• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.59-64
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• 2021

System-in-package (SIP) technology using heterogeneous integration is becoming the key of next-generation semiconductor packaging technology, and the development of low temperature Cu bonding is very important for high-performance and fine-pitch SIP interconnects. In this study the low temperature Cu bonding and the anti-oxidation effect of copper using porous Ag nanolayer were investigated. It has been found that Cu diffuses into Ag faster than Ag diffuses into Cu at the temperatures from 100℃ to 200℃, indicating that solid state diffusion bonding of copper is possible at low temperatures. Cu bonding using Ag nanolayer was carried out at 200℃, and the shear strength after bonding was measured to be 23.27 MPa.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2003.10a
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• pp.7-10
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• 2003

Blue-light-emitting peiymer/dielectric nanolayer nanocomposites were prepared by the solution intercalation method and employed in electroluminescent device. Their photoluminescence and electroluminescence characteristics suggested that the nanolayers isolate the polymer chains and hinder the formation of excimers and aggregates. By reducing the excimer formation and its deleterious effects on emission efficiency, both the color purity and the luminescence stability were improved. Furthermore, the dielectric nanolayers have an aspect ratio of about 500 and therefore act as efficient barriers to oxygen and moisture diffusion, which produced a dramatic increase in the device stability.

• Proceedings of the Korean Magnestics Society Conference
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• 2002.12a
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• pp.160-161
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• 2002

One problem in giant magnetoresistance(GMR) spin valves and magnetic tunneling junctions(MTJ) exchange biased by Mn-based antiferromagnets is the Mn diffusion into the ferromagnetic layer and other layers upon annealing.$^{1-3}$ It seems that Mn diffusion that may occur during annealing has a key role in the exchange biasing. We have fabricated multilayers inserting the nanolayer(NL) between antiferromagnet and ferromagent using ion-beam deposition system to study the diffusion effect for the exchange bias. (omitted)

• Transactions of the Korean Society of Mechanical Engineers B
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• v.37 no.10
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• pp.887-894
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• 2013

Effective thermal conductivity of nanofluids has been predicted by using generalized self-consistent model and modified Eshelby model, which have been used for analysis of material properties of composites. A nanolayer between base fluid and nanoparticle, one of key factors for abrupt enhancement of thermal conductivity of nanofluids, is included in the analysis. The effective thermal conductivities of the nanofluid predicted by the present study show good agreement with those by models in the literature for the nanolayer with a constant or linear thermal conductivity. The predicted results by the present approach have been confirmed to be consistent with experiments for representative nanofluids such as base fluids of water or ethyleneglycol and nanoparticles of $Al_2O_3$ or CuO to be validated.

• 한국전기화학회:학술대회논문집
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• 2003.10a
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• pp.37-37
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• 2003

• Macromolecular Research
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• v.16 no.3
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• pp.185-188
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• 2008

• Journal of the Microelectronics and Packaging Society
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• v.28 no.3
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• pp.9-15
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• 2021

Miniaturization of semiconductor devices has recently faced a physical limitation. To overcome this, 3D packaging in which semiconductor devices are vertically stacked has been actively developed. 3D packaging requires three unit processes of TSV, wafer grinding, and bonding, and among these, copper bonding is becoming very important for high performance and fine-pitch in 3D packaging. In this study, the effects of Ti nanolayer on the antioxidation of copper surface and low-temperature Cu bonding was investigated. The diffusion rate of Ti into Cu is faster than Cu into Ti in the temperature ranging from room temperature to 200℃, which shows that the titanium nanolayer can be effective for low-temperature copper bonding. The 12nm-thick titanium layer was uniformly deposited on the copper surface, and the surface roughness (R_q) was lowered from 4.1 nm to 3.2 nm. Cu bonding using Ti nanolayer was carried out at 200℃ for 1 hour, and then annealing at the same temperature and time. The average shear strength measured after bonding was 13.2 MPa.

• Proceedings of the Korean Magnestics Society Conference
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• 2008.12a
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• pp.172.2-172.2
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• 2008

• Corrosion Science and Technology
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• v.16 no.5
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• pp.257-264
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• 2017

Film of new Ti-15Zr-5Nb alloy formed during galvanic anodizing in orthophosphoric acid solution was characterized by optical microscope, scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), and Raman micro-spectroscopy. Its anticorrosive properties were determined by electrochemical techniques. The film had a layer with nanotube-like porosity with diameters in 500-1000 nm range. The nano layer contained significant amounts of P and O as well as alloying element. Additionally, Raman micro-spectroscopy identified oxygen as oxygen ion in $TiO_2$ anatase and phosphorous as $P_2O_7{^{4-}}$ ion in phosphotitanate compound. All potentiodynamic polarization curves in artificial Carter-Brugirard saliva with pH values (pH= 3.96, 7.84, and 9.11) depending on the addition of 0.05M NaF revealed nobler behavior of anodized alloy and higher polarization resistance indicating the film is thicker and more compact nanolayer. Lower corrosion rates of the anodized alloy reduced toxicity due to less released ions into saliva. Bigger curvature radii in Nyquist plot and higher phase angle in Bode plot for the anodized alloy ascertain a thicker, more protective, insulating nanolayer existing on the anodized alloy. Additionally, ESI results indicate anodized film consists of an inner, compact, barrier, layer and an outer, less protective, porous layer.

• Proceeding of EDISON Challenge
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• 2016.03a
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• pp.305-307
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• 2016

We calculated Li ion migration energy barrier, applying three different models on Li ion insertion into $TiO_2$ nanolayers to elucidate the previously reported high rate of charge-discharge. With the existence of additional Li ion on the surface of $TiO_2$ structure, spontaneous insertion of Li ion into the second layer from the first layer was observed. Using this result, we showed the intrinsic property of $TiO_2$ structure and it has a contribution to the reported performance. In the end, we give a suggestion on the fabrication of $TiO_2-Graphene$ hybrid structure for Li ion battery electrode.