• Title/Summary/Keyword: Nanoimprint

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Induction Heating Apparatus for Rapid Heating of Flat-Type Metallic Mold in Hot Embossing (미세 패턴 성형용 판형 금형의 급속 가열을 위한 유도가열기구)

  • Hong, S.K.;Lee, S.H.;Heo, Y.M.;Kang, J.J.
    • Transactions of Materials Processing
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    • v.16 no.4 s.94
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    • pp.282-287
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    • 2007
  • Hot embossing, one of Nanoimprint Lithography(NIL) techniques, has been getting attention as an alternative candidate of next generation patterning technologies by the advantages of simplicity and low cost compared to conventional photolithographies. A typical hot embossing usually, however, takes more than ten minutes for one cycle of the process because of a long thermal cycling. Over the last few years a number of studies have been made to reduce the cycle time for hot embossing or similar patterning processes. The target of this research is to develop an induction heating apparatus for heating a metallic micro patterning mold at very high speed with the large-area uniformity of temperature distribution. It was found that a 0.5 mm-thick nickel mold can be heated from $25^{\circ}C\;to\;150^{\circ}C$ within 1.5 seconds with the temperature variation of ${\pm}5^{\circ}C$ in 4-inch diameter area, using the induction heating apparatus.

Soft Mold Deformation of Large-area UV Impring Process (대면적 UV 임프린팅 공정에서 유연 몰드의 변형)

  • Kim, Nam-Woong;Kim, Kug-Weon
    • Journal of the Semiconductor & Display Technology
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    • v.10 no.4
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    • pp.53-59
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    • 2011
  • Recently there have been considerable attentions on nanoimprint lithography (NIL) by the display device and semiconductor industry due to its potential abilities that enable cost-effective and high-throughput nanofabrication. Although one of the current major research trends of NIL is large-area patterning, the technical difficulties to keep the uniformity of the residual layer become severer as the imprinting area increases more and more. In this paper we focused on the deformation of the $2^{nd}$ generation TFT-LCD sized ($370{\times}470mm^2$) large-area soft mold in the UV imprinting process. A mold was fabricated with PDMS(Poly-dimethyl Siloxane) layered glass back plate(t0.5). Besides, the mold includes large surrounding wall type protrusions of 1.9 mm width and the via-hole(7 ${\mu}m$ diameter) patterend area. The large surrounding wall type protrusions cause the proximity effect which severely degrades the uniformity of residual layer in the via-hole patterend area. Therefore the deformation of the mold was calculated by finite element analysis to assess the effect of large surrounding wall type protrusions and the flexiblity of the mold. The deformation of soft mold was verified by the measurements qualitatively.

Pressure Distribution by Rubber Roller in Large-area UV Imprinting Lithography Process (대면적 UV 임프린팅 공정에서 고무 롤러에 의한 압력분포)

  • Kim, Nam-Woong;Kim, Kug-Weon;Lee, Woo-Young
    • Journal of the Semiconductor & Display Technology
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    • v.9 no.2
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    • pp.91-96
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    • 2010
  • In recent years there have been considerable attentions on nanoimprint lithography (NIL) by the display device and semiconductor industry due to its potential abilities that enable cost-effective and high-throughput nanofabrication. Although one of the current major research trends of NIL is large-area patterning, the technical difficulties to keep the uniformity of the residual layer become severer as the imprinting area increases more and more. In this paper we consider the roll-to-plate type imprinting process. In the process a glass mold, which is placed upon the 2nd generation TFT-LCD glass sized substrate(370${\yen}$470 mm), is rolled by a rubber roller to achieve a uniform residual layer. The pressure distribution on the glass mold by rolling of the rubber roller is crucial information to analyze mold deformation, transferred pattern quality, uniformity of residual layer and so forth. In this paper the quantitative pressure distribution induced by rolling of the rubber roller was calculated with finite element analysis under the assumption of Neo-Hookean hyperelastic constitutive relation. Additionally the numerical results were verified by the experiments.

Deformation Analysis of Roll Mold for Nano-flexible Devices

  • Khaliq, Amin;Tahir, Usama;Jeong, Myung Yung
    • Journal of the Microelectronics and Packaging Society
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    • v.28 no.4
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    • pp.47-50
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    • 2021
  • Nanoimprint lithography (NIL) has revolutionized the fabrications of electronics, photonics, optical and biological devices. Among all the NIL processes, roll-to-roll nanoimprinting is regarded best for having the attributes of low cost, continuous, simple, and energy-efficient process for nanoscale device fabrication. However, large-area printing is limited by the master mold deformation. In this study, a finite element model (FEM) has been constructed to assess the deformation of the roll mold adhesively wrapped on the carbon fiber reinforced material (CFRP) base roll. This study also optimizes the deformations in the metallic roll mold with respect to nip-forces applied in the printing process of nano-fabrication on large scale. The numerical simulations were also conducted to evaluate the deflection in roll mold assembly due to gravity. The results have shown decreasing trend of the deformation with decreasing nip-force. Also, pressure uniformity of about 40% has been optimized by using the current numerical model along with an acceptable deflection value in the vertical axis due to gravity.

Deposition and Characterization of Antistiction Layer for Nanoimprint Lithography by VSAM (Vapor Self Assembly Monolayer) (기상 자기조립박막 법을 이용한 나노임프린트용 점착방지막 형성 및 특성평가)

  • Cha, Nam-Goo;Kim, Kyu-Chae;Park, Jin-Goo;Jung, Jun-Ho;Lee, Eung-Sug;Yoon, Neung-Goo
    • Korean Journal of Materials Research
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    • v.17 no.1
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    • pp.31-36
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    • 2007
  • Nanoimprint lithography (NIL) is a new lithographic method that offers a sub-10nm feature size, high throughput, and low cost. One of the most serious problems of NIL is the stiction between mold and resist. The antistiction layer coating is very effective to prevent this stiction and ensure the successful NIL results. In this paper, an antistiction layer was deposited by VSAM (vapor self assembly monolayer) method on silicon samples with FOTS (perfluoroctyltrichlorosilane) as a precursor for making an antistiction layer. A specially designed LPCVD (low pressure chemical vapor deposition) was used for this experiment. All experiments were achieved after removing the humidity. First, the evaporation test of FOTS was performed for checking the evaporation temperature at low pressure. FOTS was evaporated at 5 Tow and $110^{\circ}C$. In order to evaluate the temperature effect on antistiction layer, chamber temperature was changed from 50 to $170^{\circ}C$ with 0.1ml of FOTS for 1 minute. Good hydrophobicity of all samples was shown at about $110^{\circ}$ of contact angle and under $20^{\circ}$ of hysteresis. The surface energies of all samples calculated by Lewis acid/base theory was shown to be about 15mN/m. The deposited thicknesses of all samples measured by ellipsometry were almost 1nm that was similar value of the calculated molecular length. The surface roughness of all samples was not changed after deposition but the friction force showed relatively high values and deviations deposited at under $110^{\circ}$. Also the white circles were founded in LFM images under $110^{\circ}$. High friction forces were guessed based on this irregular deposition. The optimized VSAM process for FOTS was achieved at $170^{\circ}C$, 5 Torr for 1 hour. The hot embossing process with 4 inch Si mold was successfully achieved after VSAM deposition.

Polymer Optical Microring Resonator Using Nanoimprint Technique (나노 임프린트 기술을 이용한 폴리머 링 광공진기)

  • Kim, Do-Hwan;Im, Jung-Gyu;Lee, Sang-Shin;Ahn, Seh-Won;Lee, Ki-Dong
    • Korean Journal of Optics and Photonics
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    • v.16 no.4
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    • pp.384-391
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    • 2005
  • A polymer optical microring resonator, which is laterally coupled to a straight bus waveguide, has been proposed and demonstrated using a nanoimprint technique. The propagation loss of the ring waveguide and the optical power coupling between the ring and bus waveguides was calculated by using a beam propagation method, then the dependence of the device performance on them was investigated using a transfer matrix method. We have especially introduced an imprint stamp incorporating a smoothing buffer layer made of a silicon nitride thin film. This layer played an efficient role in improving the sidewall roughness of the waveguide pattern engraved on the stamp and thus reducing the scattering loss. As a result the overall Q factor of the resonator was greatly increased. Also it reduced the gap between the ring and bus waveguides effectively to enhance the coupling between them, without relying on the direct writing method based on an e-beam writer. As for the achieved device performance at the wavelength of 1550 nm, the quality factor, the extinction ratio, and the free spectral range were ~103800, ~11 dB, and 1.16 m, respectively.