• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.155.2-155.2
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• 2014

Plasma Enhanced Atomic Layer Deposition(PEALD)와 Atomic Layer Deposition(ALD) Techniques는 '정확한 두께 조절' 및 '우수한 균일도'를 가지는 신뢰할 수 있는 진공 기술이다. 본 연구에서는 다공성 구조를 가지는 기판을 대상으로 PEALD와 ALD Techniques을 이용한 $Al_2O_3$ 형성 공정의 증착 특성을 비교하였다. 각 공정은 공통적으로 Tris-Methyl-Aluminium(TMA)을 첫번째 전구체로 사용하였고 purge gas로는 Nitrogen를 사용하였다. 그리고 두번째 전구체로 PEALD 공정에서는 Oxygen Plasma를 사용하였고 ALD 공정에서는 Water를 사용하였다. 복잡한 다공성 구조를 가지는 기판은 $TiO_2$ Nano-Particle paste과 colloidal Silver paste를 소결시켜 제작하여 사용하였다. 각 공정의 차이점을 비교하기 위해서 배기단에 Capacitor Diaphram Gauge(CDG)와 Residual Gas Analyzer(RGA)를 통해서 압력과 잔류 가스를 모니터하였다. 그리고 각 공정을 통해서 porous한 Nano-Particles Network에 형성된 $Al_2O_3$막의 특성을 비교하기 위해서 FE-SEM과 EDX를 통해서 관찰하였다. 또한 좀 더 자세한 비교 분석을 위해서 $Al_2O_3$ 막이 형성된 porous한 Nano-Particles Networks의 각 각의 particles들을 분산시켜 TEM과 AFM를 통해서 관찰하였다. 나아가 전기적 물성의 차이점을 비교하기 위해서 IV 및 CV를 측정하였다. 위의 일련의 비교 실험을 통해서 'PEALD과 ALD을 이용한 다공성 기판의 증착 특성'에 대하여 고찰하였다.

• Journal of the Korean institute of surface engineering
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• v.41 no.6
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• pp.308-311
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• 2008

Oxide layers were prepared on Al2021 alloys substrate under a hybrid voltage of AC 200 V (60 Hz) combined with DC 260 V value at room temperature within $5{\sim}60\;min$ by plasma electrolytic oxidation (PEO). An optimized aluminate-fluorosilicate solution was used as the electrolytes. The surface morphology, thickness and composition of layers on Al2021 alloys at different reaction times were studied. The results showed that it is possible to generate oxide layers of good properties on Al2021 alloys in aluminate-fluorosilicate electrolytes. Analysis show that the double-layer structure oxide layers consist of different states such as ${\alpha}-{Al_2}{O_3}$ and ${\gamma}-{Al_2}{O_3}$. For short treatment times, the formation process of oxide layers follows a linear kinetics, while for longer times the formation process slows down and becomes a steady stage. During the PEO processes, the average size of the discharge channels increased gradually as the PEO treatment time increased.

• Journal of Powder Materials
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• v.19 no.1
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• pp.6-12
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• 2012

Electricity is generated by the combined reactions of hydrogen oxidation and oxygen reduction which occur on the Pt/C catalyst surface. There have been lots of researches to make high performance catalysts which can reduce Pt utilization. However, most of catalysts are synthesized by wet-processes and a significant amount of chemicals are emitted during Pt/C synthesis. In this study, Pt/C catalyst was produced by arc plasma deposition process in which Pt nano-particles are directly deposited on carbon black surfaces. During the process, islands of Pt nano-particles were produced and they were very fine and well-distributed on carbon black surface. Compared with a commercialized Pt/C catalyst (Johnson & Matthey), finer particle size, narrower size distribution, and uniform distribution of APD Pt/C resulted in higher electrochemical active surface area even at the less Pt content.

• Journal of Welding and Joining
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• v.27 no.6
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• pp.43-48
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• 2009

In this study, Cu-based bulk metallic glass (BMG) coatings were deposited by atmospheric plasma spraying (APS) process with different process conditions (with- and without hydrogen gas). As adding the hydrogen gas, thermal energy in the plasma flame increased and induced difference in the melting state of the Cu-based BMG particles. The microstructure and mechanical properties of the coatings were analyzed using a scanning electron microscope (SEM) with an energy dispersive spectroscopy (EDS) and nano-indentation tester in the light of phase analysis. It was elucidated by the nano-indentation tests that un-melted region was a mainly amorphous phase which showed discrete plasticity observed as the flow serrations on the load.displacement (P - h) curves, and the curves of solidified region showed lower flow serrations as amorphous phase mingled with crystalline phase. Oxides produced during the spraying process had the highest hardness value among the phases and were well mixed with other phases resulted from the increase in melting degree.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.164-165
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• 2005

The dry etch characteristics of GaAs over both AlGaAs and InGaP in planar inductively coupled $BCl_3$-based plasmas(ICP) with additions of $SF_6$ or $CF_4$ were studied. The additions of flourine gases provided enhanced etch selectivities of GaAs/AlGaAs and GaAs/InGaP. The etch stop reaction involving formation of involatile $AlF_3$ and $InF_3$ (boiling points of etch products: $AlF_3\sim1300^{\circ}C$, $InF_3$ > $1200^{\circ}C$ at atmosphere) were found to be effective under high density inductively coupled plasma condition. Decrease of etch rates of all materials was probably due to strong increase of flourine atoms in the discharge, which blocked the surface of the material against chlorine neutral adsorption. The process parameters were ICP source power (0 - 500 W), RF chuck power (0 - 30 W) and variable gas composition. The process results were characterized in terms of etch rate, selectivities of GaAs over AlGaAs and InGaP, surface morphology, surface roughness and residues after etching.

• Journal of the Korean Vacuum Society
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• v.18 no.4
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• pp.288-295
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• 2009

We report the etch characteristics of GaAs and AlGaAs in the diffusion pump-based capacitively coupled $BCl_3$ plasma. Process variables were chamber pressure ($50{\sim}180$ mTorr), CCP power ($50{\sim}200\;W$) and $BCl_3$ gas flow rate ($2.5{\sim}10$ sccm). Surface profilometry was used for etch rate and surface roughness measurement after etching. Scanning electron microscopy was used to analyze the etched sidewall and surface morphology. Optical emission spectroscopy was used in order to characterize the emission peaks of the $BCl_3$ plasma during etching. We have achieved $0.25{\mu}m$/min of GaAs etch rate with only 5 sccm $BCl_3$ flow rate when the chamber pressure was in the range of 50{\sim}130 mTorr. The etch rates of AlGaAs were a little lower than those of GaAs at the conditions. However, the etch rates of GaAs and AlGaAs decreased significantly when the chamber pressure increased to 180 mTorr. GaAs and AlGaAs were not etched with 50 W CCP power. With $100{\sim}200\;W$ CCP power, etch rates of the materials increased over $0.3{\mu}m$/min. It was found that the etch rates of GaAs and AlGaAs were not always proportional to the increase of CCP power. We also found the interesting result that AlGaAs did not etched at 2.5 sccm $BCl_3$ flow rate at 75 mTorr and 100 W CCP power even though it was etched fast like GaAs with more $BCl_3$ gas flow rates. By contrast, GaAs was etched at ${{\sim}}0.3{\mu}m$/min at the 2.5 sccm $BCl_3$ flow rate condition. A broad molecular peak was noticed in the range of $500{\sim}700\;mm$ wavelength during the $BCl_3$ plasma etching. SEM photos showed that 10 sccm $BCl_3$ plama produced more undercutting on GaAs sidewall than 5 sccm $BCl_3$ plasma.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.354.2-354.2
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• 2014

최근 반도체 산업의 발전에 따라 반도체 소자 내 배선재료로 사용되던 Aluminium (Al)의 대체물로 Copper (Cu)가 사용되고 있다. Cu는 Al보다 우수한 전도성과 비용이 저렴하다는 장점이 있으나 반도체 기판과의 확산으로 이를 해결해야만 하는 문제점이 있다. 이는 Si와 Cu사이에 확산방지막을 사용하여 해결할 수 있는데 Hafnium Nitride (HfN) 박막은 다른 물질과 비교해 고온에서의 안정성과 낮은 비저항을 가지고 있어 주목을 받고 있다. 본 연구에서는 rf magnetron sputter 방법으로 박막 증착 시에 인가하는 rf power가 박막의 표면 특성에 어떠한 영향을 미치는지 nano-indenter를 사용해 surface hardness와 elastic modulus의 변화를 중심으로 알아보았다. 시료는 rf magnetron sputter로 증착 시 인가하는 plasma power를 60W와 80W로 달리하여 증착하였다. 증착가스는 Ar과 $N_2$를 조절하여 사용하였고 총 유량을 40 sccm 으로 고정하였으며, 이 때 압력은 3mTorr로 유지하였다. 실험결과 plasma power를 80W로 인가하여 증착한 시료의 surface hardness (18.48 GPa)가 60W로 증착한 시료의 surface hardness (12.03 GPa)보다 큰 값을 나타내었다. 이와 마찬가지로 80W로 증착한 시료의 elastic modulus(187.16 GPa)도 60W로 증착한 시료의 탄성계수 (141.15 GPa)보다 큰 값을 나타내었다. 이는 증착 시 인가하는 plasma power의 크기가 증가하면 박막표면에 compressive stress가 생성되어 박막의 surface hardness와 elastic modulus가 상대적으로 높게 측정되는 것으로 생각된다.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2001.11a
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• pp.35-42
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• 2001

Nanotribological characteristics between a Si$_3$N$_4$ AFM tip and hydrophobic thin films were experimentally studied. Tests were performed to measure the nano adhesion and friction in both AFM(atomic force microscope) and LFM(lateral force microscope) modes in various ranges of normal load. Plasma-modified thin polymeric films were deposited on Si-wafer (100). Results showed that wetting angle of plasma-modified thin polymeric film increased with the treating time, which resulted in the hydrophobic surface and the decrease of adhesion and friction. Nanotribological characteristics of these surfaces were compared with those of other hydrophobic surfaces, such as DLC, OTS and IBAD-Ag coated surfaces. Those of OTS coated surface was superior to those of others, though wetting angle of plasma-modified thin polymeric film is higher.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08b
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• pp.1646-1649
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• 2007

RF plasma and aerosol nano process were developedfor a volume production of nanoscale phosphors. R, G, and B PDP phosphors were synthesized and the characteristics were optimized through the proprietary power treatments. PL intensities were confirmed to be enhanced up to 70% of that of present commercial phosphors.

• Journal of Advanced Marine Engineering and Technology
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• v.37 no.2
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• pp.144-148
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• 2013

In this paper, the ultra water-repellent thin films were prepared by RF PECVD. On the basis of surface morphology, chemical bonding states and plasma diagnostics, a formation model of clusters for the ultra water-repellent films was discussed from considerations of formation process and laser scattering results. Moreover, using laser scattering method, the relative change of quantity of nano-clusters or size of agglomerates could be confirmed. From the results, the films were deposited with nano-clusters and those of agglomerates, which formed in organosilicon plasma, and formation of agglomerates were depended on the deposition time.