• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.369-369
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• 2012

The present work deals with selective deposition of copper on fluoropolymers patterned silicon (111) surfaces. The pattern of fluoropolymer was fabricated by nanoimprint lithography (NIL) and plasma reactive ion etching (RIE) was used to remove the residuals layers. Copper was electrochemically deposited in bare Si regions which were not covered with fluoropolymers. The patterns of fluoropolymers and copper have been investigated by scanning electron microscopy (SEM). In this work, we used two deposition methods. One is galvanic displacement method and another is electrodeposition. Selective deposition works in both cases and it shows applicability to other materials. By optimization of the deposition conditions can be achieved therefore this process represents a simple approach for a direct high resolution patterning of silicon surfaces.

• Proceedings of the Korean Fiber Society Conference
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• 2007.11a
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• pp.31-34
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• 2007

See Full Text

• Proceedings of the KSME Conference
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• 2005.11a
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• pp.238.1-238.1
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• 2005

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1140-1144
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• 2005

A plastic-based CE (capillary electrophoresis) microchip was fabricated by hot embossing process. A Si mold was made by wet etching process and a PMMA wafer was cut off from 1mm thick PMMA sheet. A micro-channel structure on PMMA substrate was produced by hot embossing process using the Si mold and the PMMA wafer. A vacuum assisted thermal bonding procedure was employed to seal an imprinted PMMA wafer and a blank PMMA wafer. The results of microscopic cross sectional images showed dimensions of channels were well preserved during thermal bonding process. In our procedure, the deformation amount of bonding process was below 1%. The entire fabrication process may be very useful for plastic based microchip systems.

• Proceedings of the Korean Society of Rheology Conference
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• 2002.11a
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• pp.59-62
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• 2002

No Abstract, See Full Text

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.343-348
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• 2007

Molecular dynamics study of thermal NIL (Nano Imprint Lithography) process is performed to examine stamp-resist interactions. A layered structure consists of Ni stamp, poly-(methylmethacrylate) thin film resist and Si substrate was constructed for isothermal ensemble simulations. Imposing confined periodicity to the layered unit-cell, sequential movement of stamp followed by NVT simulation was implemented in accordance with the real NIL process. Both vdW and electrostatic potentials were considered in all non-bond interactions and resultant interaction energy between stamp and PMMA resist was monitored during stamping and releasing procedures. As a result, the stamp-resist interaction energy shows repulsive and adhesive characteristics in indentation and release respectively and irregular atomic concentration near the patterned layer were observed. Also, the spring back and rearrangement of PMMA molecules were analyzed in releasing process.

• 한국신재생에너지학회:학술대회논문집
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• 2009.06a
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• pp.187-187
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• 2009

나노 임프링과 전기 도금의 저렴한 방식을 이용하여 CdTe 나노 패턴형태를 제작하고자 한다. CdTe 박막은 CdTe 태양전지에서 광흡수층으로 광전자형성에 큰 영향을 미치는 층이다. 나노 패턴을 이용할 경우 p-n 접합 면적이 늘어나 여기된 전자-정공쌍이 분리를 더 잘 일으킬 수 있기 때문에 나노 임프린팅 이라는 기술을 이용하여 이를 제작해 보고자 한다. 따라서 이렇게 제작된 CdTe 나노 패턴은 XRD와 라만 기술을 이용하여 구조를 분석하고, 흡광도와 반사도를 측정하여 광 특성을 조사하려고 한다.

• Transactions of Materials Processing
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• v.14 no.7 s.79
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• pp.624-627
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• 2005

In this paper, we investigated the possibility of replicating patterned media by nano-injection molding process with a metallic nano-stamper. The original nano-master was fabricated by I-beam lithography and ICP etching process. The metallic nano-stamper was fabricated using a nanoimprint lithography and nano-electroforming process. Finally, the nano-patterned substrate was replicated using a nano-injection molding process without additional etching process. The replicated patterns using nano-injection molding process were as small as 50nm in diameter, 150nm in pitch, and 50nm in depth.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.521-522
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• 2008

An etch-less simple method was developed to fabricate two-dimensional nanostructures on glass substrate directly by using UV curable polymer resin and UV nanoimprint lithography in order to improve output coupling efficiency of OLEDs. OLEDs integrated on nanoimprinted substrates enhanced electro-luminance intensity by up to 50% compared with the conventional device.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1030-1035
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• 2003

The nanoimprint lithography technology makes higher density of semiconductor device and larger capacity of storage media. In this technology the induced damage while detaching polymer pattern from mold should be minimized. In order to analyze the problem, the basic knowledge of adhesion between the polymer and the mold is required. In this study a contact experiment of polyisobutylene specimen with spherical steel tip and polyisobutylene bead tip was conducted using nano indenter. During the contact experiment with various loading rate under load control the contact behavior of viscoelastic material was measured, i.e., the load and displacement between the tip and the specimen were measured. The data was analyzed by HBK model to obtain the stress intensity factor of contact edge and the contact radius as a function of time. Also the adhesion energies between steel/polyisobutylene and polyisobutylene/polyisobutylene were obtained employing the analysis of the crack of viscoelastic material by Schapery.