• Title/Summary/Keyword: Nano Ink

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Interfacial Microstructures between Ag Wiring Layers and Various Substrates (Ag 인쇄배선과 이종재료기판과의 접합계면)

  • Kim, Keun-Soo;Suganuma, Katsuaki;Huh, Seok-Hwan
    • Journal of Welding and Joining
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    • v.29 no.5
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    • pp.90-94
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    • 2011
  • Ag metallic particles from nano-scale to submicron-scale are combined with organic solvent to provide fine circuits and interconnection. Ink-jet printing with Ag nano particle inks demonstrated the potentials of the new printed electronics technology. The bonding at the interface between the Ag wiring layer and the various substrates is very important. In this study, the details of interfaces in Ag wiring are investigated primarily by microstructure observation. By adjusting the materials and sintering conditions, nicely formed interfaces between Ag wiring and Cu, Au or organic substrates are achieved. In contrast, transmission electron microscope (TEM) image clearly shows interface debonding between Ag wiring and Sn substrate. Sn oxides are formed on the surface of the Sn plating. The formation of these is a root cause of the interface debonding.

A Study of Substrate Surface Treatment and Metal Pattern Formation using Inkjet Printing Technology (잉크젯 프린팅 기술을 이용한 기판 표면처리와 금속 패턴 형성에 관한 연구)

  • Jo, Yong-Min;Park, Sung-Jun
    • Journal of ILASS-Korea
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    • v.17 no.1
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    • pp.20-26
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    • 2012
  • Inkjet printing is one of the direct writing technologies and is able to form a pattern onto substrate by dispensing droplets in desired position. Also, by inkjet technology manufacturing time and production costs can be reduced, and procedures can be more efficient. To form a metal pattern, it must be harmonized with conductive nano ink, printing process, sintering, and surface treatment. In this study, micro patterning of conductive line has been investigated using the piezoelectric printhead driven by a bipolar voltage signal is used to dispense $20-40{\mu}m$ diameter droplets and silver nano ink which consists of 50 nm silver particles. In addition, hydrophobic treatment of surface, overlap printing techniques, and sintering conditions with changing temperature and times to achieve higher conductivity.

Micro Patterning of Conductive Line by Micro Droplet Ejection of Nano Metal Ink (나노 금속잉크의 미세 액적 토출을 이용한 마이크로 패터닝)

  • Seo S.H.;Park S.J.;Jung H.C.;Joung J.W.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.10a
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    • pp.689-693
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    • 2005
  • Inkjet printing is a non-contact and direct writing associated with a computer. In the industrial field, there have been many efforts to utilize the inkjet printing as a new way of manufacturing, especially for electronic devices. For the application of inkjet printing to electronic field, one of the key factors is exact realization of designed images into printed patterns. In this work, micro patterning for conducting line has been studied using the piezoelectric print head and silver nano ink. Dimensions of printed images have been predicted in terms of print resolution and diameter of a single dot. The predicted and the measured values showed consistent results. Using the results, the design capability for industrial inkjet printing could be achieved.

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Effect of Marangoni flow on Surface Roughness and Packing Density of Inkjet-printed Alumina Film by Modulating Ink Solvent Composition

  • Jang, Hun-Woo;Kim, Ji-Hoon;Kim, Hyo-Tae;Yoon, Young-Joon;Kim, Jong-Hee;Hwang, Hae-Jin
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.11a
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    • pp.99-99
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    • 2009
  • Two different micro-flows during the evaporation of ink droplets were achieved by engineering both surface tension gradient and compositional gradient across the ink droplet: (1) Coffee-ring generating flow resulting from the outward flow inside the ink droplet & (2) Marangoni flow leading to the circulation flow inside the ink droplet. The surface tension gradient and the compositional gradient in the ink droplets were tailored by mixing two different solvents with difference surface tension and boiling point. In order to create the coffee-ring generating flow (outward flow), a single-solvent system using N,N-dimethylformamide with nano-sized spherical alumina particles was formulated, Marangoni flow (circulation flow) was created in the ink droplets by combining N,N-dimethylformamide and fotmamide with the spherical alumina powders as a co-solvent ink system. We have investigated the effect of these two different flows on the formation of ceramic films by inkjet printing method, The packing density of the ceramic films printed with two different ink systems (single- and co-solvent systems) and their surface roughness were characterized. The dielectric properties of these inkjet-printed ceramic films such as dielectric constant and dissipation factor were also studied in order to evaluate the feasibility of their application to the electronic ceramic package substrate.

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Evaluation of Contact Resistance between Carbon Fiber/Epoxy Composite Laminate and Printed Silver Electrode for Damage Monitoring (손상 감지 모니터링을 위한 탄소섬유 복합재료와 인쇄된 은 전극 사이의 접촉저항 평가)

  • Jeon, Eun-Beom;Takahashi, Kosuke;Kim, Hak-Sung
    • Journal of the Korean Society for Nondestructive Testing
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    • v.34 no.5
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    • pp.377-383
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    • 2014
  • An addressable conducting network (ACN) makes it possible to monitor the condition of a structure using the electrical resistance between electrodes on the surface of a carbon fiber reinforced plastics (CFRP) structure. To improve the damage detection reliability of the ACN, the contact resistances between the electrodes and CFRP laminates needs to be minimized. In this study, silver nanoparticle electrodes were fabricated via printed electronics techniques on a CFRP composite. The contact resistance between the silver electrodes and CFRP were measured with respect to various fabrication conditions such as the sintering temperature of the silver nano-ink and the surface roughness of the CFRP laminates. The interfaces between the silver electrode and carbon fibers were observed using a scanning electron microscope (SEM). Based on this study, it was found that the lowest contact resistance of $0.3664{\Omega}$ could be achieved when the sintering temperature of the silver nano-ink and surface roughness were $120^{\circ}C$ and 0.230 a, respectively.

Effects of Viscosity on Dispersion Stability of Nano CoAl2O4 Ceramic Ink

  • Lee, Ji-Hyeon;Hwang, Hae-Jin;Kim, Jin-Ho;Hwang, Kwang-Taek;Han, Kyu-Sung
    • Journal of the Korean Ceramic Society
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    • v.52 no.6
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    • pp.497-501
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    • 2015
  • Inkjet printing is a widespread technology, offering advantages such as high-quality decoration, a continuous process, and the accurate direct reproduction of patterns or pictures. In inkjet printing technology, the dispersion stability of ceramic ink is one of the most important factors. In this study, the dispersion stability of blue $CoAl_2O_4$ ink for ceramic inkjet printing is systematically investigated. Blue $CoAl_2O_4$ pigment was synthesized by a solid-state reaction and then milled to less than 300nm in size. In order to investigate the influence of the viscosity on the dispersion stability, two types of $CoAl_2O_4$ ceramic inks (termed here Blue L and Blue H) were prepared using different volume ratios of ethylene glycol and ethanol. The Blue L and Blue H ink solutions contained cetyltrimethylammonium bromide(CTAB) as a dispersive agent. The viscosity, surface tension and jetting stability of the $CoAl_2O_4$ ceramic inks were analyzed using a rheometer, a surface tension meter and a dropwatcher. The dispersion stability of the $CoAl_2O_4$ ceramic ink was investigated by a multiple light-scattering method. Blue H, a ceramic ink with higher viscosity, showed much better dispersion stability than the Blue L ceramic ink.

Copper Electrode Material using Copper Formate-Bicarbonate Complex for Printed Electronics

  • Hwang, Jaeeun;Kim, Sinhee;Ayag, Kevin Ray;Kim, Hongdoo
    • Bulletin of the Korean Chemical Society
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    • v.35 no.1
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    • pp.147-150
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    • 2014
  • Copper ink has been prepared by mixing copper(II) formate and 2-ethyl-1-hexylammonium bicarbonate (EHABC) to overcome some weak points such as aggregation and degradation of copper nano-type ink. Ink was coated on glass substrate and calcined at $110^{\circ}C$ to $150^{\circ}C$ to generate electrically conductive copper film under two different atmospheres such as nitrogen gas and gaseous mixture of formic acid and methanol. The lowest resistivity of $1.88{\mu}{\Omega}{\cdot}cm$ of copper film was obtained at $150^{\circ}C$ in gaseous formic acid condition. The long-term resistivity shows to increase from $1.88{\mu}{\Omega}{\cdot}cm$ to $2.61{\mu}{\Omega}{\cdot}cm$ after one month.

Electronic Ink using the Electrophoretic High Mobility Particles

  • Kim, Chul-Am;Kang, Seung-Youl;Kim, Gi-Heon;Ahn, Seong-Deok;Oh, Ji-Young;Suh, Kyung-Soo
    • 한국정보디스플레이학회:학술대회논문집
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    • 2007.08a
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    • pp.969-971
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    • 2007
  • The black/white electronic ink containing high mobility white nano particles and the organic black pigment particles dispersed in dielectric fluid were prepared. A charge control agent affects the electrophoretic zeta potentials of white particle, which show the maximum value in zeta potential. The electronic ink panel fabricated with the charged white particles and the black particles exhibits more than 15:1 contrast ratio at 10V.

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