• 제목/요약/키워드: Nano process

검색결과 2,508건 처리시간 0.03초

Si 태양전지 금속배선 공정을 위한 나노 Ag 잉크젯 프린터 제작 및 응용 (Manufacturing of Ag Nano-particle Ink-jet Printer and the Application into Metal Interconnection Process of Si Solar Cells)

  • 이정택;최재호;김기완;신명선;김근주
    • 반도체디스플레이기술학회지
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    • 제10권2호
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    • pp.73-81
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    • 2011
  • We manufactured the inkjet printing system for the application into the nano Ag finger line interconnection process in Si solar cells. The home-made inkjet printer consists of motion part for XY motion stage with optical table, head part, power and control part in the rack box with pump, and ink supply part for the connection of pump-tube-sub ink tanknozzle. The ink jet printing system has been used to conduct the interconnection process of finger lines on Si solar cell. The nano ink includes the 50 nm-diameter. Ag nano particles and the viscosity is 14.4 cP at $22^{\circ}C$. After processing of inkjet printing on the finger lines of Si solar cell, the nano particles were measured by scanning electron microscope. After the heat treatment at $850^{\circ}C$, the finger lines showed the smooth surface morphology without micropores.

펠티어 소자를 이용한 다공성 나노패턴의 사출에 대한 연구 (Injection molding using porous nano-scale patterned master with Pettier devices)

  • 홍남표;권종태;신홍규;서영호;김병희
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2008년도 춘계학술대회 논문집
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    • pp.513-516
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    • 2008
  • We have replicated nanopillar arrays using injection molding process of active heating and cooling method by several peltier devices. The injection melding has a high accuracy ed good reproducibility that are essential for mass production at low cost. Conventional molding processes widely use the water-based mold heating and air cooling methods. However, in case of replication for nano-patterned structures, it caused several defects such as air-flow mark, non-fill, sticking and tearing. In this study, periodic nano-scale patterns are replicated by using injection molding with Peltier devices. Porous nano-scale patterns, which have pore diameter range from 120nm to 150nm, were fabricated by using anodizing process. Periodic nano-pore structures ( $20mm\;{\times}\;20mm$) were used as a mold stamp of injection molding. Finally, PMMA with nanopillar arrays was obtained by injection molding process. By using the Peltier devices, the temperature of locally adiabatic molds can be dramatically controlled and the quality of the molded patterns can be slightly improved.

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나노인프로세스 표면형상계측을 위한 SFM시스템의 개발 (Development of SFM System for Nano In-Process Profile Measurement)

  • 권현규;최성대;홍성욱
    • 한국기계가공학회지
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    • 제3권2호
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    • pp.53-59
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    • 2004
  • In this paper, we propose a new multi-purpose Scanning Force Microscope (SFM) system. The system can be used for nano/micro-scratching, in-process profile measurement, and observation of potential surface defects which occur during the scratching in air or liquid. Experimental results of nano/micro-scratching show that the smallest scratching depth can be controlled to be 10nm, which corresponds to the stability of the SFM system. Profile measurements of nano/micro-scratching surfaces have also been performed by the method of on-machine measurement and in-process measurement. Two measurement results were in good agreement with each other. The maximum difference was approximately 10 nm, which was mainly caused by the sampling repeatability error that influences the measurement accuracy Also, micro-defects on the micro-scratching surface were successfully detected by the SFM system. It was confirmed that the number of micro-defects increases when the surface is subjected to a cyclic bending load. The maximum depth was less than 100nm.

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나노 복화(複畵)공정을 이용한 PDMS 스탬프 제작 (Fabrication of a PDMS (Poly-Dimethylsiloxane) Stamp Using Nano-Replication Printing Process)

  • 박상후;임태우;양동열;공홍진
    • 대한기계학회논문집A
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    • 제28권7호
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    • pp.999-1005
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    • 2004
  • A new stamp fabrication technique for the soft lithography has been developed in the range of several microns by means of a nano-replication printing (nRP) process. In the nRP process, a figure or a pattern can be replicated directly from a two-tone bitmap figure with nano-scale details. A photopolymerizable resin was polymerized by the two-photon absorption which was induced by a femtosecond laser. After the polymerization of master patterns, a gold metal layer (about 30 ㎚ thickness) was deposited on the fabricated master patterns for the purpose of preventing a join between the patterns and the PDMS, then the master patterns were transferred in order to fabricate a stamp by using the PDMS (poly-dimethylsiloxane). In the transferring process, a few of gold particles, which were isolated from the master patterns, remained on the PDMS stamp. A gold selective etchant, the potassium iodine (KI) was employed to remove the needless gold particles without any damage to the PDMS stamp. Through this work, the effectiveness of the nRP process with the PDMS molding was evaluated to make the PDMS stamp with the resolution of around 200 ㎚.

A Review on Transfer Process of Two-dimensional Materials

  • Kim, Chan;Yoon, Min-Ah;Jang, Bongkyun;Kim, Jae-Hyun;Kim, Kwang-Seop
    • Tribology and Lubricants
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    • 제36권1호
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    • pp.1-10
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    • 2020
  • Large-area two-dimensional (2D) materials synthesized by chemical vapor deposition on donor substrates are promising functional materials for conductors, semiconductors, and insulators in flexible and transparent devices. In most cases, 2D materials should be transferred from a donor substrate to a target substrate; however, 2D materials are prone to damage during the transfer process. The damages to 2D materials during transfer are caused by contamination, tearing, and chemical doping. For the commercialization of 2D materials, a damage-free, large-area, and productive transfer process is needed. However, a transfer process that meets all three requirements has yet to be developed. In this paper, we review the recent progress in the development of transfer processes for 2D materials, and discuss the principles, advantages, and limitations of each process. The future prospects of transfer processes are also discussed. To simplify the discussion, the transfer processes are classified into four categories: wet transfer, dry transfer, mechanical transfer, and electro-chemical transfer. Finally, the "roll-to-roll" and "roll-to-plate" dry transfer process is proposed as the most promising method for the commercialization of 2D materials. Moreover, for successful dry transfer of 2D materials, it is necessary to clearly understand the adhesion properties, viscoelastic behaviors, and mechanical deformation of the transfer film used as a medium in the transfer process.

연속체 가정을 통한 NIL 공정의 전산모사 (Numerical Simulation of NIL Process Based on Continuum Hypothesis)

  • 김승모;이우일
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2007년도 춘계학술대회A
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    • pp.532-537
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    • 2007
  • Nano imprint lithography(NIL) is a cost-efficient, high-throughput processing technique to transfer nano-scale patterns onto thin polymer films. Polymers used as the resist include UV cured resins as well as thermoplastics such as polymethyl-methacrylate(PMMA). In this study, an analytic investigation was performed for the NIL process of transferring nano scale patterns onto polymeric films. Process optimization calls for a thorough understanding of resist flow during the process. We carried out 2D and 3D numerical analyses of resist flow during NIL process. The simulation incorporated continuum-hypothesis and the effects of surface tension were taken into account. For a more effective prediction of free surface, fixed grid scheme with the volume of fluid (VOF) method were used. The simulation results were verified with experimental results qualitatively. And the parametric study was performed for various process conditions.

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탄소나노섬유 표면 구리 무전해 도금에 미치는 분산제와 도금 전처리의 영향 (Effects of Surfactant and Preplate Process on Electroless Copper Plating on Carbon Nano-fiber)

  • 한준현;석현광;이상수;지광구
    • 한국분말재료학회지
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    • 제16권2호
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    • pp.131-137
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    • 2009
  • This paper deals with the effects of the surfactant and preplate process (sensitization and activation) on electroless copper plating on carbon nano-fiber (CNF). Ultrasonic irradiation was applied both during dispersion of CNF and during electroless plating containing preplate process. The dispersion of CNF and flatness of the plated copper film were discussed based on the changes in surfactant concentration and preplate process time. It was clearly shown that high concentration of surfactant and long time of preplate process could promote the agglomeration of CNF and uneven copper plating on CNF.

GaAs/AlGaAs와 GaAs/InGaP의 건식 식각 시 Flourine 이온의 효과 (F Ion-Assisted Effect on Dry Etching of GaAs over AlGaAs and InGaP)

  • 장수욱;박민영;최충기;유승열;이제원;승한정;전민현
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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    • pp.164-165
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    • 2005
  • The dry etch characteristics of GaAs over both AlGaAs and InGaP in planar inductively coupled $BCl_3$-based plasmas(ICP) with additions of $SF_6$ or $CF_4$ were studied. The additions of flourine gases provided enhanced etch selectivities of GaAs/AlGaAs and GaAs/InGaP. The etch stop reaction involving formation of involatile $AlF_3$ and $InF_3$ (boiling points of etch products: $AlF_3\sim1300^{\circ}C$, $InF_3$ > $1200^{\circ}C$ at atmosphere) were found to be effective under high density inductively coupled plasma condition. Decrease of etch rates of all materials was probably due to strong increase of flourine atoms in the discharge, which blocked the surface of the material against chlorine neutral adsorption. The process parameters were ICP source power (0 - 500 W), RF chuck power (0 - 30 W) and variable gas composition. The process results were characterized in terms of etch rate, selectivities of GaAs over AlGaAs and InGaP, surface morphology, surface roughness and residues after etching.

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세레이션형 미세 멀티셀 튜브 압출 및 접합강도 평가 (FE analysis of Extrusion Process and Estimation of welding strength for Micro Multi Cell Tube with Serration)

  • 이정민;김병민;조형호;강충길
    • 한국정밀공학회지
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    • 제22권9호
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    • pp.49-59
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    • 2005
  • This paper describes a development of the extrusion process and estimation of the weldability for multi cell tubes used to cooling system of automobiles. A study on extrusion process is performed through the 3D FE simulation in non-steady state and extrusion experimentation. Also, nano-indentation test is employed to estimate the weldability of tubes. Especially, An evaluation of the weldability using the nano-indentation is accomplished as compared with nano-hardness in welded part and in the others. Finally, the pattern of the mandrel defection is investigated according to shapes of the porthole and/or chamber.

나노 패턴 장비용 컴플라이언스 스테이지 (Compliant Stage for Nano Patterning Machine)

  • 최기봉;이재종
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2003년도 춘계학술대회
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    • pp.1065-1068
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    • 2003
  • The nano imprint process is one of the next generation lithography has been mentioned as one of major nanoreplication techniques because it is simple process, low cost, high replication fidelity and relatively high throughput. This process requires a surface contact between a template with patterns and a wafer on a stage. After contact, the vertical moving the template to the wafer causes some directional motions of the stage. Thus the stage must move according to the motions of the template to avoid the damage of the transferred patterns on the wafer. This study is to develop the wafer stage with a passive compliance to overcome the damage. This stage is designed with the concept like that it has a monolithic, symmetry and planar 6-DOF mechanism.

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