• Advances in nano research
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• v.7 no.4
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• pp.249-263
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• 2019

In the current paper, an exact solution method is carried out for analyzing the thermo-mechanical vibration of curved FG nano-beams subjected to uniform thermal environmental conditions, by considering porosity distribution via nonlocal strain gradient beam theory for the first time. Nonlocal strain gradient elasticity theory is adopted to consider the size effects in which the stress for not only the nonlocal stress field but also the strain gradients stress field is considered. It is perceived that during manufacturing of functionally graded materials (FGMs) porosities and micro-voids can be occurred inside the material. Material properties of curved porous FG nanobeam are assumed to be temperature-dependent and are supposed to vary through the thickness direction of beam which modeled via modified power-law rule. Since variation of pores along the thickness direction influences the mechanical and physical properties, porosity play a key role in the mechanical response of curved FG nano-structures. The governing equations and related boundary condition of curved porous FG nanobeam under temperature field are derived via the energy method based on Timoshenko beam theory. An analytical Navier solution procedure is utilized to achieve the natural frequencies of porous FG curved nanobeam supposed to thermal loading. The results for simpler states are confirmed with known data in the literature. The effects of various parameters such as nonlocality parameter, porosity volume fractions, thermal effect, gradient index, opening angle and aspect ratio on the natural frequency of curved FG porous nanobeam are successfully discussed. It is concluded that these parameters play key roles on the dynamic behavior of porous FG curved nanobeam. Presented numerical results can serve as benchmarks for future analyses of curve FG nanobeam with porosity phases.

• Steel and Composite Structures
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• v.31 no.3
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• pp.261-276
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• 2019

The study investigates the free vibration of a nano-scale sandwich beam by an extended high order approach, which has not been reported in the existing literature. First-order shear deformation theory for steel skins and so-called high-order sandwich panel theory for the core are applied. Next, the modified couple stress theory is used for both skins and cores. The Hamilton principle is utilized for deriving equations and corresponding boundary conditions. First, in the study the three-mode shapes natural frequencies for various material parameters are investigated. Also, obtained results are evaluated for two types of stiff and soft cores and isotropic, homogenous steel skins. In the research since the governing equations and also the boundary conditions are nonhomogeneous, therefore some closed-form solutions are not applicable. So, to obtain natural frequencies, the boundary conditions are converted to initial conditions called the shooting method as the numerical one. This method is one of the most robust approaches to solve complex equations and boundary conditions. Moreover, three types of simply supported on both sides of the beam (S-S), simply on one side and clamp supported on the other one (S-C) and clamped supported on both sides (C-C) are scrutinized. The parametric study is followed to evaluate the effect of nano-size scale, geometrical configurations for skins, core and material property change for cores as well. Results show that natural frequencies increase by an increase in skins thickness and core Young modulus and a decrease in beam length, core thickness as well. Furthermore, differences between obtained frequencies for soft and stiff cores increase in higher mode shapes; while, the more differences are evaluated for the stiff one.

• Design & Manufacturing
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• v.16 no.3
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• pp.58-65
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• 2022

Micro-fluidic chip has been fabricated by lithography process on silicon or glass wafer, casting using PDMS, injection molding of thermoplastics or 3D printing, etc. Among these processes, 3D printing can fabricate micro-fluidic chip directly from the design without master or template for fluidic channel fabricated previously. Due to this direct printing, 3D printing provides very fast and economical method for prototyping micro-fluidic chip comparing to conventional fabrication process such as lithography, PDMS casting or injection molding. Although 3D printing is now used more extensively due to this fast and cheap process done automatically by single printing machine, there are some issues on accuracy or surface characteristics, etc. The accuracy of the shape and size of the micro-channel is limited by the resolution of the printing and printing direction or layering direction in case of SLM type of 3D printing using UV curable resin. In this study, the printing direction and thickness of each printing layer are investigated to see the effect on the size, shape and surface of the micro-channel. A set of micro-channels with different size was designed and arrayed orthogonal. Micro-fluidic chips are 3D printed in different directions to the micro-channel, orthogonal, parallel, or skewed. The shape of the cross-section of the micro-channel and the surface of the micro-channel are photographed using optical microscopy. From a series of experiments, an optimal printing direction and process conditions are investigated for 3D printing of micro-fluidic chip.

• Composites Research
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• v.20 no.5
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• pp.49-55
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• 2007

Nanocomposite blade for dicing semiconductor wafer is investigated for micro/nano-device and micro/nano-fabrication. While metal blade has been used for dicing of silicon wafer, polymer composite blades are used for machining of quartz wafer in semiconductor and cellular phone industry in these days. Organic-inorganic material selection is important to provide the blade with machinability, electrical conductivity, strength, ductility and wear resistance. Maintaining constant thickness with micro-dimension during shaping is one of the important technologies fer machining micro/nano fabrication. In this study the fabrication of blade by wet processing of mixing conducting nano ceramic powder, abrasive powder phenol resin and polyimide has been investigated using an experimental approach in which the thickness differential as the primary design criterion. The effect of drying conduction and post pressure are investigated. As a result wet processing techniques reveal that reliable results are achievable with improved dimension tolerance.

• Korean Journal of Metals and Materials
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• v.49 no.10
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• pp.818-822
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• 2011

ZnO nanorods were grown on Au-coated Si substrates by vapor phase transport (VPT) at the growth temperature of $600^{\circ}C$ using a mixture of zinc oxide and graphite powders as source material. Au thin films with the thickness of 5 nm were deposited by ion sputtering. Temperature-dependent photoluminescence (PL) was carried out to investigate the optical properties of the ZnO nanorods. Five peaks at 3.363, 3.327, 3.296, 3.228, and 3.143 eV, corresponding to the free exciton (FX), neutral donor bound exciton ($D^{\circ}X$), first order longitudinal optical phonon replica of free exciton (FX-1LO), FX-2LO, and FX-3LO emissions, were obtained at low-temperature (10 K). The intensity of these peaks decreased and their position was red shifted with the increase in the temperature. The FX emission peak energy of the ZnO nanorods exhibited an anomalous behavior (red-blue-red shift) with the increase in temperature. This is also known as an "S-shaped" emission shift. The thermal activation energy for the exciton with increasing temperature in the ZnO nanorods is found to be about 26.6 meV; the values of Varshni's empirical equation fitting parameters are = $5{\times}10^{-4}eV/K$, ${\beta}=350K$, and $E_g(0)=3.364eV$.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.270-270
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• 2016

We fabricated an organic-inorganic nano laminated encapsulation layer using molecular layer deposition (MLD) combined with atomic layer deposition (ALD). The $Al_2O_3$ inorganic layers as an effective single encapsulation layer were deposited at 80 degree C using ALD with alternating surface-saturation reactions of TMA and $H_2O$. A self-assembled organic layers (SAOLs) were fabricated at the same temperature using MLD. MLD and ALD deposition process were performed in the same reaction chamber. The prepared SAOL-$Al_2O_3$ organic-inorganic nano laminate films exhibited good mechanical stability and excellent encapsulation property. The measurement of water vapor transmission rate (WVTR) was performed with Ca test. We controlled thickness-ratio of organic and inorganic layer, and specific ratio showed a lowest WVTR value. Also this encapsulation layer contained very few pin-holes or defects which were linked in whole area by defect test. To apply into real OLEDs panels, we controlled a film stress from tensile to compressive and flexibility defined as an elastic modulus with organic-inorganic ratio. It has shown that OLEDs panel encapsulated with nano laminate layer exhibits better properties than single layer encapsulated in acceleration conditions. These results indicate that the organic-inorganic nano laminate thin films have high potential for flexible display applications.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.11a
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• pp.71-71
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• 2003

Hot embossing has been widely accepted as an alternative to photolithography in generating patterns on polymeric substrates. The optimization of embossing process should be accomplished based on polymer substrate materials. In this paper, the effect of polymer substrates on nano scale hot embossing process was studied. Silicon molds with nano size patterns were fabricated by e-beam direct writing. Molds were coated with self-assembled monolayer (SAM) of (1, 1, 2.2H -perfluorooctyl)-trichlorosilane to reduce the stiction between mold and substrates. For an embossing, pressure of 55, 75 bur, embossing time of 5 min and temperature of above transition temperature were peformed. Polymethylmethacrylates (PMMA) with different molecular weights of 450,000 and 950,000, MR-I 8010 polymer (Micro Resist Technology) and polyaliphatic imide copolymer were applied for hot embossing process development in nano size. These polymers were spun coated on the Si wafer with the thickness between 150 and 200 nm. The nano size patterns obtained after hot embossing were observed and compared based on the polymer properties by scanning electron microscopy (SEM). The imprinting uniformity dependent on the Pattern density and size was investigated. Four polymers have been evaluated for the nanoimprint By optimizing the process parameters, the four polymers lead to uniform imprint and good pattern profiles. A reduction in the friction for smooth surfaces during demoulding is possible by polymer selection.

• Journal of Powder Materials
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• v.13 no.3 s.56
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• pp.187-191
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• 2006

Al-Cu alloy nano powders were produced by the electrical explosion of Cu-plated Al wires. The composition and phase of the alloy could be controlled by varying the thickness of Cu deposit on Al wire. When the Cu layer was thin, Al solid solution and $CuAl_2$ were the major phases. As the Cu layer becomes thicker, Al diminished while $Al_4Cu_9$ phase prevailed instead. The average particle size of Al-Cu nano powders became slightly smaller from 63 nm to 44 nm as Cu layer becomes thicker. The oxygen content of Al-Cu powder decreased linearly with Cu content. It is well demonstrated that the electrodeposition combined with wire explosion could be simple and economical means to prepare variety of alloy and intermetallic nano powders.

• Journal of Electrochemical Science and Technology
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• v.8 no.3
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• pp.215-221
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• 2017

The electroless plating process largely consists of substrate cleaning, seed formation (activator formation), and electroless plating. The most widely used activator in the seed formation step is Pd, and Sn ions are used to facilitate the formation of this Pd seed layer. This is problematic because the Sn ions interfere with the reduction of Cu ions during electroless plating; thus, the Sn ions must be removed by a hydrochloric acid cleaning process. This method is also expensive due to the use of Pd. In this study, Cu electroless plating was performed by forming a seed layer using a silver nanosol instead of Pd and Sn. The effects of the Ag nanosol concentration in the pretreatment solution and the pretreatment time on the thickness and surface morphology of the Cu layer were investigated. The degrees of adhesion to the substrate were similar for the electroless-plated Cu layers formed by conventional Pd activation and those formed by the Ag nanosol.

• Advances in nano research
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• v.9 no.4
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• pp.237-250
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• 2020

An accurate plate theory for assessing sandwich structures is of interest in order to provide precise results. Hence, this paper develops Layer-Wise (LW) theory for reaching precise results in terms of buckling and vibration behavior of Functionally Graded Carbon Nanotube-Reinforced Composite (FG-CNTRC) annular nanoplates. Furthermore, for simulating the structure much more realistic, its edges are elastically restrained against in-plane and transverse displacement. The nano structure is integrated with piezoelectric layers. Four distributions of Single-Walled Carbon Nanotubes (SWCNTs) along the thickness direction of the core layer are investigated. The Differential Quadrature Method (DQM) is utilized to solve the motion equations of nano structure subjected to the electric field. The influence of various parameters is depicted on both critical buckling load and frequency of the structure. The accuracy of solution procedure is demonstrated by comparing results with classical edge conditions. The results ascertain that the effects of different distributions of CNTs and their volume fraction are significant on the behavior of the system. Furthermore, the amount of in-plane and transverse spring coefficients plays an important role in the buckling and vibration behavior of the nano-structure and optimization of nano-structure design.