• Transactions of the Korean Society of Mechanical Engineers
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• v.18 no.7
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• pp.1713-1721
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• 1994

Intermetallic-matrix composites(IMCs) have the potential of combing matrix properties of oxidation resistance and high temperature stability with reinforcement properties of high specific strength and modulus. One of the major limiting factors for successful applications of these composite at high temperatures is the formation of interfacial reactions between matrix and ceramic reinforcement during composite process and during service. The purpose of the present investigation is to develop a better understanding of the nature of creep fracture mechanisms in a $Ni_{3}Al$ composite reinforced with both $TiB_{2}$ and SiC particulates. Emphasis is placed in the roles of the products of the reactions in determining the creep lifetime of the composite. In the present study, creep rupture specimens were tested under constant ranging from 180 to 350 MPa in vacuum at $760^{\cric}C$. The experimental data reveal that the stress exponent for power law creep for the composite is 3.5, a value close to that for unreinforced $Ni_{3}Al$. The microstructural observations reveal that most of the cavities lie on the grain boundaries of the $Ni_{3}Al$ matrix as opposed to the large $TiB_{2}/Ni_{3}Al$ interfaces, suggesting that cavities nucleate at fine carbides that lie in the $Ni_{3}Al$ grain boundaries as a result of the decomposition of the $SiC_{p}$. This observation accounts for the longer rupture times for the monolicthic $Ni_{3}Al$ as compared to those for the $Ni_{3}Al/SiC_{p}/TiB_{2} IMC$. Finally, it is suggested that creep deformation in matrix appears to dominate the rupture process for monolithic $Ni_{3}Al$, whereas growth and coalescence of cavities appears to dominate the rupture process for the composite.

• Bulletin of the Korean Chemical Society
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• v.11 no.5
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• pp.379-383
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• 1990

$YBa_2Cu_{3-x}Ni_xO_{7-{\delta}}$, with x = 0.05, 0.2, 0.4, 0.7 and 1.0 had been prepared by the thermal decomposition of corresponding nitrates. Among them, the sample with x = 0.05 shows above-liquid-$N_2$ temperature superconductivity with $T_c$ of 88.7K. According to the X-ray diffraction analysis, its crystal symmetry was estimated as orthorhombic with the lattice parameters of a = 3.866${\AA}$, b = 3.893${\AA}$, c = 11.715${\AA}$. The chemical composition of the sample was determined by electron probe microanalysis and the chemical composition around its grain boundaries was carefully studied by the X-ray line scanning technique. From the observed binding energy of Ni-$2p_{3/2}$ orbital electron (B.E. = 853 eV) measured by X-ray photoelectron spectroscopy, the valency state of nickel stabilized in $YBa_2Cu_{2.95}Ni_{0.05}O_{7-{\delta}}$ oxide lattice could be determined to be Ni(II).

• Journal of Electrochemical Science and Technology
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• v.3 no.1
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• pp.29-34
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• 2012

The structural changes of $Li_{1-x}Ni_{0.5}Co_{0.2}Mn_{0.3}O_2$ cathode material for lithium ion battery during the first charge was investigated in comparison with $Li_{1-x}Ni_{0.8}Co_{0.15}Al_{0.05}O_2$ using a synchrotron based in situ X-ray diffraction technique. The structural changes of these two cathode materials show similar trend during first charge: an expansion along the c-axis of the unit cell with contractions along the a- and b-axis during the early stage of charge and a major contraction along the c-axis with slight expansions along the a- and b-axis near the end of charge at high voltage limit. In $Li_{1-x}Ni_{0.5}Co_{0.2}Mn_{0.3}O_2$ cathode, however, the initial unit cell volume of H2 phase is bigger than that of H1 phase since the c-axis undergo large expansion while a- and b- axis shrink slightly. The change in the unit cell volume for $Li_{1-x}Ni_{0.5}Co_{0.2}Mn_{0.3}O_2$ during charge is smaller than that of $Li_{1-x}Ni_{0.8}Co_{0.15}Al_{0.05}O_2$. This smaller change in unit cell volume may give the $Li_{1-x}Ni_{0.5}Co_{0.2}Mn_{0.3}O_2$ cathode material a better structural reversibility for a long cycling life.

• Journal of Technologic Dentistry
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• v.23 no.1
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• pp.9-19
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• 2001

Microstructure and phase transformation of Ti-Ni-Cu alloy powders produced by using attrition milling method were studied. Mixed powders of Ti-(50-X)Ni-XCu ($X=0{\sim}20$ at%) in composition range were mechanically alloyed for maximum 20 hours by using SUS 1/4" ball in argon atmosphere. Ball to powder ratio was 50: 1 and impeller speed was 350rpm. Mechanically alloyed with attrition millimg method. powder was heat treated at the temperature up to $850^{\circ}C$ for 1 hour in the $10^{-6}$ torr vacuum. Ti-Ni-Cu alloy powders have been fabricated by attrition milling method. and then phase transformation behaviours and microstructual properties of the alloy powders were investigated to assist in improving the the high damping capacity of Ti-Ni-Cu shape memory alloy powders. The results obtained are as follows: 1. After heat treating of fully mechanically alloyed powder at $850^{\circ}C$ for 1hour. most of the B2 and B 19' phases was formed and $TiNi_3$ were coexisted. 2. The B 19' martensite were formed in Ti-Ni-Cu alloy powders whose Cu-content is less than 5a/o. where as the B19 martensite in those whose Cu-content is more than 10at%. 3. The powders of as-milled Ti-Ni-Cu alloys whose Cu-contents is less than 5at% are amorphous. whereas those of as-milled Ti-Ni-Cu alloys whose Cu-content is more than 10at% are crystalline. This means that Cu addition tends to suppress amorphization of Ti-Ni alloy powders.

• Journal of Korea Foundry Society
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• v.24 no.6
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• pp.356-365
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• 2004

Mechanical properties and microstructures of the Ni-AI-Fe and Ni-AI-Fe-(B, Zr) alloys which containing $10{\sim}30at$.%Fe, 0.1at.%B and/or 0.1at.%Zr have been investigated. The experimental results showed that the microstructures of Ni25Al were changed from a single phase ${\gamma}$ to dual phase ${\gamma}$ and ${\beta}$ by addition of 27at.%Fe. Ni45Al, however, kept the single ${\beta}$ phase even though Fe was added upto 30at.%. The hardness of Ni25Al were increased from $H_RB$ 70 to $H_RC$ 39 by addition of 27at.%Fe. In the case of Ni45Al which have $H_RC$ 37, the hardness was decreased by lOat.%Fe addition, but increased with 30at.%Fe. The yield strength and ultimate compressive strength in the compressive test have showed a similar trend with the hardness change. The strain to fracture was 14% at maximum and achieved in Ni25Al-27at.%Fe and Ni25Al-27at.%Fe-0.1 at.%B alloys. The Ni45Al showed a relatively low strain to fracture as 4%. The impact absorption energy of Ni25Al increased from 0.74 kg-m to 1.81 kg-m by addition of 27at.%Fe. In case of Ni45Al, the addition of lOat.%Fe and lOat.%Fe with small amounts of Band Zr did not change significantly the impact absorption energy of 0.60 kg-m, whereas the addition of 30at.%Fe with small amounts of B and Zr increased it slightly. In fracture tests, both of two basic materials showed the same intergranular fracture but by adding Fe it changed to the cleavage fracture mode or co-existing of cleavage and intergranular fractures.

• Journal of the Korean Ceramic Society
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• v.38 no.12
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• pp.1174-1179
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• 2001

Mn-Co-Ni oxide system has been used as the NTC thermistors for normal temperature applications. Mn-Co-Ni oxide-based thermistors with various compositions were sintered at 1250$^{\circ}C$ for 3 hours and then maintained at 1000$^{\circ}C$ for 3 hours. The electrical properties of the thermistors fabricated were measured. In particular the MCN622 composition (Mn$_3$O$_4$60 wt%, Co$_3$O$_4$20 wt%, NiO 20wt%) exhibited the lowest resistivity and relatively high B constant. The MCN721 composition (Mn$_3$O$_4$70wt%, Co$_3$O$_4$20wt%, NiO 10 wt%) showed the higher resistivity than any other compositions. The aging properties of each composition showed comparatively stable characteristics within ${\pm}$2%.

• Journal of the Korean institute of surface engineering
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• v.28 no.1
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• pp.3-13
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• 1995

Electroless Ni and Cu platings were conducted on $B_4C$ and SiC. In the electroless Ni plating, the deposition rate on $B_4C$ was higher than on SiC. However, the electroless Cu deposition occured with high deposition rate regardless of the carbide substrates used in this study. Uniformity of the deposits was better in the electroless Cu deposition than in the electroless Ni deposition. In the topographies of the electroless depositions, Ni deposits have grown as colony, whereas Cu deposits have grown as fine individual grains.

• Korean Journal of Materials Research
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• v.15 no.9
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• pp.577-584
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• 2005

Thin Ni-B layer, $1{\mu}m$ thick, was electrolessly deposited on Cu electrode fabricated by electro-deposition. The purpose of the layer is to encapsulate Cu electrodes for preventing Cu oxidation and to serve as a diffusion barrier. The layers were annealed at $580^{\circ}C$ with and without pre-annealing at $300^{\circ}C$ for . 30minutes. In the layer with pre-annealing, the amount of Cu diffusion was lower about 5 times than the layer without pre-annealing. The difference in Cu concentration may be attributed to $Ni_3B$ formation prior to Cu diffusion. However, the difference in Cu concentration decreased during the annealing time of 5 h due to the grain growth of Ni.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.4
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• pp.17-23
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• 2001

The 3-D Hall sensor has two horizontal magnetic field sensing parts ($\chi$, y components) and one vertical magnetic field sensing part (z component). For conventional, 3-D Hall sensor it is general that the sensitivity for $B_{z}$ is about 1/10 compared with those for $B_\chi$ or $B_y$. Therefore, in this work, we proposed 3-D Hall sensor with new structure. We have increased the sensitivity about 6 times to form the trench using anisotropic etching. And we have increased the sensitivity for the $B_z$ by 80% compared with those of $B_\chi$ and$B_y$ using deposition of the ferromagnetic thin films on the bottom surface of the wafer to concentrate the magnetic fluxes. When the input current was 3 mA, sensitivities of the fabricated sensor with Ni/Fe film for $B_\chi, B_y$ and $B_{z}$ were measured as 120.1 mV/T, 111.7 mV/T, 95.3 mV/T, respectively. The measured linearity of the sensor was within $\pm$3% of error.

• Journal of the Korean Magnetics Society
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• v.14 no.5
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• pp.163-168
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• 2004

We prepared ultra thin film structure of Si(100)/ $SiO_2$(200 nm)/Ta(5 nm)/Ni$_{80}$Fe$_{20/(l～15 nm)}$Ta(5 nm) using an inductively coupled plasma(ICP) helicon sputter. Magnetic properties and cross-sectional microstructures were investigated with a superconduction quantum interference device(SQUID) and a transmission electron microscope(TEM), respectively. We report that NiFe films of sub-3 nm thickness show the B$_{bulk}$ = 0 and B$_{surf}$=-3 ${\times}$ 10$^{-7}$(J/$m^2$). Moreover, Curie temperature may be lowered by decreasing thickness. Coercivity become larger as temperature decreased with 0.5 nm - thick Ta/NiFe interface intermixing. Our result implies that effective magnetic properties of magnetoelastic anisotropy, saturation magnetization, and coercivity may change abruptly in nano-thick films. Thus we should consider those abrupt changes in designing nano-devices such as MRAM applications.