• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.1
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• pp.35-40
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• 2007

The new PEI(poly(epoxy-imide))-nano Silica film has been synthesized via in situ CS sol process, and the chemical bonding and microstructure of nano silica dispersed in resin were examined by FT-IR, TAG and SEM. The dielectric properties of these hybrid films over a given temperature and frequency ranges have been studied in a point of view of stable chemical bonding of nano Silica filler. The results from IR spectra and SEM photograph indicated that PEI-Silica hybrid film prepared with nano CS sol process has been synthesized in uniform and chemical bonding. The decrease property of dielectric constant with CS content, tangent loss consistent of given frequency and temperature has been explained in terms of the chain movement of polymer through chemical bonging and size effect of nano silica. The new PEI-CS sol hybrid film with such stable chemical and dielectric properties was expected to be used as a high functional coating application in ET, IT and electric power products.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.220-223
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• 2005

The rapid prototyping (RP) technology has been advanced for various applications such as verification of design, functional test. However, many RP machines still have low accuracy and limitation of applications for various materials. In this research, a hybrid RP system was developed to improve precision of micro parts. This hybrid system consists of deposition and material removal process by mechanical micro machining to fabricate nano composites using photo-curable polymer resin with various nano particles. In this work, using hybrid RP process with Multi-Walled Carbon Nano Tube (MWCNT) and hydroxyapatite, micro parts were fabricated. The precision of parts was evaluated based on the original CAD design, and to see the effect of nano particles on mechanical properties, tensile strength was measured. From the results of experiments, it was confirmed that the part made by hybrid process had higher precision, and the addition of nano particles improved mechanical properties.

• Journal of the Korean Society for Precision Engineering
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• v.32 no.1
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• pp.63-68
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• 2015

Micro/nano patterns for optical concentration and diffusion have been studied in the various fields such as displays, optics, and sensors. Conventional micro patterns were continuous and linear shapes due to using linear-type light sources, however, recently non-continuous patterns have been applied as point sources are used for dot-type light sources such as LEDs and OLEDs. In this study, a hybrid machining technology combining an indentation machining method and an AAO process was developed for manufacturing the non-continuous micro patterns having nano patterns. First, mirror-like surfaces ($R_a<20nm$) of pure Aluminum substrates were obtained by optimizing cutting conditions. Then, The letter of 'K' consisting of the arrays of the micro patterns was manufactured by the indentation machining method which has a similar principle to indentation hardness testing. Finally, nano patterns were machined by AAO process on the micro patterns. Conclusively, a specific letter having nano-micro hybrid patterns was manufactured in this study.

• Proceedings of the Korean Magnestics Society Conference
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• 2010.06a
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• pp.70-71
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• 2010

In this study, We fabricated FePt-based perpendicular patterned media using a selective combination of E-beam lithography and either Ar plasma etching (deposition-first process) or FePt lift-off (deposition-last process). We employed the deposition-last process to avoid chemical and structural disordering by impinging Ar ions (deposition-first process). For a patterned medium with 100 nm patterns made by this process, the out-of-plane coercivity was measured to be 5 fold larger than its in-plane value. The deposition-last process may be a promising way to achieve ultra-high density patterned media.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.6
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• pp.160-166
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• 2004

In this study, a new algorithm, named as Contour Offset Algorithm(COA) is developed to fabricate precise features or patterns in the range of several micrometers by nano replication printing(nRP) process. In the nRP process, a femto-second laser is scanned on a photosensitive monomer resin in order to induce polymerization of the liquid monomer according to a voxel matrix which is transformed from the bitmap format file. After polymerization, a droplet of ethanol is dropped to remove the unnecessary remaining liquid resin and then only the polymerized figures with nano-scaled precision are remaining on the glass plate. To obtain more precise replicated features, the contour lines in voxel matrix should be modified considering a voxel size. In this study, the efficiency of the proposed method is shown through two examples in view of accuracy.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.30 no.10 s.253
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• pp.1314-1319
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• 2006

This paper describes the novel fabrication method of the high-aspect-ratio nano structure which is impossible by conventional method using a shadow mask and a Deep X-ray Lithography (DXRL). The shadow mask with $1{\mu}m-sized$ apertures is fabricated on the silicon membrane using a conventional UV-lithography. The size of aperture is reduced to 200nm by accumulated low stress silicon nitride using a LPCVD (low pressure chemical vapor deposition) process. The X-ray mask is fabricated by depositing absorber layer (Au, $3{\mu}m$) on the back side of nano shadow mask. The thickness of an absorber layer must deposit dozens micrometers to obtain contrast more than 100 for a conventional DXRL process. The thickness of $3{\mu}m-absorber$ layer can get sufficient contrast using a central beam stop method, blocking high energy X-rays. The nano circle and nano line, 200nm in diameter in width, respectively, were demonstrated 700nm in height with a negative photoresist of SU-8.

• Korean Journal of Materials Research
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• v.12 no.1
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• pp.89-93
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• 2002

To investigate the effect of properties of pores in anodic alumina template(AAT) on the formation and characteristics of metal nano wires, Cu and Ni nano wires were manufactured using anodic alumina template formed in various electrolytes. The characteristics of prepared metal nano wires using AAT could be replicated from those of pores in AAT. The diameters of nano wires could be controlled by the widening process of anodic porous film in $H_3PO_4$ solution. The shape ratio of the nano wire was shown to be $170{\pm}30$ for Ni nano wire formed by AAT made in sulfuric acid.

• Korean Journal of Materials Research
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• v.19 no.4
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• pp.224-227
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• 2009

Nanofabrication is an essential process throughout industry. Technologies that produce general nanofabrication, such as e-beam lithography, dip-pen lithography, DUV lithography, immersion lithography, and laser interference lithography, have drawbacks including complicated processes, low throughput, and high costs, whereas nano-transfer printing (nTP) is inexpensive, simple, and can produce patterns on non-plane substrates and multilayer structures. In general nTP, the coherency of gold-deposited stamps is strengthened by using SAM treatment on substrates, so the gold patterns are transferred from stamps to substrates. However, it is hard to apply to transfer other metallic materials, and the existing nTP process requires a complicated surface treatment. Therefore, it is necessary to simplify the nTP technology to obtain an easy and simple method for fabricating metal patterns. In this paper, asnTP process with poly vinyl alcohol (PVA) mold was proposed without any chemical treatment. At first, a PVA mold was duplicated from the master mold. Then, a Mo layer, with a thickness of 20 nm, was deposited on the PVA mold. The Mo deposited PVA mold was put on the Si wafer substrate, and nTP process progressed. After the nTP process, the PVA mold was removed using DI water, and transferred Mo nano patterns were characterized by a Scanning electron micrograph (SEM) and Energy Dispersive spectroscopy (EDS).

• Journal of the Korean institute of surface engineering
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• v.40 no.4
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• pp.170-174
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• 2007

High Velocity Oxygen Fuel (HVOF) thermal spray coating of nano size WC-Co powder (nWC-Co) has been studied as one of the most promising candidate for the possible replacement of the traditional hard plating in some area which causes environmental and health problems. nWC-Co powder was coated on Inconel 718 substrates by HVOF technique. The optimal coating process obtained from the best surface properties such as hardness and porosity is the process of oxygen flow rate (FR) 38 FMR, hydrogen FR 57 FMR and feed rate 35 g/min at spray distance 6 inch for both surface temperature $25^{\circ}C\;and\;500^{\circ}C$. In coating process a small portion of hard WC decomposes to less hard $W_2C$, W and C at the temperature higher than its decomposition temperature $1,250^{\circ}C$ resulting in hardness decrease and porosity increase. Friction coefficient increases with increasing coating surface temperature from 0.55-0.64 at $25^{\circ}C$ to 0.65-0.76 at $500^{\circ}C$ due to the increase of adhesion between coating and counter sliding surface. Hardness of nWC-Co is higher or comparable to those of other hard coatings, such as $Al_2O_3,\;Cr,\;Cr_2O_3$ and HVOF Tribaloy 400 (T400). This shows that nWC-Co is recommendable for durability improvement coating on machine components such as high speed spindle.

• Journal of Sensor Science and Technology
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• v.31 no.6
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• pp.361-365
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• 2022

Advanced packaging demands are driven by the need for dense integration systems. Consequently, stacked packaging technology has been proposed instead of reducing the ultra-fine patterns to secure economic feasibility. This study proposed an effective packaging process technology for semiconductor devices using a 9-inch dicing die attach film (DDAF), wherein the die attach and dicing films were combined. The process involved three steps: tape lamination, dicing, and bonding. Following the grinding of a silicon wafer, the tape lamination process was conducted, and the DDAF was arranged. Subsequently, a silicon wafer attached to the DDAF was separated into dies employing a blade dicing process with a two-step cut. Thereafter, one separated die was bonded with the other die as a substrate at 130 ℃ for 2 s under a pressure of 2 kgf and the chip was hardened at 120 ℃ for 30 min under a pressure of 10 kPa to remove air bubbles within the DAF. Finally, a curing process was conducted at 175 ℃ for 2 h at atmospheric pressure. Upon completing the manufacturing processes, external inspections, cross-sectional analyses, and thermal stability evaluations were conducted to confirm the optimality of the proposed technology for application of the DDAF. In particular, the shear strength test was evaluated to obtain an average of 9,905 Pa from 17 samples. Consequently, a 3D integration packaging process using DDAF is expected to be utilized as an advanced packaging technology with high reliability.