• 제목/요약/키워드: Nano Pattern

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사출 성형 공정을 이용한 나노급 패턴 제작 (Injection Molded Nano Scale Pattern)

  • 유영은;서영호;최두선;이준형;제태진;황경현
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2004년도 춘계학술대회
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    • pp.989-992
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    • 2004
  • A new method is proposed to fabricate a reusable qualtz master with order of 100 nm dot pattern on its surface. Some fabrication conditions such as dose are investigated to find optimal condition. This reusable qualtz master is used directly as a stamper to injection mold the dot patterns. Polycarbonate and Polyoxymethylene are used as molding materials and the effect of the mold temperature is also investigated to see the moldabilty of the injection molding for very fine dot features.

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가스 용해를 고려한 금형내압제어 사출성형공정의 마이크로패턴 충전 해석 (Numerical Analysis of Micro-pattern Filling with Gas Dissolution by Injection Molding Process)

  • 박성호;유형민;이우일
    • 한국기계가공학회지
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    • 제13권4호
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    • pp.21-27
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    • 2014
  • The injection molding process has several advantages enabling it to produce large quantities of molded plastic products using a repetitive process. In recent years, it has been necessary to develop an injection molding process with micro/nano-sized patterns for application to the semiconductor industry and to the bio/nano manufacturing industry. In this study, we apply gas pressure to the inside of a mold and consider the gas dissolution phenomenon for a resin filling into a micro pattern with a line structure. Using numerical analysis, we calculate the filling ratio with respect to time for various internal gas pressures and various aspect ratios of the micro-patterns.

잉크젯 프린팅 기술을 이용한 기판 표면처리와 금속 패턴 형성에 관한 연구 (A Study of Substrate Surface Treatment and Metal Pattern Formation using Inkjet Printing Technology)

  • 조용민;박성준
    • 한국분무공학회지
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    • 제17권1호
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    • pp.20-26
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    • 2012
  • Inkjet printing is one of the direct writing technologies and is able to form a pattern onto substrate by dispensing droplets in desired position. Also, by inkjet technology manufacturing time and production costs can be reduced, and procedures can be more efficient. To form a metal pattern, it must be harmonized with conductive nano ink, printing process, sintering, and surface treatment. In this study, micro patterning of conductive line has been investigated using the piezoelectric printhead driven by a bipolar voltage signal is used to dispense $20-40{\mu}m$ diameter droplets and silver nano ink which consists of 50 nm silver particles. In addition, hydrophobic treatment of surface, overlap printing techniques, and sintering conditions with changing temperature and times to achieve higher conductivity.

PC소재의 선형 패턴 제작에 관한 연구 (A study on Linear Pattern Fabrication of Plate-type PC)

  • 정유나;이은경;강충길
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2008년도 춘계학술대회 논문집
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    • pp.277-280
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    • 2008
  • Recently, a demand of nano/micro patterned polymer for display or biochip has been rising. Then many studies have been carried out. Nano/micro-embossing is a deformation process where the workpiece materials is heated to permit easier material flow and then forced over a planar patterned tool. In this work, the hot-emboss process is performed with different forming conditions; forming temperature, load, press hold time, to get the proper condition for linear pattern fabrication on plated-type polymers (PC). Replicated pattern depth increases in proportion to the forming temperature, load and time. Reduction of the workpiece thickness increases according to press hold time. In process of time, reduction ratio of workpiece thickness decreases because of surface area increment of the workpiece and pressure decline on it.

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단결정 다이아몬드공구를 사용한 Cu 도금된 몰드의 미세 구조체 가공특성 (Machining Characteristics of Micro Structure using Single-Crystal Diamond Tool on Cu-plated Mold)

  • 김창의;전은채;제태진;강명창
    • 한국분말재료학회지
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    • 제22권3호
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    • pp.169-174
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    • 2015
  • The optical film for light luminance improvement of BLU that is used in LCD/LED and retro-reflective film is used as luminous sign consist of square and triangular pyramid structure pattern based on V-shape micro prism pattern. In this study, we analyzed machining characteristics of Cu-plated flat mold by shaping with diamond tool. First, cutting conditions were optimizing as V-groove machining for the experiment of micro prism structure mold machining with prism pattern shape, cutting force and roughness. Second, the micro prism structure such as square and triangular pyramid pattern were machined by cross machining method with optimizing cutting conditions. Burr and chip shape were discussed with material properties and machining method.

High Resolution Patternning for Graphene Nanoribbons (GNRs) Using Electro-hydrodynamic Lithography

  • Lee, Su-Ok;Kim, Ha-Nah;Lee, Jae-Jong;Kang, Dae-Joon
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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    • pp.198-198
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    • 2012
  • Graphene has been the subject of intense study in recent years owing to its good optoelectronic properties, possibility for stretchable electronics, and so on. Especially, many research groups have studied about graphene nanostructures with various sizes and shapes. Graphene needs to be fabricated into useful devices with controllable electrical properties for its successful device applications. However, this been far from satisfaction owing to a lack of reliable pattern transfer techniques. Photolithography, nanowire etching, and electron beam lithography methods are commonly used for construction of graphene patterns, but those techniques have limitations for getting controllable GNRs. We have developed a novel nanoscale pattern transfer technique based on an electro-hydrodynamic lithography providing highly scalable versatile pattern transfer technique viable for industrial applications. This technique was exploited to fabricate nanoscale patterned graphene structures in a predetermined shape on a substrate. FE-SEM, AFM, and Raman microscopy were used to characterize the patterned graphene structures. This technique may present a very reliable high resolution pattern transfer technique suitable for graphene device applications and can be extended to other inorganic materials.

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반도체 광원 적용을 위한 3차원 나노 구조 개발 (3-dimensional Nano Structures for Semiconductor Light Source)

  • 김제원
    • 융합정보논문지
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    • 제10권2호
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    • pp.96-101
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    • 2020
  • 반도체 조명과 아울러 디스플레이의 주요한 광원으로서 주목받고 있는 마이크로 크기의 발광다이오드에서 광학적 특성 및 효율의 향상을 위해 다양한 개발 방향과 연구 방법이 제시되어져 왔다. 하지만 이러한 개발 방향과 방법은 2차원 구조를 기반으로 하고 있으며, 이에 따라 연구와 개발이 진행되어왔다. 본 연구에서는 기존의 평면구조와는 구별되는 나노 프레임 구조를 통한 입체적인 나노 구조의 설계와 아울러 미세 패턴과 반응성 에칭 방법이 적용된 반도체 공정 적용을 제시하고자 한다. 또한, 나노 프레임 구조의 구현을 위해 적용된 공정 개발을 통해 수직성이 향상된 나노 캐비티와 이를 통한 나노 기둥의 제시를 통해 나노 구조의 반도체 광원으로의 적용 가능성을 제시하고자 한다.

진공 압력차이법에 의한 나노 정밀도를 가지는 폴리디메틸실록산 형상복제 (Fabrication Process of a Nano-precision Polydimethylsiloxane Replica using Vacuum Pressure-Difference Technique)

  • 박상후;임태우;양동열;공홍진;이광섭
    • 폴리머
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    • 제28권4호
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    • pp.305-313
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    • 2004
  • 본 연구는 나노 복화공정을 이용하여 마이크로 혹은 나노공정에 응용이 가능한 형상모형 제작공정 개발과 폴리디메틸실록산 (polydimethylsiloxane)를 이용하여 만들어진 형상모형의 몰드로 나노급 정밀도의 폴리디메틸실록산 형상을 복제하는 공정에 관한 것이다. 본 연구에서 제안한 나노 복화공정은 복잡한 형상모형 (pattern)이나 2차원 형상을 CAD 파일 없이 비트맵 그림파일을 이용하여 직접적으로 200nm 정밀도를 가지는 형상으로 만들 수 있다. 형상모형은 펨토초 레이저를 이용하여 이광자 흡수 중합법으로 제작하기 때문에 형상의 정밀도는 레이저 범의 회절한계 이하로 얻을 수 있다. 이렇게 제작된 마스터 형상모형은 본 연구에서 제안한 진공압력차이법으로 폴리디메틸실록산 몰드를 제작하여 기존의 제작방법에 비하여 정밀한 제작이 가능함을 보였으며 또한 제작된 몰드를 이용하여 양각의 플리디메틸실록산 스탬프를 제작하였다.

UVA LED를 이용한 근접 노광용 렌즈 설계 기술 연구 (A Study of Lens Design Technique for Proximity Exposure Using a UVA LED)

  • 이정수;조예지;이현화;공미선;강동화;정미숙
    • 한국광학회지
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    • 제30권4호
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    • pp.146-153
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    • 2019
  • 노광기는 회로 패턴을 원하는 위치에 전사시켜주는 장비로 패턴을 광학적 특성의 변형 없이 기재 상에 나타내기 위해서는 노광광학계의 특성이 매우 중요하다. 따라서 미세회로 패턴을 형성하기 위해서는 조사 면적에 작은 발산각으로 입사되어야 한다. 또한, 광원에서 나온 빛이 감광제와 균일하게 반응해야 하기 때문에 높은 광효율과 조도 균일도를 가져야 한다. 본 논문에서는 협각 구현의 문제점을 해결하기 위한 방법으로 반사형 타입인 파라볼라 반사경과 비구면 렌즈 설계를 진행하였고, 배열 후 시뮬레이션 분석 결과 광속 각도, 균일도, 최대조도가 목표 성능을 만족하는 것을 확인하였다.

Nano-Scale Cu Direct Bonding Technology Using Ultra-High Density, Fine Size Cu Nano-Pillar (CNP) for Exascale 2.5D/3D Integrated System

  • Lee, Kang-Wook
    • 마이크로전자및패키징학회지
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    • 제23권4호
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    • pp.69-77
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    • 2016
  • We propose nano-scale Cu direct bonding technology using ultra-high density Cu nano-pillar (CNP) with for high stacking yield exascale 2.5D/3D integration. We clarified the joining mechanism of nano-scale Cu direct bonding using CNP. Nano-scale Cu pillar easily bond with Cu electrode by re-crystallization of CNP due to the solid phase diffusion and by morphology change of CNP to minimize interfacial energy at relatively lower temperature and pressure compared to conventional micro-scale Cu direct bonding. We confirmed for the first time that 4.3 million electrodes per die are successfully connected in series with the joining yield of 100%. The joining resistance of CNP bundle with $80{\mu}m$ height is around 30 m for each pair of $10{\mu}m$ dia. electrode. Capacitance value of CNP bundle with $3{\mu}m$ length and $80{\mu}m$ height is around 0.6fF. Eye-diagram pattern shows no degradation even at 10Gbps data rate after the lamination of anisotropic conductive film.