• 한국진공학회:학술대회논문집
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• 한국진공학회 1998년도 제14회 학술발표회 논문개요집
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• pp.133-133
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• 1998

In the thin film alloy formation of the transition metals ion-beam-mixing technique forms a metastable structure which cannot be found in the arc-melted metal alloys. Sppecifically it is well known that the studies about the electronic structure of ion-beam-mixed alloys pprovide the useful information in understanding the metastable structures in the metal alloy. We studied the electronic change in the ion-beam-mixed ppt-Ct alloys by XppS and XANES. These analysis tools pprovide us information about the charge transfer in the valence band of intermetallic bonding. The multi-layered films were depposited on the SiO2 substrate by the sequential electron beam evapporation at a ppressure of less than 5$\times$10-7 Torr. These compprise of 4 ppairs of ppt and Cu layers where thicknesses of each layer were varied in order to change the alloy compposition. Ion-beam-mixing pprocess was carried out with 80 keV Ae+ ions with a dose of $1.5\times$ 1016 Ar+/cm2 at room tempperature. The core and valence level energy shift in these system were investigated by x-ray pphotoelectron sppectroscoppy(XppS) pphotoelectrons were excited by monochromatized Al K ａ(1486.6 eV) The ppass energy of the hemisppherical analyzer was 23.5 eV. Core-level binding energies were calibrated with the Fermi level edge. ppt L3-edge and Cu K-edge XANES sppectra were measured with the flourescence mode detector at the 3C1 beam line of the ppLS (ppohang light source). By using the change of White line(WL) area of the each metal sites and the core level shift we can obtain the information about the electrons pparticippating in the intermetallic bonding of the ion-beam-mixed alloys.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.147-147
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• 2011

High crystalline nonpolar a-plane (11-20) nitride light emitting diodes (LEDs) have been fabricated on r-plane (1-102) sapphire substrates by metalorganic chemical-vapor deposition (MOCVD). The multi-quantum wells (MQWs) active region is consists of 4 periods the nonpolar a-plane InGaN/GaN(a-InGaN/GaN) on a high quality a-plane GaN (a-GaN) template grown by using the multibuffer layer technique. The full widths at half maximum (FWHMs) of x-ray rocking curve (XRC) obtained from phiscan of the specimen that was grown up to nonpolar a-plane GaN LED layers with double crystal x-ray diffraction. The FWHM values were decreased down to 477 arc sec for $0^{\circ}$ and 505 arc sec for $-90^{\circ}$, respectively. After fabricating a conventional lateral LED chip which size was $300{\times}600{\mu}m^2$, we measured the optical output power by on-wafer measurements. N-electrode was made with Cr/Au contact, and ITO on p-GaN was formed with Ohmic contact using Ni/Au followed by inductively coupled plasma etching for mesa isolation. The optical output power of 1.08 mW was obtained at drive current of 20 mA with the peak emission wavelength of 502 nm.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.185-185
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• 2011

ZnTe semiconductor is very attractive materials for optoelectronic devices in the visible green spectral region because of it has direct bandgap of 2.26 eV. The prototypes of ZnTe light emitting diodes (LEDs) have been reported [1], showing that their green emission peak closely matches the most sensitive region of the human eye. Another application to photovoltaics proved that ZnTe is useful for the production of high-efficiency multi-junction solar cells [2,3]. By using the pulse laser deposition system, ZnTe thin films were deposited on ZnO thin layer, which is grown on (0001) Al2O3substrates. To produce the plasma plume from an ablated ZnO and ZnTe target, a pulsed (10 Hz) YGA:Nd laser with energy density of 95 mJ/$cm^2$ and wavelength of 266 nm by a nonlinear fourth harmonic generator was used. The laser spot focused on the surface of the ZnO and ZnTe target by using an optical lens was approximately 1 mm2. The base pressure of the chamber was kept at a pressure around $10^{-6}$ Torr by using a turbo molecular pump. The oxygen gas flow was controlled around 3 sccm by using a mass flow controller system. During the ZnTe deposition, the substrate temperature was $400^{\circ}C$ and the ambient gas pressure was $10^{-2}$ Torr. The structural properties of the samples were analyzed by XRD measurement. The optical properties were investigated by using the photoluminescence spectra obtained with a 325 nm wavelength He-Cd laser. The film surface and carrier concentration were analyzed by an atomic force microscope and Hall measurement system.

• 한국재료학회지
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• 제17권9호
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• pp.484-488
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• 2007

Mo(Ti) alloy and pure Cu thin films were subsequently deposited on $SiO_2-coated$ Si wafers, resulting in $Cu/Mo(Ti)/SiO_2$ structures. The multi-structures have been annealed in vacuum at $100-600^{\circ}C$ for 30 min to investigate the outdiffusion of Ti to Cu surface. Annealing at high temperature allowed the outdiffusion of Ti from the Mo(Ti) alloy underlayer to the Cu surface and then forming $TiO_2$ on the surface, which protected the Cu surface against $SiH_4＋NH_3$ plasma during the deposition of $Si_3N_4$ on Cu. The formation of $TiO_2$ layer on the Cu surface was a strong function of annealing temperature and Ti concentration in Mo(Ti) underlayer. Significant outdiffusion of Ti started to occur at $400^{\circ}C$ when the Ti concentration in Mo(Ti) alloy was higher than 60 at.%. This resulted in the formation of $TiO_2/Cu/Mo(Ti)\;alloy/SiO_2$ structures. We have employed the as-deposited Cu/Mo(Ti) alloy and the $500^{\circ}C-annealed$ Cu/Mo(Ti) alloy as gate electrodes to fabricate TFT devices, and then measured the electrical characteristics. The $500^{\circ}C$ annealed Cu/Mo($Ti{\geq}60at.%$) gate electrode TFT showed the excellent electrical characteristics ($mobility\;=\;0.488\;-\;0.505\;cm^2/Vs$, on/off $ratio\;=\;2{\times}10^5-1.85{\times}10^6$, subthreshold = 0.733.1.13 V/decade), indicating that the use of Ti-rich($Ti{\geq}60at.%$) alloy underlayer effectively passivated the Cu surface as a result of the formation of $TiO_2$ on the Cu grain boundaries.

• 한국전자파학회논문지
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• 제28권2호
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• pp.85-96
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• 2017

본 논문에서는 6-포트 회로망을 이용한 잡음파라미터 측정방법의 측정 주파수 대역을 확장하기 위한 2~18 GHz 광대역 6-포트 회로망을 설계 및 제작하였다. 광대역 6-포트 회로망을 설계하기 위해서 광대역 특성을 가지는 윌킨슨 전력분배기와 방향성 결합기를 설계하였다. 윌킨슨 전력분배기는 3단 구조로 설계하여 광대역 특성을 구현하였다. 방향성 결합기는 3단 구조 및 다층기판을 활용한 slot-coupled 구조로 설계하여 광대역 특성을 구현하였다. 설계된 광대역 전력분배기와 결합기를 이용하여 광대역 6-포트 회로망을 설계 및 제작하였다. 2~18 GHz 대역에서 제작된 6-포트 회로망의 측정결과는 잡음 파라미터 측정방법에 적용 가능한 특성을 보였다.

• 반도체디스플레이기술학회지
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• 제17권4호
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• pp.42-45
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• 2018

As The semiconductor decrease from 10 nanometer to 7 nanometer, It is suggested that "More than Moore" is needed to follow Moore's Law, which has been a guide for the semiconductor industry. Fan-Out Wafer Level Package(FOWLP) is considered as the key to "More than Moore" to lead the next generation in semiconductors, and the reasons are as follows. the fan-out WLP does not require a substrate, unlike conventional wire bonding and flip-chip bonding packages. As a result, the thickness of the package reduces, and the interconnection becomes shorter. It is easy to increase the number of I / Os and apply it to the multi-layered 3D package. However, FOWLP has many issues that need to be resolved in order for mass production to become feasible. One of the most critical problem is the warpage problem in a process. Due to the nature of the FOWLP structure, the RDL is wired to multiple layers. The warpage problem arises when a new RDL layer is created. It occurs because the solder ball reflow process is exposed to high temperatures for long periods of time, which may cause cracks inside the package. For this reason, we have studied warpage in the FOWLP structure using commercial simulation software through the implementation of the reflow process. Simulation was performed to reproduce the experiment of products of molding compound company. Young's modulus and poisson's ratio were found to be influenced by the order of influence of the factors affecting the distortion. We confirmed that the lower young's modulus and poisson's ratio, the lower warpage.

• 한국염색가공학회지
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• 제34권1호
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• pp.20-26
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• 2022

Centrifugal spinning is an emerging technique for fabricating micro-to-nano-fibers in recent years. To obtain fibers with the desired size and morphology, it is necessary to configure and optimize the parameters used in centrifugal spinning. In this study, it was controlled by changing the solution's concentration (7.5, 10, and 12.5 wt.%) and disk's rotational velocity (6,000, 8,000, and 10,000 rpm) to prepare centrifugal spun nano-filter. The morphological property, air permeability, and dust collection efficiency of the PVA/PP bi-layer nanoweb prepared by centrifugal spun PVA on the PP micron nonwoven substrate are studied using a field emission scanning electron microscope, an air permeability tester, and a filter tester equipment, and the analysis results indicate that it is suitable as a nano-filter when the concentration of PVA solution is 10 wt.% and the rotational velocity of the disk is 8,000 rpm. The resultant reduced diameter and uniform fibers also proved that an excellent dust collection efficiency filter could be made.

• 한국컴퓨터정보학회:학술대회논문집
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• 한국컴퓨터정보학회 2021년도 제64차 하계학술대회논문집 29권2호
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• pp.701-702
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• 2021

The purpose of the study was to identify fiber changes induced by electrical stimulation of a certain neural substrate in the rat brain. In the stimulation group, the peripheral nerve was injured and the brain area associated to inhibit sensory information was electrically stimulated. There were sham and sham stimulation groups as controls. Then high-field diffusion tensor imaging (DTI) was acquired. 35 features were taken from the DTI measures from 7 different brain pathways. To compare the efficacy of the classification for 3 animal groups, the linear regression analysis (LDA) and the machine learning technique (MLP) were applied. It was found that the testing accuracy by MLP was about 77%, but that of accuracy by LDA was much higher than MLP. In conclusion, machine learning algorithm could be used to identify and predict the changes of the brain white matter in some situations. The limits of this study will be discussed.

• 한국재료학회지
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• 제11권8호
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• pp.671-678
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• 2001

$RuO_2$ 박막을 전극으로 하여 Pt/Ti/Si 기판 위에 $RuO_2$ /LiPON/$RuO_2$의 다층 구조로 이루어진 전고상의 박막형 마이크로 슈퍼캐패시터를 제작하였다. 전극용 $RuO_2$박막은 반응성 dc 마그네트론 스퍼터를 이용하여 $O_2$/[Ar+$O_2$]비를 증가시키며 성장시켰고, 비정질 LiPON 고체전해질 박막은 순수한 질소분위기 하에서 rf 스퍼터링으로 성장시켰다. 상온에서의 충-방전 측정을 통해 $RuO_2$ 박막의 미세구조에 따라 슈퍼캐패시터의 사이클 특성이 영향을 받는 것을 알 수 있었다. Glancing angle x-ray diffraction(GXRD)과 transmission electron microscopy (TEM) 분석을 통해 산소 유량의 증가가 $RuO_2$박막의 미세 구조의 영향을 주는 것을 알 수 있었고, X-ray photoelectron spectroscopy (XPS) 분석을 통해 산소 유량 비의 증가가 Ru과 산소간의 결합에도 영향을 줌을 알 수 있었다. 또한 사이클 후 슈퍼캐패시터의 TEM 및 AES depth profiling 분석을 통해, 충-방전 시 $RuO_2$와 LiPON과의 계면반응에 의해 형성된 계면 층이 사이클 특성에 영향을 줌을 알 수 있었다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제41회 하계 정기 학술대회 초록집
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• pp.293-294
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• 2011

It is known that semiconductor quantum-dot (QD) heterostructures have superior zero-dimensional quantum confinement, and they have been successfully applied to semiconductor laser diodes (QDLDs) for optical communication and infrared photodetectors (QDIPs) for thermal images [1]. The self-assembled QDs are normally formed at Stranski-Krastanov (S-K) growth mode utilizing the accumulated strain due to lattice-mismatch existing at heterointerfaces between QDs and cap layers. In order to increase the areal density and the number of stacks of QDs, recently, sub-monolayer (SML)-thick QDs (SQDs) with reduced strain were tried by equivalent thicknesses thinner than a wetting layer (WL) existing in conventional QDs (CQDs) by S-K mode. Despite that it is very different from CQDs with a well-defined WL, the SQD structure has been successfully applied to QDIP[2]. In this study, optical characteristics are investigated by using photoluminescence (PL) spectra taken from self-assembled InAs/GaAs QDs whose coverage are changing from submonolayer to a few monolayers. The QD structures were grown by using molecular beam epitaxy (MBE) on semi-insulating GaAs (100) substrates, and formed at a substrate temperature of 480$^{\circ}C$ followed by covering GaAs cap layer at 590$^{\circ}C$. We prepared six 10-period-stacked QD samples with different InAs coverages and thicknesses of GaAs spacer layers. In the QD coverage below WL thickness (~1.7 ML), the majority of SQDs with no WL coexisted with a small amount of CQDs with a WL, and multi-peak spectra changed to a single peak profile. A transition from SQDs to CQDs was found before and after a WL formation, and the sublevel of SQDs peaking at (1.32${\pm}$0.1) eV was much closer to the GaAs bandedge than that of CQDs (~1.2 eV). These revealed that QDs with no WL could be formed by near-ML coverage in InAs/GaAs system, and single-mode SQDs could be achieved by 1.5 ML just below WL that a strain field was entirely uniform.