• 제목/요약/키워드: N deposition

검색결과 2,148건 처리시간 0.027초

펄스형 DC PACVD 법에의해 미치는 공정인자의 영향 (The Effect of Processing Parameters on the Mechanical Properties of TiN Films by the Pulsed DC PACVD)

  • 김진관;변응선;백운승;이구현;제창웅;윤재홍;이상로
    • 한국표면공학회지
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    • 제30권5호
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    • pp.298-309
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    • 1997
  • Hard Tin coating on tool steel substrate were prepared using the pulsed PACVE. An orthogonal experimental design was employed to find the best deposition conditions for TiN coating and to systematically understand the effect of processing parameters. The small size Taguchi matrix called the L16 was used for experiment and ANOVA(ANalysis of VAriance) was followed to study the effect of main parameters on hardness and adhesion TiN coatings. In conclusion, pulse on/off time ratio and pulsing frequency were the major deposition parameters to determine hardness and adhesion of TiN coating in the pulsed DC PACVE process. (200) preferred orientation, columnar growth and dome-shaped surface morphology of the TiN films gave rise to a high hardness and a good adhesion to the substrates.

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NEW PROGRESS IN TiN-BASED PROTECTIVE COATINGS DEPOSITED BY ARC ION PLATING

  • Huang, R.F.;Wen, L.S.
    • 한국표면공학회지
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    • 제32권3호
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    • pp.265-275
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    • 1999
  • Titanium nitride and related overlayers produced by arc ion plating (AIP) are applied as commercial coatings in world-wide scale since the middle of 80s. Due to the achievements of low temperature deposition (LTD), they begin now to be used as wear and corrosion-resistant coatings for machine parts, besides applications on cemented carbide and high speed steel cutting tools. On the other side, TiN can be now applied successfully to brass, Al-alloy, ZnAl alloy articles as decorative coating through LTD. Various nitrides, carbonitrides, borides and other refractory compounds, such as (Ti, Al)N, TiCN, CrN, are used as the coatings for special heavy-duty working conditions instead of TiN since 90s. More and more multilayer coatings are applied now substituting single layer ones. Duplex processes are under development.

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Growth of InGaN/GaN Multiple Quantum Wells by Metalorganic Chemical Vapor Deposition and Their Structural and Optoelectronic Properties

  • Kim, H.J.;Kwon, S.-Y.;Yim, S.;Na, H.;Kee, B.;Yoon, E.
    • Journal of Korean Vacuum Science & Technology
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    • 제6권2호
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    • pp.88-91
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    • 2002
  • InGaN/GaN multiple quantum wells (MQWs) were grown by metalorganic chemical vapor deposition and their structural and optical properties were studied. When the average In content was increased by increasing TMIn flow rate, PL measurement showed little change in PL peak position and large increase in PL intensity instead. Large changes in PL peak position could be achieved by changing growth temperature. We propose the formation of fixed In content, highly In-rich quantum dot-like phases in InGaN MQWs driven by spinodal decomposition.

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In-situ SiN 박막을 이용하여 성장한 GaN 박막 및 LED 소자 특성 연구 (A Study of Properties of GaN and LED Grown using In-situ SiN Mask)

  • 김덕규;유인성;박춘배
    • 한국전기전자재료학회논문지
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    • 제18권10호
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    • pp.945-949
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    • 2005
  • We have grown GaN layers with in-situ SiN mask by metal organic chemical vapor deposition (MOCVD) and study the physical properties of the GaN layer. We have also fabricate PN junction light emitting diode (LED) to investigate the effect of the SiN mask on its optical property By inserting a SiN mask, (102) the full width at half maximum (FWHM) decreased from 480 arcsec to 409 arcsec and threading dislocation (TD) density decreased from $3.21{\times}10^9\;cm^{-2}$ to $9.7{\times}10^8\;cm^{-2}$. The output power of the LED with a SiN mask increased from 198 mcd to 392 mcd at 20 mA. We have thus shown that the SiN mask improved significantly the physical and optical properties of the GaN layer.

Cu 금속배선을 위한 카본-질소-텅스텐 확산방지막 특성 (Characteristics of W-C-N Thin Diffusion Barrier for Cu Interconnection)

  • 이창우
    • 마이크로전자및패키징학회지
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    • 제12권4호통권37호
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    • pp.345-349
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    • 2005
  • 300 mW-cm의 낮은 비저항을 갖는 카본-질소$\_$텅스텐 (W-C-N) 확산방지막을 원자층 증착법으로 제조하였으며, 반응기체로 $WF_6-N_2-CH_4$를 사용하였다. $N_2$$CH_4$ 반응기체를 주입 할 때는 고주파 펄스를 인가하여 플라즈마에 의한 반응물의 분리가 일어나도록 하였다. 다층금속배선에 사용하는 층간 절연층 (TEOS) 위에서 W-C-N 박막은 원자층 증착기구를 따르며, 10에서 100 사이클 동안 증착율이 0.2nm/cycles 로 일정한 값을 가진다. 또한 Cu 배선을 위한 확산방지막으로써 W-C-N 박막은 비정질 상을 가지며, $800^{\circ}C$에서 30분간 열처리해도 Cu의 확산을 충분히 방지할 수 있음을 확인하였다.

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Electrophoretic Deposition for the Growth of Carbon nanofibers on Ni-Cu/C-fiber Textiles

  • Nam, Ki-Mok;Mees, Karina;Park, Ho-Seon;Willert-Porada, Monika;Lee, Chang-Seop
    • Bulletin of the Korean Chemical Society
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    • 제35권8호
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    • pp.2431-2437
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    • 2014
  • In this study, Ni, Ni-Cu and Ni/Cu catalysts were deposited onto C-fiber textiles via the electrophoretic deposition method, and the growth characteristics of carbon nanofibers on the deposited catalyst/C-fiber textiles were investigated. The catalyst deposition onto C-fiber textiles was accomplished by immersing the C-fiber textiles into Ni or Ni-Cu mixed solutions, producing the substrate by post-deposition of Ni onto C-fiber textiles with pre-deposited Cu, and passing it through a gas mixture of $N_2$, $H_2$ and $C_2H_4$ at $700^{\circ}C$ to synthesize carbon nanofibers. For analysis of the characteristics of the synthesized carbon nanofibers and the deposition pattern of catalysts, SEM, EDS, BET, XRD, Raman and XPS analysis were conducted. It was found that the amount of catalyst deposited and the ratio of Ni deposition in the Ni-Cu mixed solution increased with an increasing voltage for electrophoretic deposition. In the case of post-deposition of Ni catalyst onto substrates with pre-deposited Cu, both bimetallic catalyst and carbon nanofibers with a high level of crystallizability were produced. Carbon nanofibers yielded with the catalyst prepared in Ni and Ni-Cu mixed solutions showed a Y-shaped morphology.

Deposition Pressure Dependent Electric Properties of (Hf,Zr)O2 Thin Films Made by RF Sputtering Deposition Method

  • Moon, S.E.;Kim, J.H.;Im, J.P.;Lee, J.;Im, S.Y.;Hong, S.H.;Kang, S.Y.;Yoon, S.M.
    • Journal of the Korean Physical Society
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    • 제73권11호
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    • pp.1712-1715
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    • 2018
  • To study the applications for ferroelectric non-volatile memory and ferroelectric memristor, etc., deposition pressure dependent electric the properties of $(Hf,\;Zr)O_2$ thin films by RF sputtering deposition method were investigated. The bottom electrode was TiN thin film to produce stress effect on the formation of orthorhombic phase and top electrode was Pt thin film by DC sputtering deposition. Deposition pressure was varied along with the same other deposition conditions, for example, sputtering power, target to substrate distance, post-annealing temperature, annealing gas, annealing time, etc. The structural and electric properties of the above thin films were investigated. As a result, it is confirmed that the electric properties of the $(Hf,\;Zr)O_2$ thin films depend on the deposition pressure which affects structural properties of the thin films, such as, structural phase, ratio of the constituents, etc.

PECVD를 이용한 ZnO박막 증착시 증착 변수가 증착속도 및 결정 구조에 미치는 영향 (The Effects of Deposition Conditions on Deposition Rate and Crystallinity of ZnO Thin Films Deposited by PECVD)

  • 김영진;김형준
    • 한국재료학회지
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    • 제4권1호
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    • pp.90-96
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    • 1994
  • 플라즈마 CVD(PECVFD)장치로 금속유기물인 Diethylzinc와 $N_{2}O$를 합성하여 $300^{\circ}C$이하의 낮은 기판 온도에서 ZnO 박막을 증착하여, 증착변수가 박막의 증착속도 및 결정구조에 미치는 영향을 알아 보았다. 기판 온도 $150^{\circ}C$에서부터 이미 결정화된 ZnO 박막의 증착이 가능했으며, $200^{\circ}C$이상에서 X-ray rocking curve분석결과, 표준편차값($\delta$)이 6˚ 미만의 c축 배향성이 뛰어난 ZnO박막이 유리 기판위에 증착되었다. 기판온도오 인가된 rf전력에 의한 증착속도의 변화 양상은 매우 다양하였으며, 특히 결정화에 따른 증착속도 변화의 전이점이 관찰되었다. 200 W와 250W의 rf 전력에서 증착된 박막의 경우 활성화 에너지는 각각 3.1 KJ/mol과 1.9 KJ/mol이었다.

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Polyimide 기판을 이용한 CVD-Cu 박막 형성기술 (Formation of CVD-Cu Thin Films on Polyimide Substrate)

  • 조남인;임종설;설용태
    • 한국산학기술학회논문지
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    • 제1권1호
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    • pp.37-42
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    • 2000
  • 유기금속 화학기상증착기술에 의해 폴리이미드 기판과 질화티탄 기판 위에 구리박막을 형성하였다. 구리박막을 화학기상증착기술에 의해 형성하면 종래의 물리적증착기술에 비하여 증착속도가 빠르고 층덮힘 성질이 좋아 산업체의 제품생산 응용에서 많은 장점이 있다. 이 장점은 제품의 생산성과 신뢰성에 영향을 미친다. 기판의 온도와 구리전구체 증기압력 조건을 변화시키며 반복실험을 실시하였으며, 시편에 따라서는 전기적 성질 향상을 위하여 후속 열처리를 수행하였다. 형성된 구리박막의 미세구조는 전자현미경으로 관찰하였으며, 전기비저항은 4점 프로브를 이용하여 측정하였다. 질화티탄을 기판으로 사용한 경우 구리박막에서는 섭씨 180도의 기판온도에서 만들어진 시편에서 가장 좋은 전기적 성질이 측정되었다. 한편, 폴리이미드 기판을 사용한 경우, 기상과 액상의 혼합상태 전구체를 이용하여 250 nm/min의 매우 높은 증착속도를 얻을 수 있었다.

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