• 한국진공학회:학술대회논문집
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• 한국진공학회 2002년도 제23회 학술발표회 초록집
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• pp.110-110
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• 2002

• 대한전기학회:학술대회논문집
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• 대한전기학회 2011년도 제42회 하계학술대회
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• pp.1473-1474
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• 2011

박막트랜지스터(Thin Film Transistor: TFT)의 게이트 절연층 에서는 박막의 전계강도, 고유전율 및 우수한 표면 특성이 요구된다. HD-PECVD(High Density - Plasma Enhanced Chemical Vapor Deposition)를 이용하여 $NH_3$ 유량 및 기판 온도를 변화시키면서 SiN 박막을 제작하고, 표면특성을 AFM 으로, CONTACT ANGLE로 접촉각을 측정하여 Young's Equation 으로 Surface Energy를 계산하였고 전기적 특성은 MIM 구조를 제작하고 C-V 측정을 하여 조사하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1993년도 추계학술대회 논문집
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• pp.97-102
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• 1993

According as the high integrity of the semi conductor devices is definited required, the concern on the multi-layered wiring, and three-dimensional devices is growing these days. Therefore, plasma-enhanced chemical vapored deposition(PECVD) enables low-teperature process and is widely used, but it causes the instability of the devices due to a lot of impurities within the film. The PECVD oxynitride was formed by changing the gas ratio of (N$_2$O) to (N$_2$+NH$_3$). It's contained a small portion of hydrogen, had higher refrctive index and capacitance than oxide, and showed the capacitance increasement and the chemical stabi1ity. This is caused by nitrogen distribution increase of the interface lather than within the film.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집 Vol.3 No.2
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• pp.964-967
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• 2002

The effectiveness of silicon nitride SiNx surface passivation is investigated and quantified. This study adopted single-layer antireflection (SLAR) coating of SiNx for efficiency improvement of solar cell. The silicon nitride films were deposited by means of plasma enhanced chemical vapor deposition (PECVD) in planar coil reactor. The process gases used were pure ammonia and a mixture of silane and helium. The thickness and the refractive index on the films were measured by ellipsometry and chemical bonds were determined by using an FT-IR equipment. This films obtained were analyzed in term of hydrogen content, refractive index for gas flow ratio $(NH_3/SiH_4)$, and efficiency of solar cell. The polycrystalline silicon solar cells passivated by silicon nitride shows efficiency above 12.8%.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.230.1-230.1
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• 2014

대면적 그래핀의 높은 제조비용과 낮은 생산성으로 인해 최근 산화그래핀(GO)을 박리하여 대면적화 하는 연구가 활발히 진행되고 있다. 하지만, Hummers 법에 의해 제조된 산화그래핀은 제조공정상 발생되는 황이나 수소 및 산소 등의 불순물에 의한 특성저하와 15층에서 25층 정도의 다층 구조에 의한 높은 접촉저항 때문에 그래핀 고유의 특성 발휘가 어렵다. 본 연구에서는 DC 열 플라즈마의 NH3 방전을 이용하여 산화그래핀의 불순물인 S, H, O를 완전히 제거하였고, DC 열 플라즈마 처리된 후의 산화그래핀의 Volume을 평균 2.5배정도 증가시켰다. 또한 N2와 He을 혼합 시킨 DC 열 플라즈마 방전으로 산화그래핀 표면에 N 을 도핑 하여 전기적 특성을 향상시켰다. N 도핑 농도는 최대 20wt%이었으며 N2과 He공급량, Current 조절에 의해 Dopping 농도를 제어하였다.

• 한국반도체및디스플레이장비학회:학술대회논문집
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• 한국반도체및디스플레이장비학회 2006년도 춘계학술대회
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• pp.211-215
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• 2006

평면 광도파로 코어로 사용되는 SiON (Silicon oxynitride)과 클래딩으로 사용되는 $SiO_2$ (Silicon oxide)의 굴절률 차이가 2.5 %인 고굴절률차 평면 광도파로용 SiON 박막을 PECVD (plasma enhanced chemical vapor deposition)로 제작하였다. PECVD에 사용된 가스는 $SiH_4,\;NH_3,\;N_{2}O$이고, Si 기판의 $SiO_2$ 막은 100 nm이다. 가스의 비율에 따라 SiON 막의 굴절률은 633 nm의 파장에서 1.476에서 1.777까지 변화하였다. 코어로 사용되는 SiON의 두께는 $2.5{\mu}m$이고 클래딩과의 굴절률 차이는 2.5 %였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.200-201
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• 2008

태양전지 제작 시 반사방지막(Anti-reflection Coating)이 태양전지 효율에 미치는 영향을 알아보기 위한 실험으로 최적의 가스비를 알아보기 위하여 Plasma Enhanced Chemical Vapor Deposition(PECVD)를 이용한 Silicon nitride 증착 실험이다. SiH4 가스를 45 sccm으로 고정시킨 상태에서 NH3를 25,45,60,90,135 sccm으로 가변하여 Carrier Lifetime과 Refractive index를 측정하였다. PECVD의 조건은 기판온도 $450^{\circ}C$, Chamber 압력 1 Torr, 증착두께 $1000\AA$으로 고정하였다. 증착 후 500, 600, 700, $800^{\circ}C$로 열처리를 하고나서 Carrier Lifetime을 측정하여 열처리에 대한 효과도 알아보았다.

• 반도체디스플레이기술학회지
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• 제21권2호
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• pp.45-50
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• 2022

The etching with high selectivity of silicon dioxide over silicon nitride is essential in semiconductor fabrication, and gas phase etch (GPE) can increase the competitiveness of the selective dielectric etch. In this work, GPE of plasma enhanced chemical vapor deposited SiO₂ was performed, and the effects of process parameters, such as temperature, partial pressure ratio, and gas supply cycle, are investigated in terms of etch rate and within wafer uniformity. Employing multiple regression analysis, the importance of each parameter elements is analyzed.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.68-68
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• 2011

As feature size is smaller, new technology are needed in semiconductor factory such as gap-fill technology for sub 100nm, development of ALD equipment for Cu barrier/seed, oxide trench etcher technology for 25 nm and beyond, development of high throughput Cu CMP equipment for 30nm and development of poly etcher for 25 nm and so on. We are focus on gap-fill technology for sub-30nm. There are many problems, which are leaning, over-hang, void, micro-pore, delaminate, thickness limitation, squeeze-in, squeeze-out and thinning phenomenon in sub-30 nm gap fill. New gap-fill processes, which are viscous oxide-SOD (spin on dielectric), O3-TEOS, NF3 Based HDP and Flowable oxide have been attempting to overcome these problems. Some groups investigated SOD process. Because gap-fill performance of SOD is best and process parameter is simple. Nevertheless these advantages, SOD processes have some problems. First, material cost is high. Second, density of SOD is too low. Therefore annealing and curing process certainly necessary to get hard density film. On the other hand, film density by Flowable oxide process is higher than film density by SOD process. Therefore, we are focus on Flowable oxide. In this work, dielectric film were deposited by PECVD with TSA(Trisilylamine - N(SiH3)3) and NH3. To get flow-ability, the effect of plasma treatment was investigated as function of O2 plasma power. QMS (quadruple mass spectrometry) and FTIR was used to analysis mechanism. Gap-filling performance and flow ability was confirmed by various patterns.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.167-167
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• 2011

Magnetic random access memory (MRAM) is one of the prospective semiconductor memories for next generation. It has the excellent features including nonvolatility, fast access time, unlimited read/write endurance, low operating voltage, and high storage density. MRAM consists of magnetic tunnel junction (MTJ) stack and complementary metal-oxide semiconductor (CMOS). The MTJ stack is composed of various magnetic materials, metals, and a tunneling barrier layer. For the successful realization of high density MRAM, the etching process of magnetic materials should be developed. Among various magnetic materials, FePt has been used for pinned layer of MTJ stack. The previous etch study of FePt magnetic thin films was carried out using $CH_4/O_2/NH_3$. It reported only the etch characteristics with respect to the variation of RF bias powers. In this study, the etch characteristics of FePt thin films have been investigated using an inductively coupled plasma reactive ion etcher in various etch chemistries containing $CH_4$/Ar and $CH_4/O_2/Ar$ gas mixes. TiN thin film was employed as a hard mask. FePt thin films are etched by varying the gas concentration. The etch characteristics have been investigated in terms of etch rate, etch selectivity and etch profile. Furthermore, x-ray photoelectron spectroscopy is applied to elucidate the etch mechanism of FePt thin films in $CH_4$/Ar and $CH_4/O_2/Ar$ chemistries.