• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2011년도 춘계학술대회 논문집
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• pp.693-694
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• 2011

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2000년도 춘계학술대회논문집 - 한국공작기계학회
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• pp.435-440
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• 2000

In this study, we aims to develop the machining technology for the ultra precision surface and profile accuracy. For this purpose, we construct the electrolytic in process grinding system (ELID grinding) and apply to the cylindrical and internal grinding. Through the various machining experiments such as SCM steel., ceramics, tungsten carbide etc., we have obtained nanometer surface roughness. And we have applied this mirror grinding technique to hydraulic manual valve and mold core of mini disk optical pick-up base. For the development of fine mechanical part machining technology, e have made multi fiber optical connector using fine grinding technology. And constructed micro drilling system with process monitoring system which is possible to drill 50${\mu}{\textrm}{m}$ diameter hole.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.81-85
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• 2005

In this paper, the structural design optimization of a wafer grinding machine using a multi-step optimization with genetic algorithm is presented. The design problem, in this study, is to find out the optimum configuration and dimensions of structural members which minimize the static compliance, the dynamic compliance, and the weight of the machine structure simultaneously under several design constraints. The first design step is shape optimization, in which the best structural configuration is found by getting rid of structural members that have no contributions to the design objectives from the given initial design configuration. The second and third steps are sizing optimization. The second design step gives a set of good design solutions having higher fitness for lightweight and minimum static compliance. Finally the best solution, which has minimum dynamic compliance and weight, is extracted among those good solution set. The proposed design optimization method was successfully applied to the structural design optimization of a high precision wafer grinding machine. After optimization, both static and dynamic compliances are reduced more than $92\%\;and\;93\%$ compared with the initial design, which was designed empirically by experienced engineers. Moreover the weight of the optimized structure are also slightly reduced than before.

• 한국우주과학회:학술대회논문집(한국우주과학회보)
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• 한국우주과학회 2004년도 한국우주과학회보 제13권1호
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• pp.33-33
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• 2004

Traditional bound abrasive grinding leaves the machine marks and subsurface damages ranging from 1 to few tens microns ms in height. These are removed typically by subsequent craftmen-based loose abrasive lapping, polishing and figuring. Using the multi-variable regression technique, we established a new automated grinding process control method for the removal of loose abrasive lapping from the traditional fabrication process. (omitted)

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2005년도 ICCAS
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• pp.621-625
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• 2005

This paper presents a new hybrid serial-parallel robot(HSPR), which has six degrees of freedom driven by ball screw linear actuators and motored joints. This hybrid robot design presents a compromise between high rigidity of fully parallel manipulators and extended workspace of serial manipulators. The hybrid robot has a large, singularity-free workspace and high stiffness. Therefore, the presented kinematic structure of the hybrid robot is particularly suitable for multi-tasking machining processes such as milling, drilling, deburring and grinding. In addition to the machining processes, the hybrid robot can be used for welding, fixturing, material handling and so on. The study on design of the hybrid robot is performed. A kinematic analysis and mechanism description of the hybrid robot with six-controlled degree of freedom is presented. In the virtual design works by DADS, workspace and force analysis are discussed. A numerical model is treated to demonstrate our analysis and to determine the range of permissible extension of the struts. Also, we determine some important design parameters for the hybrid robot.

• The Journal of Advanced Prosthodontics
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• 제13권4호
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• pp.258-267
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• 2021

PURPOSE. The purpose of this study was to compare the surface roughness, phase transformation, and surface topography of dental zirconia with three different yttrium oxide compositions under same grinding and polishing conditions. MATERIALS AND METHODS. Three zirconia disks (IPS e.max ZirCAD LT, MT, MT multi, Ivoclar Vivadent AG, Schaan, Liechtenstein) were selected for experimental materials. Sixty-nine bar-shaped specimens were fabricated as 12.0 × 6.0 × 4.0 mm using a milling machine and glazing was conducted on 12.0 × 6.0 mm surface by same operator. With a custom polishing device, 12.0 × 6.0 mm surfaces were polished under same condition. Surface roughness (Ra[㎛]) was measured before grinding (C), after grinding (G), and at every 3 steps of polishing (P1, P2, P3). X-ray diffraction and FE-SEM observation was conducted before grinding, after grinding, and after fine polishing (P3). Statistical analysis of surface roughness was performed using Kruskal-Wallis test and Mann-Whitney-U test was used as a post hoc test (α = .05). RESULTS. There were no significant differences of surface roughness between LT, MT, and MM groups. In LT, MT, and MM groups, P3 groups showed significantly lower surface roughness than C groups. X-ray diffraction showed grinding and polishing didn't lead to phase transformation on zirconia surface. In FE-SEM images, growths in grain size of zirconia were observed as yttrium oxide composition increases. CONCLUSION. Polished zirconia surface showed clinically acceptable surface roughness, but difference in yttrium oxide composition had no significant influence on the surface roughness. Therefore, in clinical situation, zirconia polishing burs could be used regardless of yttrium oxide composition.

• Journal of Astronomy and Space Sciences
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• 제21권2호
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• pp.141-152
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• 2004

우주망원경용 비구면 반사경 가공 공정은 고정입자 연삭, 자유입자 래핑, 연마의 순서를 따른다. 숙련공에 의한 경험적 공정조절에 의해 목표 비구면을 가공하는 전통적 연삭 공정에서는 수 ${mu}m$ 높이의 표면 밑 손상을 남기며 뒤이은 자유입자 래핑 및 연마 공정에서 이를 제거하며 가공한다. 본 연구는 컴퓨터 수치 제어 연삭 공정진화 모델을 개발하여, 연삭가공을 통해 반사경 표면조도 최소 40nm이하, 가공 예측정확도 20nm급을 이루었다. 구체적인 방법론으로 초정밀가공기의 연삭모듈을 이용하여 연삭 휠 입자의 크기, 이송속도, 공작물 회전선속도 등 연삭 변수를 변화시키며 직경 20, 100mm Zerodur 소재를 초기 연삭하였다. 초기 연삭 변수와 측정된 표면조도와의 관계를 경험적 해석과 다 변수 회귀분석 해석 방법을 통하여 공정조절용 수치 연삭 모델을 구성하였다. 정량적 공정제어는 입력된 연삭변수들로부터 가공 후 표면조도를 예측하고, 측정된 표면조도를 이용하여 수치연삭 모델을 개량한 후 다음 가공에서 측정될 표면조도를 예측하는 순으로 만복 진행되었다. 본 연구에서는 CNC 연삭공정조절로부터 최소 평균 표면조도 36nm, 예측정확도 ${pm}20nm$를 얻었다. 이 연구결과는 정량적 연삭공정제어 모델을 사용하여 자유입자 래핑 공정을 수행할 필요 없이 연삭에서 직접 연마 공정으로 진행할 수 있는 획기적인 공정 효율 향상을 의미한다.

• 한국산학기술학회논문지
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• 제16권10호
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• pp.7071-7077
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• 2015

최근 스마트폰, 태블릿 PC 및 전자기기 등의 사용이 증가함에 따라 커버글라스의 수요가 증가하고 있는 추세이다. 모바일 기기의 디스플레이가 대형화되면서 접촉이나 낙하 등과 같이 외부에서 힘을 받게 되는 환경에서 높은 강도를 유지하는 것이 요구되고 있다. 커버글라스 제작 공정에서 연마공정은 커버글라스의 표면거칠기 및 충분한 강도를 제공하는 중요한 공정이다. 기존 연삭 숫돌에 의한 가공방법은 커버글라스 가공표면에 스크레치, 칩핑, 노칭 및 마이크로 크랙 등의 가공 문제점이 발생한다. 따라서 본 연구에서는 모바일 커버글라스의 연마를 위해 연마필름을 이용한 폴리싱 시스템을 개발하였다. 구조적 안정성을 평가하기 위해 연마 필름 폴리싱 시스템에 대한 유한요소모델을 생성하였고 다물체 동역학 해석을 수행하였다. 연마 필름 폴리싱 시스템에 대한 응력 및 변위 해석을 통해 특성을 분석하였고 레이저 변위 센서를 이용해 제작된 시스템에 대한 변위를 측정하여 구조적 안정성에 대해 확인하였다.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 1996년도 춘계학술대회 논문집
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• pp.124-131
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• 1996

The use of small hemispherical high-speed precision bearing has increased drastically these days in the field of computer disk driver, highteech devices as well as communication and electronic device drivers. It was suggested that the new polishing process adopting the diamond grinding wheel and polishing tool instead of multi stage lapping processes, which enables the mass production of the bearing by reduction of polishing time. Polishing mechanism was analysed and the results were applied to the design and manufacturing of the polishing system. Experiments for selection of optimal polishing conditions were carried out using the polishing system.