• Journal of the Institute of Electronics and Information Engineers
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• v.50 no.2
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• pp.47-53
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• 2013

In this work, signal transmission properties of SATA connector have been improved using its differential impedance calculation and its design revision to closer impedance matching. Using 3 dimensional electromagnetic field simulator, the differential mode S-parameter was calculated to investigate its signal fidelity. The differential impedance is calculated from the equation of the odd mode impedance with inductance, capacitance, mutual inductance, and mutual capacitance. The differential impedance of SATA connector was calculated to be $107.3{\Omega}$ and did not meet the design specification with $100{\Omega}{\pm}5%$. In order to achieve its impedance range and improve its signal transmission properties, SATA connector's design has been revised with two different directions and analyzed through the calculation of differential impedance, differential reflection loss, and differential insertion loss.

• Journal of the Institute of Electronics and Information Engineers
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• v.54 no.7
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• pp.55-60
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• 2017

This paper is proposed on the transmit Method Finger-Printer Scanning of Mutual Capacitance Touch Screen Panel Using Differential Pulse for improving the security of computer information. This system is composed of differential pulse generator and Ring-Counter, also Supply voltage is 5V. this system generates the Pulse wave which is composed of In-Phase and Out of Phase at 1MHz while period of 2m/s. it is designed and be able to operate four channels. overall power consumption is approximately 78.08nW. This prototype is implemented in 0.25um CMOS Process and Chip area is $870um{\times}880um$.

• Journal of IKEEE
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• v.23 no.3
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• pp.1046-1053
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• 2019

In a multi-channel single-ended system, the far-end crosstalk (FEXT) due to mutual inductance and mutual capacitance between two adjacent channels critically limit the bandwidth. FEXT causes crosstalk-induced jitter (CIJ) and crosstalk-induced glitch (CIG) which leads to timing margin and voltage margin degradations, respectively. Therefore, FEXT must be compensated in order to increase eye opening and achieve high data-rate. It can be compensated in transmitter by controlling the timing of the data or reshaping the waveform of the signal. Also, FEXT can be compensated in receiver by generating mimicked FEXT using high-pass filter. In this paper, recent techniques to compensate FEXT are investigated, with discussions of their pros and cons.

• Transactions on Electrical and Electronic Materials
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• v.4 no.3
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• pp.5-9
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• 2003

In this paper, a layout-based CMOS RF model for RFIC's including the capacitance effect, the skin effect, and the proximity effect between metal lines on the Si surface is proposed for the first time for accurately predicting the RF behavior of CMOS devices. With these RF effects, the RF equivalent circuit model based on the layout of the multi-finger gate transistor is presented. The capacitances between metal lines on the Si surface are modeled with the layout. And the skin effect is modeled to the equivalent ladder circuit of metal line. The proximity effect is modeled by adding the mutual inductance between cross-coupled inductances in the ladder circuit representation. Compared to the BSIM 3v3 and other models, the proposed RF model shows better agreements with the measured data and shows well the frequency dependent behavior of devices in GHz ranges.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1996.11a
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• pp.265-269
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• 1996

In this paper, electric field interference was analyzed in the Printed Circuit Board to restrain the elcctromagnetic wave using Boundary Element Method and Finite Element Method. First, charge density distribution was simulated using Boundary Element Method and the characteristic impedance was caculated to restrain the reflex wave, and mutual capacitance was caculated in the multi-strip line PCB. Finally, electric field was simulated in the variable patterns using Finite Element Method. As a result, the optimal structure and characteristics of strip line was obtained and the imformations about the optimal design pattern could be obtained with the analysing the feild distribution.

• Proceedings of the Korean Society of Computer Information Conference
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• 2014.01a
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• pp.23-24
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• 2014

본 논문에서는 최근 모바일 기기에서 많이 사용되고 있는 마름모 패턴의 터치스크린패널(TSP; Touch Screen Pannel)에서 정확한 터치 위치를 획득하는 방법을 제안한다. 가로와 세로로 배치된 ITO 투명전극필름은 사용자의 터치로 인하여 변화된 정전용량(mutual capacitance)을 측정하여 터치위치를 파악한다. 그러나 터치패턴의 모양과 손가락의 크기에 따라서 측정되는 상호정전용량의 값에 차이가 발생하며 이 차이는 터치위치 계산에 영향을 미쳐서 정확한 터치위치를 획득하기 어렵게 한다. 이러한 결과로 TSP 상에서 직선을 그어도 측정된 터치 값은 S자 형태로 나타난다. 본 논문에서는 이러한 문제를 완화하기 위하여 Matlab 상에서 터치상황을 시뮬레이션하고 이를 이용하여 터치위치를 보상하여 보다 더 정확한 터치위치를 구하는 방법을 제안한다.

• Journal of Hydrogen and New Energy
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• v.26 no.2
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• pp.184-191
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• 2015

As the power electronics system increases the frequency, the power loss and thermal management are paid more attention. This research presents a real time model of dissipation power with junction temperature response for 120kw IGBT inverter which is applied to the thermal management of high power IGBT inverter. Since the computational time is critical for real time simulation, look-up tables of IGBT module characteristic curve are implemented. The power loss from IGBT provides a clue to calculate the temperature of each module of IGBT. In this study, temperature of each layer in IGBT is predicted by lumped capacitance analysis of layers with convective heat transfer. The power loss and temperature of layers in IGBT is then communicated due to mutual dependence. In the dynamic model, PWM pulses are employed to calculation real time IGBT and diode power loss. Under Matlab/Simulink$^{(R)}$ environment, the dynamic model is validated with experiment. Results showed that the dynamic response of power loss is closely coupled with effective thermal management. The convective heat transfer is enough to achieve proper thermal management under guideline temperature.

• Journal of Electrical Engineering and Technology
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• v.10 no.3
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• pp.983-989
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• 2015

Power transformer is one of the major and key apparatus in electric power system. Monitoring and diagnosis of transformer fault is necessary for improving the life period of transformer. The failures caused by short circuits are one of the causes of transformer outages. The short circuit currents induce excessive forces in the transformer windings which result in winding deformation affecting the mechanical and electrical characteristics of the winding. In the present work, a transformer producing only the radial flux under short circuit is considered. The corresponding axial displacement profile of the windings is computed using Finite Element Method based transient structural analysis and thus obtained displacements are compared with the experimental result. The change in inter disc capacitance and mutual inductance of the deformed windings due to different short circuit currents are computed using Finite Element Method based field analyses and the corresponding Sweep Frequency Responses are computed using the modified electrical equivalent circuit. From the change in the first resonant frequency, the winding movement can be quantified which will be useful for estimating the mechanical withstand capability of the winding for different short circuit currents in the design stage itself.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.40 no.8
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• pp.555-559
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• 2003

In this paper, a new CMOS RF model for RF IC design including the capacitance effect, the skin effect, and the proximity effect between metal lines on the Si surface is proposed for tile first time for accurately predicting the RF behavior of CMOS devices. The capacitances between metal lines on the Si surface are modeled with the layout. And the skin effect is modeled with a parallel branch added in equivalent circuit of metal line. The proximity effect is modeled by adding the mutual inductance between cross-coupled inductances in the ladder circuit representation. Compared to the BSIM 3v3. the proposed RF model shows good agreements with the measured data and shows well the frequency dependent behavior of devices in GHz ranges.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.24 no.4
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• pp.466-473
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• 2013

In this paper, a compact planar multi-loop self-resonant coil of high quality factor with a coaxial cross section is proposed for effective wireless charging. The proposed coil has high Q-factor and a resonant frequency of a coil can be easily controlled by adjusting distributed capacitance. For designing the coil, a self-inductance and a distributed capacitance are calculated theoretically. The self-inductance is calculated from the sum of the mutual energies between small circular loops that are made by dividing the cross section of the coil. To verify its properties and calculation results, the self-resonant coils are fabricated by using a coaxial cable with characteristic impedance of $50{\Omega}$. The measured frequencies are very consistent with the calculated ones. In addition, the resonant frequency can be adjusted slightly by the tuning parameter ${\gamma}$. The resonant coils are applied to a tablet PC, the Q-factors of the Tx and Rx resonant coils are 282 and 135, respectively. As a result of measurement when height between the two resonant coils is 4.4 cm, the power transfer efficiency is more than 80 % within a radius of 5 cm.