• ETRI Journal
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• 제31권6호
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• pp.725-731
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• 2009

In this paper, electrostatic discharge (ESD) protection circuits with an advanced substrate-triggered NMOS and a gate-substrate-triggered NMOS are proposed to provide low trigger voltage, low leakage current, and fast turn-on speed. The proposed ESD protection devices are designed using 0.13 ${\mu}m$ CMOS technology. The experimental results show that the proposed substrate-triggered NMOS using a bipolar transistor has a low trigger voltage of 5.98 V and a fast turn-on time of 37 ns. The proposed gate-substrate-triggered NMOS has a lower trigger voltage of 5.35 V and low leakage current of 80 pA.

• JSTS:Journal of Semiconductor Technology and Science
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• 제13권4호
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• pp.402-409
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• 2013

An innovative application of voltage-contrast (VC) inspection allowed inline detection of NMOS leakage in dense SRAM cells is presented. Cell sizes of SRAM are continual to do the shrinkage with bit density promotion as semiconductor technology advanced, but the resulting challenges include not only development of smaller-scale devices, but also intra-devices isolation. The NMOS leakage caused by the underneath n+/P-well shorted to the adjacent PMOS/N-well was inspected by the proposed electron-beam (e-beam) scan in which VC images were compared during the in-line process step of post contact tungsten (W) CMP (Chemical Mechanical Planarization) instead of end-of-line electrical test, which has a long response time. A series of experiments based on the mechanism for improving the intra-well isolation was performed and verified by the inline VC inspection. An optimal process-integration condition involved to the tradeoff between the implant dosage and photo CD was carried out.

• 대한전자공학회논문지SD
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• 제45권6호
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• pp.10-15
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• 2008

본 논문에서는 UHF RFID 응용을 위한 새로운 NMOS 게이트 교차연결 전류미러형 브리지 정류기를 제시하였다. 제시된 정류기의 직류 변환 특성은 고주파 등가회로를 이용하여 해석하였으며, 주파수 증가에 따른 게이트 누설전류를 회로적인 방법으로 줄일 수 있는 게이트 커패시턴스 감소 기법을 이론적으로 제시하였다. 구해진 결과, 제안한 정류기는 기존의 게이트 교차 연결형 정류기와 거의 같은 직류 출력전압 특성을 보이면서도, 게이트 누설전류가 1/4 이하로 감소하고, 부하저항에서의 소비전력도 30% 이상 감소하며, 부하저항의 변화에 대해 보다 안정적인 직류전압을 공급함을 알 수 있었다. 또한 제안한 정류기는 13.56MHz의 HF(for ISO 18000-3)부터 915MHz의 UHF(for ISO 18000-6) 및 2.45GHz의 마이크로파 대역 (for ISO 18000-4)까지의 전 주파수 범위에 대해 충분히 높고 잘 정류된 직류 변환 특성을 보여 특정 주파수 대역을 사용하는 다양한 RFID 시스템의 트랜스폰더 칩 구동을 위한 범용 정류기로 사용될 수 있다.

• 한국전기전자재료학회논문지
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• 제11권6호
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• pp.428-435
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• 1998

SOI-like-bulk CMOS device is proposed, which having the advantages of SOI(Silicon On Insulator) and protects short channel effects efficiently with adding partial epitaxial process at standard CMOS process. SOI-like-bulk NMOS and PMOS with 0.25${\mu}{\textrm}{m}$ gate length have designed and optimized through analyzing the characteristics of these devices and applying again to the design of processes. The threshold voltages of the designed NMOS and PMOS are 0.3[V], -0.35[V] respectively and those have shown the stable characteristics under 1.5[V] gate and drain voltages. The leakage current of typical bulk-CMOS increase with shortening the channel length, but the proposed structures on this a study reduce the leakage current and improve the subthreshold characteristics at the same time. In addition, subthreshold swing value, S is 70.91[mV/decade] in SOI-like-bulk NMOS and 63.37[mV/ decade] SOI-like-bulk PMOS. And the characteristics of SOI-like-bulk CMOS are better than those of standard bulk CMOS. To validate the circuit application, CMOS inverter circuit has designed and transient & DC transfer characteristics are analyzed with mixed mode simulation.

• 한국산학기술학회논문지
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• 제9권2호
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• pp.333-338
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• 2008

본 논문에서는 유효한 DC 전압을 얻기 위해 요구되는 최소입력전압이 충분히 낮으면서도 소비전력이 기존의 정류기 보다 낮은 새로운 NMOS 전류미러형 브리지 정류기를 제안하였다. 설계된 정류기는 13.56 MHz의 HF (for ISO 18000-3)부터 915 MHz의 UHF (for ISO 18000-6) 및 2.45 GHz의 마이크로파 대역 (for ISO 18000-4)까지의 전 주파수 범위에 대해 RFID Transponder에 내장된 마이크로 칩을 구동하기에 충분히 높고 잘 정류된 직류전압을 공급할 수 있다. 제안된 NMOS 정류기의 출력특성은 고주파 등가회로를 이용하여 해석하였으며, 동작 주파수 종가에 따른 게이트 누설전류를 효과적으로 감소시킬 수 있는 회로적 방법을 이론적으로 제시하였다. 이러한 방법을 사용하여 설계된 NMOS 전류미러형 브리지 정류기는 3V 피크-투-피크 입력전압과 $45\;K{\Omega}$ 부하저항에서 $100\;{\mu}W$의 소비전력 특성과 2.13V의 DC 출력전압이 구해졌다. 제안된 NMOS 전류미러형 브리지 정류기는 기존의 정류기에 비해 UHF 및 마이크로파 대역에서도 안정적으로 동작하며, 보다 우수한 특성들을 보였다.

• JSTS:Journal of Semiconductor Technology and Science
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• 제1권2호
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• pp.103-110
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• 2001

Gate oxide scaling for sub-l00nm CMOS devices has been studied. Issues on the gate oxide scaling are reviewed, which are boron penetration, reliability, and direct tunneling leakage currents. Reliability of Sub-2.0nm oxides and the device performance degradation due to boron penetration are investigated. Especially, the effect of gate leakage currents on the transistor characteristics is studied. As a result, it is proposed that thinner oxides than previous expectations may be usable as scaling proceeds. Based on the gate oxide thickness optimization process we have established, high performance CMOS transistors of $L_{gate}=70nm$ and $T_{ox}=1.4nm$ were fabricated, which showed excellent current drives of $860\mu\textrm{A}/\mu\textrm{m}$ (NMOS) and $350\mu\textrm{A}/\mu\textrm{m}$ (PMOS) at $I_{off}=10\mu\textrm{A}/\mu\textrm{m}$ and $V_dd=1.2V$, and CV/I of 1.60ps (NMOS) and 3.32ps(PMOS).

• JSTS:Journal of Semiconductor Technology and Science
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• 제7권2호
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• pp.67-75
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• 2007

To improve low sense margin at low voltage, we propose a negatively driven sensing (NDS) scheme and to solve the problem of WL-to-BL short leakage fail, a variable bitline reference scheme with free-level precharged bitline (FLPB) scheme is adopted. The influence of the threshold voltage offset of NMOS and PMOS transistors in a latch type sense amplifier is very important factor these days. From evaluating the sense amplifier offset voltage distribution of NMOS and PMOS, it is well known that PMOS has larger distribution in threshold voltage variation than that of NMOS. The negatively-driven sensing (NDS) scheme enhances the NMOS amplifying ability. The offset voltage distribution is overcome by NMOS activation with NDS scheme first and PMOS activation followed by time delay. The sense amplifier takes a negative voltage during the sensing and amplifying period. The negative voltage of NDS scheme is about -0.3V to -0.6V. The performance of the NDS scheme for DRAM at the gigabit level has been verified through its realization on 1-Gb DDR2 DRAM chip.

• 대한전자공학회논문지
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• 제26권10호
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• pp.1606-1616
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• 1989

In this paper, the design of DYNAMIC CMOS ARRAY LOGIC which has both advantages of dynamic CMOS and array logic circuits is proposed. The major components of DYNAMIC CMOS ARRAY LOGIC are two-stage dunamic CMOS circuits and an internal clock generator. The function block of dynamic CMOS circuits is realized as a parallel interconnection of NMOS transistors. Therefore the operating speed of DYNAMIC CMOS ARRAY LOGIC is much faster than the one of the conventional dynamic CMOS PLAs and static CMOS PLA. Also, the charge redistribution problem by internl delay is solved. The internal clock generator generates four internal clocks that drive all the dynamic CMOS circuits. During evaluation, two clocks of them are delayed as compared with others. Therefore the race problem is completoly eliminated. The internal clock generator also prevents the reduction of circuit output voltage and noise margin due to leakage current and charge coupling without any penalty in circuit operating speed or chip area utilization.

• IEIE Transactions on Smart Processing and Computing
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• 제3권6호
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• pp.410-415
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• 2014

This paper presents a new rectifier with a bootstrapping technique to reduce the effective drop voltage. An all-digital delay locked loop (ADDLL) circuit was also applied to prevent the reverse leakage current. The proposed rectifier uses NMOS diode connected instead of PMOS to reduce the design size and improve the frequency respond. All the sub-circuits of ADDLL were designed with low power consumption to reduce the total power of the rectifier. The rectifier was implemented in CMOS $0.35{\mu}m$ technology. The peak power conversion efficiency was 76 % at an input frequency of 6.78MHz and a power level of 5W.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 춘계학술대회 논문집 반도체 재료 센서 박막재료 전자세라믹스
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• pp.9-12
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• 2004

This paper investigated the stability of Ta-Mo alloy on thin gate dielectric. Ta-Mo alloy was deposited by using co-sputtering process after thermal growing of 3.4nm and 4.2nm silicon dioxide. When the sputtering power of Ta and Mo were 100W and 70W, respectively, the suitable work function for NMOS gate electrode, 4.2eV, could obtain. To prove interface thermal stability of thin film gate dielectric and Ta-Mo alloy, rapid thermal annealing was performed at $600^{\circ}C$ and $700^{\circ}C$ for 10sec in Ar ambient. The results of interface reaction were surveyed by change of silicon dioxide thickness and work function after annealing process. Also, the reliability of alloy gate and gate dielectric could be confirmed by quantity of leakage current. Ta-Mo alloy was showed low sheet resistance and thermal stability, namely, little change of gate dielectric and work function, after $700^{\circ}C$ annealing process.