• ETRI Journal
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• v.31 no.6
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• pp.725-731
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• 2009

In this paper, electrostatic discharge (ESD) protection circuits with an advanced substrate-triggered NMOS and a gate-substrate-triggered NMOS are proposed to provide low trigger voltage, low leakage current, and fast turn-on speed. The proposed ESD protection devices are designed using 0.13 ${\mu}m$ CMOS technology. The experimental results show that the proposed substrate-triggered NMOS using a bipolar transistor has a low trigger voltage of 5.98 V and a fast turn-on time of 37 ns. The proposed gate-substrate-triggered NMOS has a lower trigger voltage of 5.35 V and low leakage current of 80 pA.

• JSTS:Journal of Semiconductor Technology and Science
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• v.13 no.4
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• pp.402-409
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• 2013

An innovative application of voltage-contrast (VC) inspection allowed inline detection of NMOS leakage in dense SRAM cells is presented. Cell sizes of SRAM are continual to do the shrinkage with bit density promotion as semiconductor technology advanced, but the resulting challenges include not only development of smaller-scale devices, but also intra-devices isolation. The NMOS leakage caused by the underneath n+/P-well shorted to the adjacent PMOS/N-well was inspected by the proposed electron-beam (e-beam) scan in which VC images were compared during the in-line process step of post contact tungsten (W) CMP (Chemical Mechanical Planarization) instead of end-of-line electrical test, which has a long response time. A series of experiments based on the mechanism for improving the intra-well isolation was performed and verified by the inline VC inspection. An optimal process-integration condition involved to the tradeoff between the implant dosage and photo CD was carried out.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.6
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• pp.10-15
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• 2008

In this paper, a new NMOS gate cross-connected current-mirror type bridge rectifier for UHF RFID applications is presented. The DC converting characteristics of the proposed rectifier are analyzed with the high frequency equivalent circuit and the gate capacitance reduction technique for reducing the gate leakage current due to the increasing of operating frequency is also proposed theoretically by circuitry method. As the results, the proposed rectifier shows nearly same DC output voltages as the existing NMOS gate cross-connected rectifier, but it shows the gate leakage current reduced to less than 1/4 and the power consumption reduced more than 30% at the load resistor, and it shows more stable DC supply voltages for the valiance of load resistance. In addition, the proposed rectifier shows high enough and well-rectified DC voltages for the frequency range of 13.56MHz HF(for ISO 18000-3), 915MHz UHF(for ISO 18000-6), and 2.45 GHz microwave(for ISO 18000-4). Therefore, the proposed rectifier can be used as a general purpose one to drive RFID transponder chips on various RFID systems which use specified frequencies.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.6
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• pp.428-435
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• 1998

SOI-like-bulk CMOS device is proposed, which having the advantages of SOI(Silicon On Insulator) and protects short channel effects efficiently with adding partial epitaxial process at standard CMOS process. SOI-like-bulk NMOS and PMOS with 0.25${\mu}{\textrm}{m}$ gate length have designed and optimized through analyzing the characteristics of these devices and applying again to the design of processes. The threshold voltages of the designed NMOS and PMOS are 0.3[V], -0.35[V] respectively and those have shown the stable characteristics under 1.5[V] gate and drain voltages. The leakage current of typical bulk-CMOS increase with shortening the channel length, but the proposed structures on this a study reduce the leakage current and improve the subthreshold characteristics at the same time. In addition, subthreshold swing value, S is 70.91[mV/decade] in SOI-like-bulk NMOS and 63.37[mV/ decade] SOI-like-bulk PMOS. And the characteristics of SOI-like-bulk CMOS are better than those of standard bulk CMOS. To validate the circuit application, CMOS inverter circuit has designed and transient & DC transfer characteristics are analyzed with mixed mode simulation.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.9 no.2
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• pp.333-338
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• 2008

In this paper, a new NMOS current-mirror type bridge rectifier for driving RFID chips, whose minimum input voltage required to obtain the effective DC output voltage is low enough and whose power dissipation can be reduced than that of conventional one, is proposed. The designed rectifier is able to supply high enough and well-rectified DC voltages to drive RFID transponder chips for the frequency range of 13.56 MHz HF(for ISO 18000-3), 915 MHz UHF(fur ISO 18000-6), and 2.45 GHz microwave(for ISO 18000-4). Output characteristics of the proposed rectifier are analyzed with the high frequency equivalent circuit. And the circuitry method for effective reducing of the gate leakage current due to the increasing of operating frequency is also proposed theoretically. Using this method, the power consumption of $100\;{\mu}W$ and the DC output voltage of 2.13V for 3V peak-to-peak input voltage and $45\;K{\Omega}$ load resistance are obtained. Compared to conventional one, the proposed rectifier operates in more stable and shows superior characteristics in UHF and microwave frequencies.

• JSTS:Journal of Semiconductor Technology and Science
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• v.1 no.2
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• pp.103-110
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• 2001

Gate oxide scaling for sub-l00nm CMOS devices has been studied. Issues on the gate oxide scaling are reviewed, which are boron penetration, reliability, and direct tunneling leakage currents. Reliability of Sub-2.0nm oxides and the device performance degradation due to boron penetration are investigated. Especially, the effect of gate leakage currents on the transistor characteristics is studied. As a result, it is proposed that thinner oxides than previous expectations may be usable as scaling proceeds. Based on the gate oxide thickness optimization process we have established, high performance CMOS transistors of $L_{gate}=70nm$ and $T_{ox}=1.4nm$ were fabricated, which showed excellent current drives of $860\mu\textrm{A}/\mu\textrm{m}$ (NMOS) and $350\mu\textrm{A}/\mu\textrm{m}$ (PMOS) at $I_{off}=10\mu\textrm{A}/\mu\textrm{m}$ and $V_dd=1.2V$, and CV/I of 1.60ps (NMOS) and 3.32ps(PMOS).

• JSTS:Journal of Semiconductor Technology and Science
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• v.7 no.2
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• pp.67-75
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• 2007

To improve low sense margin at low voltage, we propose a negatively driven sensing (NDS) scheme and to solve the problem of WL-to-BL short leakage fail, a variable bitline reference scheme with free-level precharged bitline (FLPB) scheme is adopted. The influence of the threshold voltage offset of NMOS and PMOS transistors in a latch type sense amplifier is very important factor these days. From evaluating the sense amplifier offset voltage distribution of NMOS and PMOS, it is well known that PMOS has larger distribution in threshold voltage variation than that of NMOS. The negatively-driven sensing (NDS) scheme enhances the NMOS amplifying ability. The offset voltage distribution is overcome by NMOS activation with NDS scheme first and PMOS activation followed by time delay. The sense amplifier takes a negative voltage during the sensing and amplifying period. The negative voltage of NDS scheme is about -0.3V to -0.6V. The performance of the NDS scheme for DRAM at the gigabit level has been verified through its realization on 1-Gb DDR2 DRAM chip.

• Journal of the Korean Institute of Telematics and Electronics
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• v.26 no.10
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• pp.1606-1616
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• 1989

In this paper, the design of DYNAMIC CMOS ARRAY LOGIC which has both advantages of dynamic CMOS and array logic circuits is proposed. The major components of DYNAMIC CMOS ARRAY LOGIC are two-stage dunamic CMOS circuits and an internal clock generator. The function block of dynamic CMOS circuits is realized as a parallel interconnection of NMOS transistors. Therefore the operating speed of DYNAMIC CMOS ARRAY LOGIC is much faster than the one of the conventional dynamic CMOS PLAs and static CMOS PLA. Also, the charge redistribution problem by internl delay is solved. The internal clock generator generates four internal clocks that drive all the dynamic CMOS circuits. During evaluation, two clocks of them are delayed as compared with others. Therefore the race problem is completoly eliminated. The internal clock generator also prevents the reduction of circuit output voltage and noise margin due to leakage current and charge coupling without any penalty in circuit operating speed or chip area utilization.

• IEIE Transactions on Smart Processing and Computing
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• v.3 no.6
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• pp.410-415
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• 2014

This paper presents a new rectifier with a bootstrapping technique to reduce the effective drop voltage. An all-digital delay locked loop (ADDLL) circuit was also applied to prevent the reverse leakage current. The proposed rectifier uses NMOS diode connected instead of PMOS to reduce the design size and improve the frequency respond. All the sub-circuits of ADDLL were designed with low power consumption to reduce the total power of the rectifier. The rectifier was implemented in CMOS $0.35{\mu}m$ technology. The peak power conversion efficiency was 76 % at an input frequency of 6.78MHz and a power level of 5W.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.04b
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• pp.9-12
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• 2004

This paper investigated the stability of Ta-Mo alloy on thin gate dielectric. Ta-Mo alloy was deposited by using co-sputtering process after thermal growing of 3.4nm and 4.2nm silicon dioxide. When the sputtering power of Ta and Mo were 100W and 70W, respectively, the suitable work function for NMOS gate electrode, 4.2eV, could obtain. To prove interface thermal stability of thin film gate dielectric and Ta-Mo alloy, rapid thermal annealing was performed at $600^{\circ}C$ and $700^{\circ}C$ for 10sec in Ar ambient. The results of interface reaction were surveyed by change of silicon dioxide thickness and work function after annealing process. Also, the reliability of alloy gate and gate dielectric could be confirmed by quantity of leakage current. Ta-Mo alloy was showed low sheet resistance and thermal stability, namely, little change of gate dielectric and work function, after $700^{\circ}C$ annealing process.