• Proceedings of the Korea Electromagnetic Engineering Society Conference
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• 2002.11a
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• pp.340-343
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• 2002

Electromagnetic(EM) radiation problems and their possible solutions are addressed in this paper for the split power plane of high-speed digital systems. Stitching and decoupling capacitors are proved to be very effective fur reducing signal noise, ground bounce as well as electromagnetic radiation from the split power plane. Simulations based on 3D-Finite Difference Time Domain (FDTD) method are utilized for the analysis of practical high frequency multi-layered PC main board

• Journal of electromagnetic engineering and science
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• v.2 no.2
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• pp.75-80
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• 2002

Signal integrity problems and their possible solutions are addressed in this paper for split power plane of high-speed digital systems. Stitching and decoupling capacitors are proved to be very effective for reducing signal noise, ground bounce as well as electromagnetic radiation from the split power plane. Simulations based on 3D-Finite Difference Time Domain (FDTD) method are utilized for the analysis of practical high frequency multi-layered PC main board.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.319-319
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• 2013

Even though the fabrication methods of metal oxide based thin film capacitor have been well established such as RF sputtering, Sol-gel, metal organic chemical vapor deposition (MOCVD), ion beam assisted deposition (IBAD) and pulsed laser deposition (PLD), an applicable capacitor of printed circuit board (PCB) has not realized yet by these methods. Barium Strontium Titanate (BST) and other high-k ceramic oxides are important materials used in integrated passive devices, multi-chip modules (MCM), high-density interconnect, and chip-scale packaging. Thin film multi-layer technology is strongly demanded for having high capacitance (120 nF/$mm^2$). In this study, we suggest novel multi-layer thin film capacitor design and fabrication technology utilized by plasma assisted deposition and photolithography processes. Ba0.6Sr0.4TiO3 (BST) was used for the dielectric material since it has high dielectric constant and low dielectric loss. 5-layered BST and Pt thin films with multi-layer sandwich structures were formed on Pt/Ti/$SiO_2$/Si substrate by RF-magnetron sputtering and DC-sputtering. Pt electrodes and BST layers were patterned to reveal internal electrodes by photolithography. SiO2 passivation layer was deposited by plasma-enhanced chemical vapor deposition (PE-CVD). The passivation layer plays an important role to prevent short connection between the electrodes. It was patterned to create holes for the connection between internal electrodes and external electrodes by reactive-ion etching (RIE). External contact pads were formed by Pt electrodes. The microstructure and dielectric characteristics of the capacitors were investigated by scanning electron microscopy (SEM) and impedance analyzer, respectively. In conclusion, the 0402 sized thin film multi-layer capacitors have been demonstrated, which have capacitance of 10 nF. They are expected to be used for decoupling purpose and have been fabricated with high yield.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2019.05a
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• pp.133-136
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• 2019

Recently, many industrial devices are facing protocol compatibility problems with external monitoring and control systems. This paper designed an industrial communication gateway that can support the transformation of industrial communication protocol using multi-layered communication module. Industrial communication gateways have a structure that connects individual communication modules using rs485 serial communication to multiple layers. Each communication module consisted of analog data card, a digital data card LAN, and a CAN-enabled card. The main board processor used Atmega micro-processor, and the rs485 serial slot was placed to have a multi-layer communication module structure. These additive layer type communication modules support analog and digital I/O functions and LAN and CAN for wide use in industrial communication control and monitoring.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.59-66
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• 2018

In this paper, we analyzed the usefulness of single-structured printed circuit board (PCB) modeling by using numerical analysis to model the PCB structure applied to a package for semiconductor purposes and applying modeling assuming a single structure. PCBs with circuit layer of 3rd and 4th were used for analysis. In addition, measurements were made on actual products to obtain material characteristics of a single structure PCB. The analysis results showed that if the PCB was modeled in a single structure compared to a multi-layered structure, the warpage analysis results resulting from modeling the PCB structure would increase and there would be a significant difference. In addition, as the circuit layer of the PCB increased, the mechanical properties of the PCB, the elastic coefficient and inertia moment of the PCB increased, decreasing the package's warpage.

• Macromolecular Research
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• v.14 no.4
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• pp.430-437
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• 2006

The ultra-drawing process of an ultra high molecular weight polyethylene (UHMWPE) gel film was examined by incorporating linear low-density polyethylene (LLDPE) and $BaTiO_3$ nanoparticles. The effects of LLDPE and the draw ratios on the morphological development and mechanical properties of the nanocomposite membrane systems were investigated. By incorporating $BaTiO_3$ nanoparticles in the UHMWPE/LLDPE blend systems, the ultra-drawing process provided a highly extended, fibril structure of UHMWPE chains to form highly porous, composite membranes with well-dispersed nanoparticles. The ultra-drawing process of UHMWPE/LLDPE dry-gel films desirably dispersed the highly loaded $BaTiO_3$ nanoparticles in the porous membrane, which could be used to form multi-layered structures for electronic applications in various embedded, printed circuit board (PCB) systems.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.11 no.1
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• pp.55-62
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• 2000

In this paper, cellularphone antenna was designed to be capable of being mounted on the circuit-board with co-planar feeding method. The designed antenna is fabricated by the following procedure : make the multi-layered dielectric ceramic($\varepsilon_{\tau}$=23) hexahedron($7.5mm\times4.5mm\times0.4mm$) and then produce λ/4 monopole radiation element with helical structure on the surface of the hexahedron. The results are as followings : Returnloss 27.36 dB, -10 dB bandwidth 76 MHz(3.97 %), H-plane average gain -9.43 dBd.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2002.05a
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• pp.181-183
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• 2002

The accurate permeability for preform is critical to model and design the impregnation of fluid resin in the composite manufacturing process. In this study, the in-plane and transverse permeability for a woven fabric are predicted numerically through the coupled flow model which combines microscopic with macroscopic flow. The microscopic and macroscopic flow which are flows within the micro-unit and macro-unit cell, respectively, are calculated by using 3-D CVFEM(control volume finite element method). To avoid checker-board pressure field and improve the efficiency on numerical computation, A new interpolation function for velocity is proposed on the basis of analytic solutions. The permeability of plain woven fabric is measured through unidirectional flow experiment and compared with the permeability calculated numerically. Based on the good agreement of the results, the relationships between the permeability and the structures of preform such as the fiber volume fraction and stacking effect can be understood. The reverse and the simple stacking are taken in account. Unlike past literatures, this study is based on more realistic unit cell and the improved prediction of permeability can be achieved. It is observed that in-plane flow is more dominant than transverse flow in the real flow through preform and the stacking effect of multi-layered preform is negligible. Consequently, the proposed coupled flow model can be applied to modeling of real composite materials processing.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.23 no.12
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• pp.1673-1678
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• 2019

There are various networks and communication methods are used in industrial communication. Enterprises need to convert communications between industrial devices and networks for production line expansion, factory upgrades, network segmentation, and SI. This requires designers manufactured by many manufacturers to provide communication equipment for data or protocol conversion in order to connect and transmit various other mechanical devices to the network. This paper designed industrial communication gateway that can support the transformation of industrial communication protocol using multi-layered communication module. Industrial communication gateways have a structure that connects individual communication modules using RS485 communication to multiple layers. Each communication module consisted of analog and digital data card, LAN, and CAN-enabled card. The main board processor used Atmega micro-processor, and the RS485 slot was placed to have a multi-layer communication module structure. These additive layer type communication modules support analog and digital I/O functions and LAN and CAN for wide use in industrial communication control and monitoring.

• Journal of the Korean Institute of Traditional Landscape Architecture
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• v.28 no.4
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• pp.36-48
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• 2010

The objectives of this study are to research and analyze the positioning of Mt. Back Hwa(白華山) and the characteristics of its neighboring cultural scenery based on the Two Seated Buddah Temple, a small Buddhist temple of Taeul in Taean and to view both landscape geographic codes and religious attractions over Mt. Back Hwa by discussing its expression and meaning for the scenery scattered or nested over this districts. The panoramic view of west shows the character of Mt. Back Hwa as a magnanimity of Buddhist Goddess of Mercy which is viewed as a view point field no less than its location as a landscape target and its singularity as a rocky mountain. The ancient castle, signal beacon post and the small Buddhist temple of Taeul to be read importantly in the old map and SinjeungDongkukyeojiseungram(新增東國輿地勝覽) form the core of place identity, and a number of carve(engrave) letters such as Eopungdae(御風臺), Youngsadae(永思臺), etc. show the prospect of this mountain and monumentality derived from place characteristics. In addition removing of Taeiljeon, a portrait scroll of Dangun, national ancestor makes possible to guess the national status hold by Mt. Back Hwa in advance and to know that it has symbiotic relationship with indigenous religion and shares with the universal locality which have been continued for a long time through a portrait scroll of Dangun enshrined in Samsunggak. More than anything else, however the Rock-carved Buddha Triad in Taean, Giant Buddha of Baekjae era enshrined in the small Buddhist temple of Taeul is not only why Mt. Back Hwa, magnanimity of Buddhist Goddess of Mercy exists but also a signifier. In spite of such a placity, the union ideas of confucianism, buddhism and doctrinism of buddhism prevailed in the Late Joseon Dynasty allows the cultural phenomenon of taoism to be read in the same weight through Ilsogae(一笑溪) and Gammodae(感慕臺) which are mountain stream and pond area respectively centered in the carve letter, 'Taeeuldongcheon(太乙洞天)' constructed in front of the small Buddhist temple of Taeul, the Baduk board type of rock carvings engraved over them and a number of traces of carve letters made by confucian scholars since the Middle of Joseon Dynasty. The reason such various cultural sceneries are mixed in Mt. Back Hwa is in the results of inheritance of religious places and fusion of sprit of the times, and the various type of cultural scenery elements scattered in Mt. Back Hwa are deemed as unique geographic code to understand the multi-layered placity and the characteristics of scenery of Mt. Back Hwa in Taean.