• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2005년도 추계학술발표대회 개요집
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• pp.219-221
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• 2005

Sn-9Zn solder balls were bonded to Cu, ENIG (Electroless Nickel/Immersion Gold) and electrolytic Au/Ni pads, and the effect of aging on their joint reliability was investigated. The interfacial products were different from the general reaction layer formed in a Sn-base solder. The intermetallic compounds formed in the solder/Cu joint were $Cu_{5}Zn_{8}$ and $Cu_{6}Sn_{5}$. After aging treatment, voids formed irregularly at the bottom side of the solder because of Sn diffusion into the $Cu_{5}Zn_{8}$ IMC. In the case of the solder/ENIG joint, $AuZn_{3}$ IMCs were formed at the interface. In the case of the Au/Ni/Cu substrate, an $AuZn_{3}$ IMC layer formed at the interface due to the fast reaction between Au and Zn. In addition, the $AuZn_{3}$ IMC layer became detached from the interface after reflow. When the aging time was extended to 100 h, $Ni_{5}Zn_{21}$ IMC was observed on the Ni substrate.

• 한국표면공학회지
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• 제55권5호
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• pp.299-307
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• 2022

Gold plating is used as a coating of connector in printed circuit boards, ceramic integrated circuit packages, semiconductor devices and so on, because the film has excellent electric conductivity, solderability and chemical properties such as durability to acid and other chemicals. In most cases, internal connection between device and package and external terminals for connecting packaging and printed circuit board are electroless Ni-P plating followed by immersion Au plating (ENIG) to ensure connection reliability. The deposition behavior and film properties of electroless Au plating are affected by P content, grain size and mixed impurity components in the electroless Ni-P alloy film used as the underlayer plating. In this study, the correlation between electroless nickel plating used as a underlayer layer and cyanide-free electroless Au plating using thiomalic acid as a complexing agent and aminoethanethiol as a reducing agent was investigated.

• Progress in Superconductivity
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• 제6권2호
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• pp.133-137
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• 2005

We fabricated the Au/Ni template for YBCO coated conductors and evaluated texture formation and the microstructural evolution. The cube textured Ni substrate was fabricated by rolling and recrystallization annealing, and subsequently Au layer formed on the substrate by electroless-plating method. The texture was evaluated by pole-figure with x-ray goniometer with orientation distribution function (ODF) analysis. The surface roughness and grain boundary morphology of template were characterized by atomic force microscopy (AFM) We observed that Au layer deposited epitaxially on Ni substrate and formed a strong cube texture when plating time was optimized. The full-width at half-maximum (FWHM) was $8.4^{\circ}$ for out-of-plane and $9.98^{\circ}$ for in-plane texture for plating time of 30 min. Microstructural observation showed that the Au layer was homogeneous and dense without formation of crack/microcrack. In addition, we observed that root-mean-square (RMS) and depth of grain boundary were 14.6 nm and 160 $\AA$ for the Au layer, respectively, while those were 27.0 nm and 800 $\AA$ for the Ni substrate, indicating that the electoless-plated Au layer had relatively smooth surface and effectively mollified grain groove.

• 자원환경지질
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• 제53권4호
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• pp.363-381
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• 2020

The polymetallic Co, Ni, Cu, As, Au, and Ag deposits of Bou Azzer East are located in the western part of the Bou Azzer inlier in the Central Anti Atlas, Morocco. Six stages of emplacement of the mineralization have been identified. Precious metals (native gold and electrum) are present in all stages of this deposit except the early nickeliferous stage. From the Statistical analysis of the Co, As, Ni, Au, and Ag contents of a set of 501 samples, shows that the Pearson correlation coefficient between As-Co elements (0.966) is the highest followed by that of the Au-Ag couple (0.506). Principal component analysis (PCA) and hierarchical ascending classification (HAC) of the grades show, that Ni is associated with the pair (As-Co) and Cu is rather related to the pair (Au-Ag). The kriging maps show that the highest values of the Co, As and Ni appear in the contact of the serpentinite with other facies, as for those of Au and Ag, in addition to anomalous zones concordant with those of Co, Ni and As, they show anomalies at the extreme South and North of the study area. The development of the anomalous Au and Ag zones is mainly along the N40-50°E and N145°E directions.

• 한국전기전자재료학회논문지
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• 제21권7호
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• pp.610-614
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• 2008

In this work, the electrical and optical properties of the two different p-type GaN electrode schemes, ZnNi/ITO and ZnNi/Au, were compared each other, and applied to the top-emitting GaN/InGaN light-emitting diodes (LEDs). The ZnNi/ITO electrode showed much higher transmittance (90%) and slightly lower contact resistance $(1.27{\times}10^{-4}{\Omega}cm^2)$ than those (77%, $(2.26{\times}10^{-4}{\Omega}cm^2)$) of the ZnNi/Au at a wavelength of 460 nm. In addition, GaN LEDs having ZnNi/ITO showed accordingly higher light output power and luminous intensity than those having ZnNI/Au did at the current levels up to 1 A.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.68-71
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• 2003

The reaction of ultra-small eutectic 58Bl-42Sn solder bump with Au/Ni/Ti and Au/Cu/Ti UBMs during reflow was studied. The eutectic Bi-Sn solder bumps of $46{\mu}m$ diameter were fabricated by using the evaporation method and were reflowed using the rapid thermal annealing system. The intermetallic compound was characterized using a SEM, an EDS, and an XRD. The $(Cu_xAu_{1-x})_6Sn_5$ compounds formed at the interface between Bi-Sn solder and Au/Cu/Ti UBM. On the other hand, in the Bi-Sn solder bump on Au/Ni/Ti UBM, the faceted and rectangular intermetallic compounds were observed on the solder bump surface and inside the solder bump as well as at the UBM interface. These intermetallic compounds were Identified as $(Au_{l-x-y}Bi_xNi_y)Sn_2$ phase.

• 마이크로전자및패키징학회지
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• 제8권3호
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• pp.55-62
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• 2001

최근 전자 제품에서 사용이 폭발적으로 증가하고 있는 BGA, CSP 등의 면실장형 부품의 폭 넓은 채용에 따라서 베어 보드에서 solderability에 영향을 미치는 평탄한 표면 처리에 대한 요구는 갈수록 증가되고 있다. 무전해 Ni/Au도금 처리는 이러한 요구에 대한 해결책을 가지고 있어서 많은 전자제품에서 평탄한 표면 처리를 요구하는 응용 분야에 폭 넓게 사용되고 있다. 그러나, 무전해 Ni/Au 도금은 평탄한 표면 처리를 가지는 반면에 도금 공정에서 Ni의 산화와 적정한 P성분과 같은 몇 가지 해결요소를 가지고 있는 실정이다. 본 연구에서는 무전해 Ni/Au 도금 처리를 한 보드에서 BGA의 solderability에 미치는 영향을 사전 조사한 후, NiP 산화 특성과 보드의 휨과 간은 주요 인자를 선정하였다. 이를 위하여 먼저, 다양한 도금 조건을 가지는 테스트 보드를 제작한 후, 도금 공정에서 P성불을 감소시켜 NiP 산화 특성을 개선하였다. 또한 다양한 내층 구조와 휨 분석을 통해 내층 구조를 개선하여 보드의 휨을 최소화하였다. Solderability의 평가를 위해서 최적의 조건으로 제작된 보드에 BGA를 실장하여 보드의 휨과 도금 특성을 분석하였다. BGA의 접합부 조직은 주사 전자현미경(SEM: Scanning Electronic Microscope)과 광학 현미경(Optical Microscope)으로 관찰하였으며, 성분 분석은 EDS(Energy Dispersive Spectroscopy)를 활용하였다. 또한 기계적인 특성은 ball shear tester를 사용해서 파괴 강도와 모드를 분석하였다.

• 한국재료학회지
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• 제12권9호
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• pp.750-760
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• 2002

In this study, three solders, Sn-37Pb, Sn-3.5Ag, and Sn-3.8Ag-0.7Cu were screen printed on both electroless Ni/Au and OSP metal finished micro-via PCBs (Printed Circuit Boards). The interfacial reaction between PCB metal pad finish materials and solder materials, and its effects on the solder bump joint mechanical reliability were investigated. The lead free solders formed a large amount of intermetallic compounds (IMC) than Sn-37Pb on both electroless Ni/Au and OSP (Organic Solderabilty Preservatives) finished PCBs during solder reflows because of the higher Sn content and higher reflow temperature. For OSP finish, scallop-like $Cu_{6}$ /$Sn_{5}$ and planar $Cu_3$Sn intermetallic compounds (IMC) were formed, and fracture occurred 100% within the solder regardless of reflow numbers and solder materials. Bump shear strength of lead free solders showed higher value than that of Sn-37Pb solder, because lead free solders are usually harder than eutectic Sn-37Pb solder. For Ni/Au finish, polygonal shaped $Ni_3$$Sn_4$ IMC and P-rich Ni layer were formed, and a brittle fracture at the Ni-Sn IMC layer or the interface between Ni-Sn intermetallic and P-rich Ni layer was observed after several reflows. Therefore, bump shear strength values of the Ni/Au finish are relatively lower than those of OSP finish. Especially, spalled IMCs at Sn-3.5Ag interface was observed after several reflow times. And, for the Sn-3.8Ag-0.7Cu solder case, the ternary Sn-Ni-Cu IMCs were observed. As a result, it was found that OSP finished PCB was a better choice for solders on PCB in terms of flip chip mechanical reliability.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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• pp.412-412
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• 2008

ENIG(Electroless Nickel Immersion Gold)is a surface treatment method that is used most widely at fine pitch's SMT and BGA packaging process. ENIG has good diffusion barrier of Ni against solder and good wettability due to Au finish. But when the discoloration occurred on the Au finish of ENIG, some key characteristics related to the quality and reliability of PCB such as bondability, solderability and electrical flowing of packaging process could be deteriorated. In this paper, we have performed the water dip test ($88^{\circ}C$ purified water) which accelerates the galvanic corrosion of Ni diffused from the Ni-P layer. That is, the excessive oxidation of the Ni layer could result in non-wetting of the solder because the flux may not be able to remove excessive oxides. Though Au discoloration have been reported to be caused by Ni oxides in many literature, it is still open to verify and discuss The microstructures and chemical compositions have been investigated using FE-SEM, TEM, FIB, EDS and XPS. As a result, authors have found that the Au discoloration in ENIG type is severely caused by the oxidation of the Ni and the mechanism of Au discoloration can be confirmed through the experiment result of water dip test.

• 자원리싸이클링
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• 제20권4호
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• pp.58-64
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• 2011

고온에서 PCB 처리를 통한 Au, Ag와 같은 귀금속뿐 아니라 Ni과 같은 주요 회유금속을 회수하기 위한 기초연구로서 CaO-$Al_2O_3$(-$SiO_2$) 및 CaO-$SiO_2$-$CaF_2$ 슬래그를 이용하여 Au, Ag, Ni의 회수거동올 관찰하였다. 슬래그 투입 없이 PCB만으로 용융실험을 수행한 결과 PCB는 거의 용융되지 않았으며, 이로부터 유도전류를 이용한 용융을 촉진할 뿐 아니라 유가금속의 회수를 위해서는 Cu와 갇은 적절한 base metal이 필요함을 확인하였다. 본 연구결과, PCB/Cu ratio는 1 이하가 바람직할 것으로 생각된다. CaO-$Al_2O_3$(-$SiO_2$) 및 CaO-$SiO_2$-$CaF_2$ 슬래그를 투입한 결과, $CaF_2$를 함유하는 fluorosilicate계 슬래그가 calcium aluminate계 슬래그보다 융점과 점도가 낮게 제어되었으며, 이로부터 Au, Ag, Ni의 높은 분배비를 얻을 수 있었다. 점도가 낮은 $CaF_2$ 함유 슬래그 적용 시 높은 유가금속 회수율은 슬래그 내에서 각 금속입자의 등속침강속도가 상승하기 때문인 것으로 평가되었다.