• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2004년도 추계학술발표대회 개요집
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• pp.231-233
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• 2004

• 한국원자력학회:학술대회논문집
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• 한국원자력학회 2002년도 춘계공동학술발표회요약집
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• pp.149-149
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• 2002

• 대한기계학회논문집B
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• 제20권4호
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• pp.1406-1415
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• 1996

Several recent studies have revealed that boiling heat transfer may be considerably enhanced in a narrow restricted region. In his study, the narrow restricted region was formed by attaching a perforated plate on top of a boiling surface. Through systematic experiments, effects of the hole size, hole pattern, gap width between the perforated plate and the boiling surface were investigated using water or R-113. Results show that perforated plates considerably enhance the boiling of water or R-113. For water, especially, they have outperformed commercial enhanced tubes, which confirms that boiling enhancement mechanism of the perforated plate (thin film evaporation beneath the elongated bubble) is very effective to the boiling of high surface tension liquids such as water. Optimum configuration was found - 3.0 mm hole diameter, 15 mm * 15 mm hole pattern, 0.3 ~ 0.5 mm gap width for water, and 2.0 mm hole diameter, 3.5 mm * 3.5 mm hole pattern, O.5 mm gap width for R-113. A correlation which correlates most of the data within .+-. 30% was also developed.

• Transactions on Electrical and Electronic Materials
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• 제12권4호
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• pp.131-134
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• 2011

Back-end-of-line using ultra low-k (ULK; k < 2.5) has been required to reduce resistive capacitance beyond 45 nmtechnologies, because micro-processing units need higher speed and density. There are two strategies to manufacture ULK inter-layer dielectric (ILD) materials using an air-gap (k = 1). The former ULK and calcinations of ILD degrade the mechanical strength and induce a high cost due to the complication of following process, such as chemical mechanical polishing and deposition of the barrier metal. In contrast, the air-gap based low-k ILD with a relatively higher density has been researched on the trench-type with activity, but it has limited application to high density devices due to its high air-gap into the next metal layer. The height of air-gap into the next metal layer was reduced by changing to the via-typed air-gap, up to about 50% compared to that of the trench-typed air-gap. The controllable ULK was easily fabricated using the via-typed air-gap. It is thought that the via-type air-gap made the better design margin like via-patterning in the area with the dense and narrow lines.

• 대한기계학회논문집A
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• 제34권1호
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• pp.79-83
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• 2010

최근 원자력발전소 배관계의 용접 시 결함 발생의 원인이 되는 용접변형과 용접잔류응력을 감소시키고 용접 효율도 증가시키기 위해 협개선 용접법이 적용되고 있다. 협개선 용접법은 기존 용접법에 비해 상대적으로 입열량이 적고 용접변형과 용접잔류응력도 감소시킬 수 있기 때문에 배관 건전성 관점에서 많은 이점이 있을 수 있다. 그러나 실제 협개선 용접부 결함에 대한 정확한 파괴역학적 분석 등을 위해서는 용접 특성을 고려하여 변형 및 용접잔류응력 특성을 정확하게 예측해야 한다. 따라서 본 논문에서는 협개선 용접부에 대한 상세 2차원 유한요소해석을 수행하여 협개선 용접부의 용접잔류응력 분포를 결정하였으며, 이를 일반적인 용접법에 대한 특성과 비교하였다. 본 논문의 결과는 향후 협개선 용접부의 결함 평가와 용접방법 개선 등을 위해 적용될 수 있다.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제50권9호
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• pp.466-470
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• 2001

We have developed a sub-micron gap fabrication technology using chemical-mechanical polishing (CMP) without /the sub-micron lithography equipments (0.18∼0.25 7m). And it has been applied to a lateral field emission device (FED), in which narrow gap distance is very important for reducing turn-on voltage. As a result, the turn-on voltage (at which the current level is 1 nA) of the fabricated device with the gap distance of 256 nm is as low as 4.0 V, which is the lowest turn-on voltage among lateral FEDs ever reported.

• 대한설비공학회:학술대회논문집
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• 대한설비공학회 2008년도 동계학술발표대회 논문집
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• pp.55-60
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• 2008

Turbulent flow characteristics on the gap of two parallel channels are investigated using LES(large eddy simulation) approach. Two parallel channels have the same cross-section area and are connected by the narrow channel named the gap. Turbulent flow near the gap makes the flow pulsation along the streamwise direction of two channels. The flow condition is the Reynolds number of $2.5{\times}10^{-5}$. We compared the predicted results with the previous experimental results and presented the axial mean velocity, turbulent intensities, Reynolds shear stresses and turbulent kinetic energy.

• 한국자기학회:학술대회 개요집
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• 한국자기학회 2002년도 동계연구발표회 논문개요집
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• pp.32-33
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• 2002

최근 세계적 주목을 받고 있는 spin FET[1] 소자의 구현은 강자성 물질에 의하여 반도체에 주입된 spin 편향된 전자가 반도체 계면에 유도된 전기장의 영향을 받아 spin-orbit interaction을 하는 mechanism(Rashbar effect)이 근간을 이루고 있다. 작은 band gap을 가지는 반도체(narrow gap 반도체)는 작은 유효질량의 전자에 의해서 이러한 Rashbar effect[2]를 크게 할 수 있는 물질로서, spin FET 구현을 위한 강력한 후보이며, 요즘 한창 연구되고 있는 주제이기도 하다[3]. (중략)

• Bulletin of the Korean Chemical Society
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• 제34권2호
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• pp.661-664
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• 2013

• 대한전기학회:학술대회논문집
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• 대한전기학회 1998년도 추계학술대회 논문집 학회본부 C
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• pp.1054-1060
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• 1998

Previous counter-current flow limitation (CCFL) and critical heat flux (CHF) studies included investigations on the inlet entrance, inclined channel and gap effects for the most part. In this study, the local CHF correlation was presented to be used in the numerical analysis for the 3 dimensional hemispherical geometry. Also, first-principle analyses were performed to determine the maximum heat removal capability from the debris through the gap that may be formed during a core melt accident. The maximum heat removal capability by gap cooling can be applied in quantitatively assessing the severe accident management measures.