. For Ni-Co alloy, sulfonate and diol related organic additives were very effective to alleviate its residual stress and surface roughness. The maximum deposition rate was $106{\mu}m/hr$ at 10ASD and the tensile strength of alloy deposit was 2 times larger than that of Ni only case.

• 한국금형공학회:학술대회논문집
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• 2008.06a
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• pp.35-38
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• 2008

A pattern master and a Ni stamper for 50nm class of patterns are fabricated through e-beam lithography and Ni electroforming process. A model pattern set is designed, which is based on unit patterns of 50nm, 100nm, 150nm and 200nm in length and 50nm in width. The e-beam process is optimized to fabricate designed patterns with some parameters including dose, accelerating voltage, focal distance and developing time. For Ni electroforming to fabricate Ni stamper, a seed layer, a conducting layer, is deposited first on the pattern master fabricated by an e-beam lithography process. Ni, Ti/Ni and Cr are first tested to find optimal seed layer process. Currently the best result is obtained when adopting Cr deposited to be 100nm thick with continuous tilting motion of the master substrate during the deposition process.

• Korean Journal of Materials Research
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• v.17 no.10
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• pp.538-543
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• 2007

We fabricated the Ni plate by electroforming process and evaluated the microstructure, mechanical properties and wear behavior of the Ni plate. Specifically, the effects of addition of wetting agents, SF 1 and SF 2 solutions, on the microstructure and properties were investigated. The microstructure and surface morphology were characterized by transmission electron microscopy (TEM) and atomic force microscopy (AFM), respectively, and friction coefficient was measured by the ball-on-disk method. We found that the microstructure and mechanical properties of Ni plate were changed with kind and amount of wetting agents used. The hardness and tensile strength of Ni plate formed without wetting agents was 228 Hv and 660.7 MPa, respectively, whiled when wetting agent was added, those were improved to be 739 Hv and 1286.3 MPa. These improvements were probably due to the finer grain size and less crystallization of Ni. In addition, when both wetting agents were added, the friction coefficient was reduced from 0.73 to 0.67 which is partially caused by the improved hardness and smooth surface.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2011.05a
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• pp.49-49
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• 2011

본 연구에서는 Fe계 합금전주도금 미세부품 및 금형 제조에 사용되는 전주용 Fe계 합금도금 기술을 개발을 위해 Fe-Ni 및 Fe-Ni-W 합금 전기도금에 대한 속도론적 고찰을 통해 Fe-Ni 합금도금층 내의 Fe과 Ni, Fe-Ni-W 합금 도금층 내의 Fe, Ni, W 성분 함유량에 대한 각각의 공정 제어인자를 규명하였다. Fe-Ni합금과 Fe-Ni-W합금도금층 구현에 있어 합금도금액의 합성, 최적 전류밀도 범위 도출, 합금도금층의 표면거칠기 및 경도 확보를 위한 공정조건 확립 등을 수행하였고, 전주(electroforming)를 이용하여 마이크로 기어 및 금형을 제조하였다.

• 한국전기화학회:학술대회논문집
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• 2003.04a
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• pp.41-41
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• 2003

• Proceedings of the Korean Magnestics Society Conference
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• 2002.04a
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• pp.130-131
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• 2002

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2003.10a
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• pp.101-101
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• 2003