• Title/Summary/Keyword: Multi-material flow

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Optimal Design of Multiperiod Process-Inventory Network Considering Transportation Processes (수송공정을 고려한 다분기 공정-저장조 망구조의 최적설계)

  • Suh, Kuen-Hack;Yi, Gyeong-Beom
    • Journal of Institute of Control, Robotics and Systems
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    • v.18 no.9
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    • pp.854-862
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    • 2012
  • The optimal design of batch-storage network by using periodic square wave model provides analytical lot sizing equations for a complex supply chain network characterized as multi-supplier, multi-product, multi-stage, non-serial, multi-customer, cyclic system including recycling and/or remanufacturing. The network structure includes multiple currency flows as well as material flows. The processes are represented by multiple feedstock/product materials with fixed composition which are very suitable for production processes. In this study, transportation processes that carry multiple materials with unknown composition are added and the time frame is changed from single period into multiple periods in order to represent nonperiodic parameter variations. The objective function of the optimization involves minimizing the opportunity costs of annualized capital investments and currency/material inventories minus the benefit to stockholders in the numeraire currency. The expressions for the Kuhn-Tucker conditions of the optimization problem are reduced to a multiperiod subproblem for average flow rates and analytical lot-sizing equations. The multiperiod lot sizing equations are different from single period ones. The effects of corporate income taxes, interest rates and exchange rates are incorporated.

Contact oxide etching using $CHF_3/CF_4$ ($CHF_3/CF_4$를 사용한 콘택 산화막 식각)

  • 김창일;김태형;장의구
    • Electrical & Electronic Materials
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    • v.8 no.6
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    • pp.774-779
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    • 1995
  • Process optimization experiments based on the Taguchi method were performed in order to set up the optimal process conditions for the contact oxide etching process module which was built in order to be attached to the cluster system of multi-processing purpose. In order to compare with Taguchi method, the contact oxide etching process carried out with different process parameters(CHF$_{3}$/CF$_{4}$ gas flow rate, chamber pressure, RF power and magnetic field intensity). Optimal etching characteristics were evaluated in terms of etch rate, selectivity, uniformity and etched profile. In this paper, as a final analysis of experimental results the optimal etching characteristics were obtained at the process conditions of CHF3/CF4 gas flow rate = 72/8 sccm, chamber pressure = 50 mTorr, RF power = 500 watts, and magnetic field intensity = 90 gauss.

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Molecular Dynamics Simulations of Fullerene Nanostructure Fabrications by Atomic Force Microscope Carbon Nanotube tip (원자간력 현미경 탄소 나노튜브 팁을 이용한 플러렌 나노 구조물 제작에 관한 분자동역학 시뮬레이션)

  • 이준하;이홍주
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.17 no.8
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    • pp.812-822
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    • 2004
  • This paper shows that carbon nanotubes can be applied to a nanopipette. Nano space in atomic force microscope multi-wall carbon nanotube tips is filled with molecules and atoms with charges and then, the tips can be applied to nanopipette when the encapsulated media flow off under applying electrostatic forces. Since the nano space inside the tips can be refilled, the tips can be permanently used in ideal conditions of no chemical reaction and no mechanical deformation. Molecular dynamics simulations for nanopipette applications demonstrated the possibility of nano-lithography or single-metallofullerene-transistor array fabrication.

Mold-Flow Simulation in 3 Die Stack Chip Scale Packaging

  • Rhee Min-Woo
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2005.09a
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    • pp.67-88
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    • 2005
  • Mold-Flow 3 Die Stack CSP of Mold array packaging with different Gate types. As high density package option such as 3 or 4 die stacking technologies are developed, the major concerning points of mold related qualities such as incomplete mold, exposed wires and wire sweeping issues are increased because of its narrow space between die top and mold surface and higher wiring density. Full 3D rheokinetic simulation of Mold flow for 3 die stacking structure case was done with the rheological parameters acquired from Slit-Die rheometer and DSC of commercial EMC. The center gate showed severe void but corner gate showed relatively better void performance. But in case of wire sweeping related, the center gate type showed less wire sweeping than corner gate types. From the simulation results, corner gate types showed increased velocity, shear stress and mold pressure near the gate and final filling zone. The experimental Case study and the Mold flow simulation showed good agreement on the mold void and wire sweeping related prediction. Full 3D simulation methodologies with proper rheokinetic material characterization by thermal and rheological instruments enable the prediction of micro-scale mold filling behavior in the multi die stacking and other complicated packaging structures for the future application.

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CFD Analysis for the Design of a Venturi Tube-type Air Bubble Generator with Porous Material Throat (다공성 재질의 목을 가진 벤츄리 관 공기방울 발생장치의 설계를 위한 유동해석)

  • Yun, Jeong-Eui
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.40 no.10
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    • pp.667-672
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    • 2016
  • The goal of this study was to develop a venturi-type air bubble generator with a porous material throat. Using the two-phase multi-flow CFD analysis for the venturi tube, researchers determined the optimal design of major dimensions, such as the venturi throat length and diameter, in order to control the performance of the air bubble supply through the porous material throat in a venturi tube. Researchers then determined the relationship between the flow rate of supply water and the major design dimensions of the venturi-type air generator for maximizing the performance of the air bubble supply through the porous material throat in a venturi tube.

An empirical study on the material distribution decision making

  • Ko, Je-Suk
    • Journal of the Korean Data and Information Science Society
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    • v.21 no.2
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    • pp.355-361
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    • 2010
  • This paper addresses a mathematical approach to decision making in a real-world material distribution situation. The problem is characterized by a low-volume and highly-varied mix of products, therefore there is a lot of material movement between the facilities. This study focuses especially on the transportation scheduler with a tool that can be used to quantitatively analyze the volume of material moved, the type of truck to be used, production schedules, and due dates. In this research, we have developed a mixed integer programming problem using the minimum cost, multiperiod, multi-commodity network flow approach that minimizes the overall material movement costs. The results suggest that the optimization approach provides a set of feasible solution routes with the objective of reducing the overall fleet cost.

The Relationship between Grain Design and Non-uniform Ablation of Solid Rocket Insulation (추진제 형상과 연소관 단열재 불균일 삭마의 관계)

  • Kim, Jeongjin;Lee, Jungseob;Jin, Jungkun;Lee, Dohyung
    • Journal of the Korean Society of Propulsion Engineers
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    • v.24 no.2
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    • pp.28-34
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    • 2020
  • In order to relieve the burden of the rear ablative material, the combustion test of the solid rocket motor with the forward deployed multi-pin grain design was successfully performed twice. However, after disassembling the solid rocket motor, a non-uniform ablation pattern was found in the rear ablative material. Periodic repetition of local and regional ablation was measured precisely. Two-dimensional flow and eddy flow, created by the uneven main-pin flow hitting the rear ablative material, were identified as the cause of non-uniform ablation. In addition. when the rear pins were removed, the possibility of securing the soundness of the rear ablative material was confirmed as the average flow velocity and the standard deviation were lowered.

Rheological Perspectives on Direct Printing Processes

  • An, Gyeong-Hyeon
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2011.05a
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    • pp.1.2-1.2
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    • 2011
  • With recent advances in materials and products, materials processing experiences new challenges. More particles and polymers in material side and thinner and faster deformations in processing side. It happens in most emergying industries such as manufacturing of batteries, solar cells, multi-layer chips, displays, printed electronics, to list a few. In most cases, they are manufactured by coating or printing process, which is defined as a process in which gas is replaced by liquid on a substrate. In this sense, casting, inkjet printing, and roll-to-roll printing are all included. The printing process consists of three unit processes. As the materials used in the above mentioned applications typically contain a large amount of particles with polymers and solvents, they continuously change microstructures during preparation, flow, and even drying. However, little is known about the flow characteristics of such complex fluids and less is known about how to design and control the process. Therefore, for better control of the process and for better quality of the product, we need to understand the flow characteristics of these complex fluids under extremely fast flow environment.

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Growth and Properties of CrNx/TiNy/Al Based on N2 Gas Flow Rate for Solar Thermal Applications

  • Ju, Sang-Jun;Jang, Gun-Eik;Jang, Yeo-Won;Kim, Hyun-Hoo;Lee, Cheon
    • Transactions on Electrical and Electronic Materials
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    • v.17 no.3
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    • pp.146-149
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    • 2016
  • The CrN/TiN/Al thin films for solar selective absorber were prepared by dc reactive magnetron sputtering with multi targets. The binary nitride CrN layer deposited with change in N2 gas flow rates. The gas mixture of Ar and N2 was an important parameter during sputtering deposition because the metal volume fraction (MVF) was controlled by the N2 gas flow rate. In this study, the crystallinity and surface properties of the CrN/TiN/Al thin films were estimated by X-ray diffraction (XRD), atomic force microscopy (AFM) and field emission scanning electron microscopy (FESEM). The composition and depth profile of thin films were investigated using Auger electron spectroscopy (AES). The absorptance and reflectance with wavelength spectrum were recorded by UV-Vis-NIR spectrophotometry at a range of 300~1,100 nm.

A Study on Electro-deposited Multi-layered Diamond Tool for Grinding Sapphire Wafers (사파이어 절삭용 다층 전착 다이아몬드 공구에 대한 연구)

  • Lim, Goun;Song, William;Hong, Joo Wha
    • Journal of the Korean Society for Heat Treatment
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    • v.30 no.5
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    • pp.222-226
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    • 2017
  • Recently sapphire wafer has expected as smart phone cover material, however, brittle nature of sapphire needed edge grinding processes to prevent early initiation of cracks. Electro-deposited multi-layered groove tools with $35{\mu}m$ diamond particles were studied for sapphire wafer grinding. Solid particle flow behaviors in agitated electrolyte was studied using PIV(Particle Image Velocimetry), and uniform particle distribution in Ni bond were obtained when agitating impeller was located lower part of electrolyte. Hardness values of $400{\pm}50Hv$ were maintained for retention of diamond particles in electro-deposited bond layer. Sapphire wafer edge grinding test was carried out and multi-layered $160{\mu}m$ thick diamond tool showed much greater grinding capabilities up to 2000 sapphire wafers than single-layered $50{\mu}m$ thick diamond electro-deposited tools of 420 wafers. The reason why 3 times thicker multi-layered tools than single-layered tools showed 5 times longer tool lives in grinding processes was attributed to self-dressed new diamond particles in multi-layered tools, and multi-layered diamond tools could be promising for sapphire grinding.