• Title/Summary/Keyword: Nano metal particles

Search Result 156, Processing Time 0.023 seconds

Heat Conductivity Test and Conduction Mechanism of Nanofluid (나노유체의 열전도율 실험과 열전달 메커니즘의 제시)

  • Park, Kweon-Ha;Lee, Jin-A;Kim, Hye-Min
    • Journal of Advanced Marine Engineering and Technology
    • /
    • v.32 no.6
    • /
    • pp.862-868
    • /
    • 2008
  • Many studies have been conducted to increase heat transfer in fluid. One of the various heat transfer enhancement techniques is suspending fine metallic or nonmetallic solid powder in traditional fluid. Nanofluid is defined as a new kind of heat transfer fluid containing a very small quantity of nanometer particles that are uniformly and stably suspended in a liquid. This study investigates the effect of nanofluid containing diamond, CuNi and CuAg nanometer particles, and proposes the heat transport mechanism of nanofluid. The test result shows that the thermal conductivity of nanofluid is much higher than that of traditional fluid, and the increasing rate of the conductivity is dependent on the conductivity of the solid metal.

Reduction Behaviors of Nitric Oxides on Copper-decorated Mesoporous Molecular Sieves

  • Cho, Ki-Sook;Kim, Byung-Joo;Kim, Seok;Kim, Sung-Hyun;Park, Soo-Jin
    • Bulletin of the Korean Chemical Society
    • /
    • v.31 no.1
    • /
    • pp.100-103
    • /
    • 2010
  • In this study, NO reduction behaviors of copper-loaded mesoporous molecular sieves (Cu/MCM-41) have been investigated. The Cu loading on MCM-41 surfaces was accomplished by a chemical reduction method with different Cu contents (5, 10, 20, and 40%). $N_2/77$ K adsorption isotherm characteristics, including the specific surface area and pore volume, were studied by BET's equation. NO reduction behaviors were confirmed by a gas chromatography. From the experimental results, the Cu loading amount on MCM-41 led to the increase of NO reduction efficiency in spite of decreasing the specific surface area of catalysts. This result indicates that highly ordered porous structure in the MCM-41 and the presence of active metal particles lead the synergistical NO reduction reactions due to the increase in adsorption energy of MCM-41 surfaces by the Cu particles.

A Research About P-type Polycrystalline Silicon Thin Film Transistors of Low Temperature with Metal Gate Electrode and High Temperature with Gate Poly Silicon (실리콘 게이트전극을 갖는 고온소자와 금속 게이트전극을 갖는 P형 저온 다결정 실리콘 박막 트랜지스터의 전기특성 비교 연구)

  • Lee, Jin-Min
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.24 no.6
    • /
    • pp.433-439
    • /
    • 2011
  • Poly Si TFTs (poly silicon thin film transistors) with p channel those are annealed HT (high temperature) with gate poly crystalline silicon and LT (low temperature) with metal gate electrode were fabricated on quartz substrate using the analyzed data and compared according to the activated grade silicon thin films and the size of device channel. The electrical characteristics of HT poly-Si TFTs increased those are the on current, electron mobility and decrease threshold voltage by the quality of particles of active thin films annealed at high temperature. But the on/off current ratio reduced by increase of the off current depend on the hot carrier applied to high gate voltage. Even though the size of the particles annealed at low temperature are bigger than HT poly-Si TFTs due to defect in the activated grade poly crystal silicon and the grain boundary, the characteristics of LT poly-Si TFTs were investigated deterioration phenomena those are decrease the electric off current, electron mobility and increase threshold voltage. The results of transconductance show that slope depend on the quality of particles and the amplitude depend on the size of the active silicon particles.

Nanomaterials for Advanced Electrode of Low Temperature Solid Oxide Fuel Cells (SOFCs)

  • Ishihara, Tatsumi
    • Journal of the Korean Ceramic Society
    • /
    • v.53 no.5
    • /
    • pp.469-477
    • /
    • 2016
  • The application of nanomaterials for electrodes of intermediate temperature solid oxide fuel cells (SOFC) is introduced. In conventional SOFCs, the operating temperature is higher than 1073 K, and so application of nanomaterials is not suitable because of the high degradation rate that results from sintering, aggregation, or reactions. However, by allowing a decrease of the operating temperature, nanomaterials are attracting much interest. In this review, nanocomposite films with columnar morphology, called double columnar or vertically aligned nanocomposites and prepared by pulsed laser ablation method, are introduced. For anodes, metal nano particles prepared by exsolution from perovskite lattice are also applied. By using dissolution and exsolution into and from the perovskite matrix, performed by changing $P_{O2}$ in the gas phase at each interval, recovery of the power density can be achieved by keeping the metal particle size small. Therefore, it is expected that the application of nanomaterials will become more popular in future SOFC development.

Investigation of Conductive Pattern Line for Direct Digital Printing (디지털 프린팅을 위한 전도성 배선에 관한 연구)

  • Kim, Yong-Sik;Seo, Shang-Hoon;Lee, Ro-Woon;Kim, Tae-Hoon;Park, Jae-Chan;Kim, Tae-Gu;Jeong, Kyoung-Jin;Yun, Kwan-Soo;Park, Sung-Jun;Joung, Jae-Woo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2007.06a
    • /
    • pp.502-502
    • /
    • 2007
  • Current thin film process using memory device fabrication process use expensive processes such as manufacturing of photo mask, coating of photo resist, exposure, development, and etching. However, direct printing technology has the merits about simple and cost effective processes because inks are directly injective without mask. And also, this technology has the advantage about fabrication of fine pattern line on various substrates such as PCB, FCPB, glass, polymer and so on. In this work, we have fabricated the fine and thick metal pattern line for the electronic circuit board using metal ink contains Ag nano-particles. Metal lines are fabricated by two types of printing methods. One is a conventional printing method which is able to quick fabrication of fine pattern line, but has various difficulties about thick and high resolution DPI(Dot per Inch) pattern lines because of bulge and piling up phenomenon. Another(Second) methods is sequential printing method which has a various merits of fabrication for fine, thick and high resolution pattern lines without bulge. In this work, conductivities of metal pattern line are investigated with respect to printing methods and pattern thickness. As a result, conductivity of thick pattern is about several un.

  • PDF

Growth of Metal Nano-Particles on Polarity Patterned Ferroelectrics by Photochemical Reaction (광화학적 반응을 이용한 편극 패턴된 강유전체 표면에 금속 나노입자의 증착에 관한 연구)

  • Park, Young-Sik;Kim, Jung-Hoon;Yang, Woo-Chul
    • Journal of the Korean Vacuum Society
    • /
    • v.20 no.4
    • /
    • pp.300-306
    • /
    • 2011
  • We report the surface distribution of metal (Ag, Au) nanoparticles grown on polarity-patterned ferroelectric substrates by photochemical reaction. Single crystal periodically polarity-patterned $LiNbO_3$(PPLN) was used as a ferroelectric substrate. The nanoparticles were grown by ultra-violet (UV) light exposure of the PPLN in the aqueous solutions including metas. The surface distribution of the grown nanoparticles were measured by atomic force microscopy and identification of the orientation of the polarity of the ferroelectric surface was performed by piezoelectric force microscopy. The Ag- and Au-nanoparticles grown on +z polarity regions are larger and denser than that on -z polarity regions. In particlur, the largest and denser Ag-nanoparticles were grwon on the polarity boundary regions of the PPLN while Au-nanoparticles were not specifically grown on the boundary regions. Thus, we found that the size and position of metal nanoparticles grown on ferroelectric surfaces can be controlled by UV-exposure time and polarity pattern structures. Also, we discuss the difference of the surface distribution of the metal nano-particles depending on the polarity of the ferroelectric surfaces in terms of surface band structures, reduced work fucntion, and inhomogeneous electric field distribution.

The Variation of Packing Density According to Powder Size Distribution and Epoxy Resin in Soft Magnetic Composite (연자성 복합체에서 파우더 크기 분포와 Epoxy Resin에 따른 Packing Density 변화)

  • Lee, Chang Hyun;Oh, Sea Moon;Shin, Hyo Soon;Yeo, Dong Hun;Kim, Jin Ho
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.30 no.12
    • /
    • pp.782-787
    • /
    • 2017
  • There is growing interest in power inductors in which metal soft magnetic powder and epoxy resin are combined. In this field, the process technology for increasing the packing density of magnetic particles in an injection molding process is very important. However, little research has been reported in this regard. In order to improve the packing density, we investigated and compared the sedimentation heights of pastes for three types of soft magnetic alloy powders as a function of the mixing ratios and the type of resin used. Experimental results showed that the packing density was the highest (71.74%) when the mixing ratio was 80 : 16 : 4 (Sendust : Fe-S : CIP) according to the particle size using an SE-4125 resin. In addition, the packing density was found to be inversely related to the layer separation distance. As a result, it was confirmed that the dispersion of solid particles in the paste was important for curing; however, the duration of the curing process can greatly affect the packing density of the final composite.

Development of SiC Composite Solder with Low CTE as Filling Material for Molten Metal TSV Filling (용융 금속 TSV 충전을 위한 저열팽창계수 SiC 복합 충전 솔더의 개발)

  • Ko, Young-Ki;Ko, Yong-Ho;Bang, Jung-Hwan;Lee, Chang-Woo
    • Journal of Welding and Joining
    • /
    • v.32 no.3
    • /
    • pp.68-73
    • /
    • 2014
  • Among through silicon via (TSV) technologies, for replacing Cu filling method, the method of molten solder filling has been proposed to reduce filling cost and filling time. However, because Sn alloy which has a high coefficient of thermal expansion (CTE) than Cu, CTE mismatch between Si and molten solder induced higher thermal stress than Cu filling method. This thermal stress can deteriorate reliability of TSV by forming defects like void, crack and so on. Therefore, we fabricated SiC composite filling material which had a low CTE for reducing thermal stress in TSV. To add SiC nano particles to molten solder, ball-typed SiC clusters, which were formed with Sn powders and SiC nano particles by ball mill process, put into molten Sn and then, nano particle-dispersed SiC composite filling material was produced. In the case of 1 wt.% of SiC particle, the CTE showed a lowest value which was a $14.8ppm/^{\circ}C$ and this value was lower than CTE of Cu. Up to 1 wt.% of SiC particle, Young's modulus increased as wt.% of SiC particle increased. And also, we observed cross-sectioned TSV which was filled with 1 wt.% of SiC particle and we confirmed a possibility of SiC composite material as a TSV filling material.

Preparation of Manganese Oxide Powders by Spray Pyrolysis and its Electrochemical Characterization (Spray Pyrolysis에 의한 Manganese Oxide 입자의 제조 및 전기화학적 특성)

  • Choi, Won-Chang;Byun, Dong-Jin;Lee, Jung-Kee;Park, Dal-Keun;Kim, Hyeon-Joong
    • Korean Journal of Materials Research
    • /
    • v.11 no.11
    • /
    • pp.936-940
    • /
    • 2001
  • Spray pyrolysis is a favorable technique to form complex mixed-metal oxide powders with high purity in high temperature region. Manganese oxide powders were prepared by spray pyrolysis from an aqueous solution of $Mn(NO_3)_2$. Powders were formed in the temperature range of 500~$700^{\circ}C$ under the constant pressure of 300torr. All the powders have hydrous forms. When the temperature was increased, the size and the surface area of the particles decreased. An electrochemical capacitors were made with manganese oxide electrodes and KOH electrolyte. With the temperature decreased, capacitors showed high capacitance. Capacitor which was prepared with powders formed in the temperature $500^{\circ}C$ demonstrated specific capacitances as high as 83F/g.

  • PDF

Experimental Studies on Plasmon Resonance of Ag Nanoparticles on Highly Ordered Pyrolytic Graphite (HOPG)

  • Lopez Salido, Ignacio;Bertram, Nils;Lim, Dong-Chan;Gantefor, Gerd;Kim, Young-Dok
    • Bulletin of the Korean Chemical Society
    • /
    • v.27 no.4
    • /
    • pp.556-562
    • /
    • 2006
  • Studies on Ag nanoparticles grown on Highly Ordered Pyrolytic Graphite (HOPG) using HREELS provide different results for smaller and larger particle sizes corresponding to Ag coverages below and above 4 monolayers, respectively. For the larger particles, a positive frequency shift with decreasing particle size and a broadening of the plasmon resonance were observed with decreasing particle size, in line with previous studies on Ag on alumina. For the smaller particles, in contrast, a shift to lower energy with decreasing particle size, and a narrowing of the plasmon resonance with decreasing particle size can be found. The asymmetry of the Ag-features present for Ag coverages above 4 monolayers disappears for Ag coverages below 4 monolayers. The result for the smaller particles can be rationalized in terms of change of the particle growth mode with increasing particle size, which corroborates our STM data, as well as electronic effects due to the metal/support charge transfer.