• Journal of the Korea Organic Resources Recycling Association
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• v.32 no.3
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• pp.57-66
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• 2024

In this study, silicon sludge from a semiconductor packaging process is recycled to fabricate silica coated silicon-sludge and applied as a filler for an epoxy molding compound(EMC). Silicon-sludge powder(S-sludge) is treated with acid to remove metallic impurities and then coated using the sol-gel method to synthesize silica coated silicon-sludge powder(SS-sludge). The as-synthesized SS-sludge is subsequently mixed with epoxy resin, a curing agent, and carbon black to create an EMC(SS-sludge EMC). The heat dissipation properties of the EMC were examined using an IR camera. IR camera analysis confirmed that the SS-sludge EMC exhibited the highest surface temperature of 58.5℃ compared to SiO₂-based EMC. This enhancement in heat dissipation using SS-sludge EMC is attributed to the excellent thermal conductivity(150W/mK) of the silicon substrate and the presence of the silica layer on the SS-sludge surface which effectively enhances the thermal property of the EMC. Therefore, this study successfully demonstrates the recycling of silicon sludge from a semiconductor packaging process by synthesizing silica coated silicon-sludge and suggests a novel application of this material in semiconductor packaging.

• Korean Chemical Engineering Research
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• v.59 no.4
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• pp.487-492
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• 2021

In this study, the electrochemical properties of pitch coated silicon sheets/graphite anode materials were investigated. Using NaCl as a template, silicon sheets were prepared through the stöber method and the magnesiothermic reduction methode. In order to synthesize the anode composite, the silicon sheets and graphite were combined with SDBS. The pitch coated silicon sheets/graphite was synthesized using THF as a solvent for the anode material composite. The physical properties of the prepared anode composites were analysed by XRD, SEM, EDS and TGA. The electrochemical performances of the prepared anode composites were performed by the current charge/discharge, rate performance, cyclic voltammetry and EIS tests in the electrolyte LiPF₆ dissolved solvents (EC:DMC:EMC=1:1:1 vol%). As the silicon composition of silicon sheets/graphite composite material increased, the discharge capacity also increased, but the cycle stability tended to decrease. The anode material of pitch coated silicon sheets/graphite composite (silicon sheets:graphite=3:7 weight ratio) showed the initial discharge capacity of 1228.8 mAh/g and the capacity retention ratio of 77% after 50 cycles. From these results, it was found that the cycle stability of pitch coated silicon sheets/graphite was improved.

• Steel and Composite Structures
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• v.36 no.6
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• pp.631-642
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• 2020

This paper studies nonlinear stability behavior of a nanocrystalline silicon curved nanoshell considering strain gradient size-dependency. Nanocrystallines are composite materials with an interface phase and randomly distributed nano-size grains and pores. Imperfectness of the curved nanoshell has been defined based on an initial deflection. The formulation of nanocrystalline nanoshell has been established by thin shell theory and an analytical approach has been used in order to solve the buckling problem. For accurately describing the size effects related to nano-grains or nano-pores, their surface energies have been included. Nonlinear stability curves of the nanoshell are affected by the size of nano-grain, curvature radius and nano-pore volume fraction. It is found that increasing the nano-pore volume fraction results in lower buckling loads.

• Journal of Surface Science and Engineering
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• v.41 no.6
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• pp.331-334
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• 2008

The replica of highly ordered nano-sphere array patterns were fabricated using hot embossing method. First, silica nano-sphere array on Si substrate was transferred to PVC film at $130^{\circ}C$ and 7 bar using hot embossing process. Then, silica nano-sphere array on PVC template was removed by soaking the PVC film in buffered oxide etcher. In order to form anti-stiction layer, the PVC template was coated with silicon dioxide layer and self-assembled monolayer. Through UV nanoimprint lithography with the fabricated flexible PVC template, highly ordered nano-sphere array pattern was imprinted on curved substrates with high fidelity.

• Proceedings of the KWS Conference
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• 2005.11a
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• pp.168-170
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• 2005

Nickel base brazes containing boron and silicon as melting point depressants are used extensively in the joining and repair of hot-section components in next generation nuclear reactor and aero-engine. Therefore, the present study has investigated the preliminary applicability of nickel based alloying nano powders. Nano Ni-based alloying powders synthesized by Pulsed Wire Evaporation (PWE) method. It's powder morphology and phase transformation temperature were analyzed by scanning electron microscopy, transmission electron microscopy, and differential scanning calorimeter(DSC). The powder particle size was approximately 10${\sim}$100nm and exhibits a quite even equiaxed shape. The results of DSC measurement show that both the nano Inconel 625 nano powder and Inconel 718 nano powder presents similar liquidus temperatures approximately $1373^{\circ}C$ and $1380^{\circ}C$ respectively.

• KSTLE International Journal
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• v.6 no.1
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• pp.13-16
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• 2005

Friction characteristics at nano-scale of self-assembled monolayers (SAMs) having different chain lengths and end groups were experimentally studied.51 order to understand the effect of the chain length and end group on the nano-scalefriction: (1) two different SAMs of shorter chain lengths with different end groups such as methyl and phenyl groups, and (2)four different kinds of SAMs having long chain lengths (C10) with end groups of fluorine and hydrogen were coated on siliconwafer (100) by dipping method and Chemical Vapour Deposition (CVD) technique. Their nano-scale friction was measuredusing an Atomic Force Microscopy (AFM) in the range of 0-40 nN normal loads. Measurements were conducted at the scanning speed of 2 $mu$m/s for the scan size of 1$mu$m x 1 $mu$m using a contact mode type $Si_3N_4$ tip (NPS 20) that had a nominal spring constant0.58 N/m. All experiments were conducted at anlbient temperature (24 $pm$1$circ$C) and relative humidity (45 $pm$ 5%). Results showedthat the friction force increased with applied normal load for all samples, and that the silicon wafer exhibited highest frictionwhen compared to SAMs. While friction was affected by the inherent adhesion in silicon wafer, it was influenced by the chainlength and end group in the SAMs. It was observed that the nano-friction decreased with the chain length in SAMs. In the caseof monolayers with shorter length, the one with the phenyl group exhibited higher friction owing to the presence of benBenerings that are stiffer in nature. In the case of SAMs with longer chain length, those with fluorine showed friction values relativelyhigher than those of hydrogen. The increase in friction due to the presence of fluorine group has been discussed with respect tothe siBe of the fluorine atom.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.487-487
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• 2013

According to shrinkage of transistor, interface traps have been recognized as a major factor which limits the process development in manufacturing industry. The traps occur through spontaneous generation process, and spread into the forbidden band. There is a large change of current though a few traps are existed at the Si-SiO2 interface. Moreover, the increased temperature largely affects to the leakage current due to the interface trap. For this reason, we made an effort to find out the relationship between temperature and interface trap. The subthreshold swing (SS) was investigated to confirm the correlation. The simulated results show that the sphere of influence of trap is enlarged according to increase in temperature. To investigate the relationship between thermal energy and surface potential, we extracted the average surface potential and thermal energy (kT) according to the temperature. Despite an error rate of 6.5%, change rates of both thermal energy and average surface potential resemble each other in many ways. This allows that SS is affected by the trap within the range of the thermal energy from the surface energy.

• Current Photovoltaic Research
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• v.6 no.1
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• pp.1-11
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• 2018

Current major photovoltaic (PV) market share (> 60%) is being occupied by the multicrystalline (mc)-silicon solar cells despite of low efficiency compared to single crystalline silicon solar cells. The diamond wire sawing technology reduces the production cost of crystalline silicon solar cells, it increases the optical loss for the existing mc-silicon solar cells and hence its efficiency is low in the current mass production line. To overcome the optical loss in the mc-crystalline silicon, caused by the diamond wire sawing, next generation texturing process is being investigated by various research groups for the PV industry. In this review, the limitation of surface structure and optical loss due to the reflectivity of conventional mc-silicon solar cells are explained by the typical texturing mechanism. Various texturing technologies that could minimize the optical loss of mc-silicon solar cells are explained. Finally, next generation texturing technology to survive in the fierce cost competition of photovoltaic market is discussed.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.10a
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• pp.162-165
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• 2007

AAO(Anodic Aluminum Oxidation) method has been known that it is practically useful for the fabrication of nano-structures and makes it possible to fabricate the highly ordered nano masters on large surface and even on the 2.5 or 3D surface at low cost comparing to the expensive e-beam lithography or the conventional silicon processing. In this study, by using the multi-step anodizing and etching processes, highly ordered nano patterned master with concave shapes was fabricated. By varying the processing parameters, such as initial matter and chemical conditions; electrical and thermal conditions; time scheduling; and so on, the size and the pitch of the nano pattern can be controlled. Consequently, various alumina/aluminum nano structures can be easily available in any size and shape by optimized anodic oxidation in various aqueous acids. In order to replicate nano patterned master, the resulting good filled uniform nano molded structure through electro-forming process shows the validity of the fabricated nano pattern masters.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.698-701
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• 2005

We have investigated experimentally a nano patterning using electron beam lithography for the nickel stamper fabrication. Recently, DVD and Blu-ray disk(BD) have nano-scale patterns in order to increase the storage density. Specially, BD has 100nm-scale patterns which are generally fabricated by electron beam lithography. In this paper, we found optimum condition of electron-beam lithography for 100nm-scale patterning. We controlled various conditions of EHP(acceleration voltage), beam current, dose and aperture size in order to obtain optimum conditions. We used 100nm-thick PMMA layer on a silicon wafer as photoresist. We found that EHP was the most dominant factor in electron-beam lithography.