• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
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• pp.112-113
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• 2006

In this paper. we investigated a characteristic of holographic grating data erasure with non-polarized beam at amorphous chalcogenide As-Ge-Se-S thin film. A sample of holographic grating data was formed with DPSS laser for setup. Then, the erasure process was performed with He-Ne laser vertically at sample. As-Ge-Se-S(single layer). Ag/As-Ge-Se-S(double layer) and As-Ge-Se-S/Ag/As-Ge-Se-S(multi-layer) are manufactured to compare their characteristic of erasure.

• Corrosion Science and Technology
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• 제5권3호
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• pp.112-116
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• 2006

This study has been conducted to monitor the corrosion rate of cathodically protected structure and corrosion inhibited system using multi-line thin-film electrical resistance (TFER) sensor in various environments. The field test data of TFER sensor for the corrosion monitoring of cathodically protected underground pipeline in soil environments and of corrosion inhibited gas heaters were also presented. The sensor was found to be a powerful method to commit the sensitive pick-up of small corrosion rate which can be observed in the cathodically protected and corrosion inhibited systems.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.478-478
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• 2012

Recently, there are many researches in order to increase the deposition rate (D/R) and improve film uniformity and quality in the deposition of microcrystalline silicon thin film. These two factors are the most important issues in the fabrication of the thin film solar cell, and for the purpose of that, several process conditions, including the large area electrode (more than 1.1 X 1.3 (m2)), higher pressure (1 ~ 10 (Torr)), and very high frequency regime (VHF, 40 ~ 100 (MHz)), have been needed. But, in the case of large-area capacitively coupled discharges (CCP) driven at frequencies higher than the usual RF (13.56 (MHz)) frequency, the standing wave and skin effects should be the critical problems for obtaining the good plasma uniformity, and the ion damage on the thin film layer due to the high voltage between the substrate and the bulk plasma might cause the defects which degrade the film quality. In this study, we will propose the new concept of the large-area multi-electrode (a new multi-electrode concept for the large-area plasma source), which consists of a series of electrodes and grounds arranged by turns. The experimental results with this new electrode showed the processing performances of high D/R (1 ~ 2 (nm/sec)), controllable crystallinity (~70% and controllable), and good uniformity (less than 10%) at the conditions of the relatively high frequency of 40 MHz in the large-area electrode of 280 X 540 mm2. And, we also observed the SEM images of the deposited thin film at the conditions of peeling, normal microcrystalline, and powder formation, and discussed the mechanisms of the crystal formation and voids generation in the film in order to try the enhancement of the film quality compared to the cases of normal VHF capacitive discharges. Also, we will discuss the relation between the processing parameters (including gap length between electrode and substrate, operating pressure) and the processing results (D/R and crystallinity) with the process condition map for ${\mu}c$-Si:H formation at a fixed input power and gas flow rate. Finally, we will discuss the potential of the multi-electrode of the 3.5G-class large-area plasma processing (650 X 550 (mm2) to the possibility of the expansion of the new electrode concept to 8G class large-area plasma processing and the additional issues in order to improve the process efficiency.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.1537-1540
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• 2003

MEMS technology with micro scale is complete system utilized as the sensor. micro electro device. The metallization of MEMS is very important to transfer the power operating the sensor and signal induced from sensor part. But in the MEMS structures local stress concentration and deformation is often happened by geometrical shape and different constraint on the metallization. Therefore. this paper studies the effect of supporting type and thickness ratio about thin film thickness of the substrate thickness for the residual stress variation caused by thermal load in the multi-layer thin film. Specimens were made from materials such as Al, Au and Cu and uniform thermal load was applied, repeatedly. The residual stress was measured by FEA and nano-indentation using AFM. Generally, the specimen made of Al induced the large residual stress and the 1st layer made of Al reduced the residual stress about half percent than 2nd layer. Specimen made of Cu and Au being the lower thermal expansion coefficient induce the minimum residual stress. Similarly the lowest indentation length was measured in the Au_Cu specimen by nano-indentation.

• Transactions on Electrical and Electronic Materials
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• 제16권1호
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• pp.29-33
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• 2015

This paper presents the results of the optical characteristics of ITO thin film with different buffer layer thicknesses of $SiO_2$ and $Nb_2O_5$ for touch sensor application. $SiO_2$ and $Nb_2O_5$ buffer layers were deposited using RF magnetron sputtering equipment. The buffer layers were inserted between glass and ITO layers. In order to compare with the experimental results, the Essential Macleod Program (EMP) was adopted. Based on EMP simulation, the [$Nb_2O_5{\mid}SiO_2{\mid}ITO$] multi-layered thin film exhibited high transmittance of more than 85% in the visible region. The actual experimental results also showed transmittance of more than 85% in the visible region, indicating that the simulated results were well matched with the experimental results. The sheet resistance of ITO based film was about $340{\Omega}/sq$. The surface roughness maintained a relatively small value within the range of 0.1~0.4 nm when using the $Nb_2O_5$ and $SiO_2$ buffer layers.

• 대한기계학회논문집A
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• 제28권5호
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• pp.532-538
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• 2004

MEMS technology applying to the sensors and micro-electro devices is complete system. These microsystems are made by variable processes. Especially, the mentallization process has very important functions to transfer the power operating the sensor and signal induced from sensor part. But in the structures of MEMS the local stress concentration and deformation are often yielded by an irregular geometrical shape and different constraint. Therefore, this paper studies the effect of supporting type and thickness ratio about thin film of the substrate on the residual stress variation when the thermal loads is applied to the multi-layer thin film fabricated by metallization process. Specimens were made from several materials such as Al, Au and Cu. Then, uniform thermal load was applied, repeatedly. The residual stress was measured by FE Analysis and nano-indentation method using AFM. Generally, the specimen made of Al induced the larger residual stress than that of made of other materials. Specimen made of Cu and Au having the low thermal expansion coefficient induces the minimum residual stress. Similarly, the lowest indentation length was measured by nano-indentation method in the Si/Au/Cu specimen. Particularly, clusters are created in the specimen made of Cu by thermal load and the indentation length became increasingly large by cluster formation.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2007년도 춘계학술발표회 초록집
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• pp.128-129
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• 2007

$ZnS/Na_3AlF_6$ multi-layer thin film were produced by evaporation system. ZnS were selected as a high refractive index material and $Na_3AlF_6$ were selected as low refractive index material. Optical properties including color effect were systematically studied in terms of different optical thickness by spectrophotometer. In oder to compare with experimental data, the Essential Macleod Program(EMP) was adopted that simulation program. The thin film consisting of $ZnS/Na_3AlF_6$ multi-layer show the wave length of $530{\sim}600nm$, typically color range between purple, blue, green. It was confirmed that this experimental result was well matched with simulation data.

• 전기전자학회논문지
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• 제22권2호
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• pp.302-308
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• 2018

다층 박막 스퍼터링(Multi-Layer Sputtering)은 상이한 물질을 원하는 두께의 박막을 다층(Multi-Layer) 으로 형성함을 목적으로 한다. 다층 박막 증착 공정은 공정 시간이 비교적 많은 비중을 차지하는데, 그 주요 원인은 공정 시간에 비해 증착하고자하는 기판의 이동 시간과 챔버를 고진공 상태로 만드는 시간이 많이 소요되기 때문이다. 반도체나 디스플레이 산업은 하나의 챔버에서 단일 물질을 스퍼터링하고 기판이 다관절 로봇을 통해 다른 챔버로 이동하여 다른 물질을 스퍼터링하는 공정이 대부분인데, 이는 필연적으로 공정 설비 내에 여러 개의 챔버와 진공펌프, 다관절 로봇이 필요하다. 이러한 문제점을 해결하기 위해 본 논문에서는 단일 진공 챔버 내에서 서로 상이한 물질을 증착하는 다층박막 스퍼터링 장치에 대한 제어시스템을 제안하고 TFT 공정에서 적용한다. 제어시스템의 제작과 실험을 통해 유효성을 입증한다.

• 한국전기전자재료학회논문지
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• 제32권4호
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• pp.287-295
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• 2019

Privacy films are typically manufactured by combining black resin and transparent louver-shaped patterns. The use of black resin results in excellent light-shielding. However, black resin can reduce the transmittance of privacy films at the front viewing angle. In this study, we applied $SiO_2/SiON$ multi-layer thin films on a privacy film to maintain transmittance at the front viewing angle and improve light-shielding at the side viewing angle. We determined the optimum combination of thicknesses of the $SiO_2/SiON$ multi-layer stacks to increase the overall transmittance; the light shielding could be maximized at the side viewing angle.

• Advances in nano research
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• 제15권2호
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• pp.91-104
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• 2023

Development of thin carbon nanotubes (CNTs) nanoliquid film over the rough surface of a horizontal rotating disk is investigated by considering symmetric roughness either along the azimuthal or radial directions. The disk surface is either heated or cooled axisymmetrically from below. The effects of single-walled carbon nanotubes (SWCNTs), multi-walled carbon nanotubes (MWCNTs) are analyzed on the film thinning process with different types of base liquids. Closed form solutions for velocity and temperature field are obtained for small values of Reynolds number whereas the numerical solution is derived for moderate values of Reynolds number. It is found that fluid retention / depletion takes place when the roughness is symmetric along the azimuthal / radial directions. It is also seen that the film thinning rate enhances for MWCNTs compare to SWCNTs. Further it is found that two different heat transfer regions exits within the flow domain depending on the fact that heat is transferred from disk to liquid film and vice-versa.