• Proceedings of the IEEK Conference
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• 2001.10a
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• pp.705-710
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• 2001

So for the quartz-glassy crucible wastes which was used for pulling up silicon-single-crystal ingot have simply reused for refractory raw-materials, or exhausted. This study is concerned on the advanced recycling-technology that is obtained by the proper micro-particle preparation process in order to fabricate fine amorphous silica filler for EMC (Epoxy Molding Compound). Therefore, this paper will deal with the physical, chemical and thermal pre-treatment process for efficient impurity removal and with the proper micro-particle process for producing the amorphous silicafiller. In view of the results, if the chemical, physical and thermal pre-treatment process for efficient elimination of impurity was passed, the purity of wasted fused glassy crucible is almost equal to the its of first anhydrous quartz glass. Thus, it was understood that this wasted fused glassy crucible was sufficient value of recycling, though it was damaged. When the ingot was fabricated, Phase transformation of crystallization by heat treatment (heat hysteresis phenomenon) was not changed. So, it was understood that as fused silica in the amorphous state, as It is, recycling possibility was very high

• Proceedings of the Korean Society of Dyers and Finishers Conference
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• 2008.10a
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• pp.109-110
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• 2008

본 연구에서는 신축성이 우수한 친수형 무공 PET필름을 사용해서, 소취성, 보온성 및 투습방수성이 우수한 신발용 소재를 개발하였다. 이상의 목적을 달성하기 위해서 최적 소재의 선정, PET필름의 특성평가, 최적 라미네이팅 공정조건 확립, 첨가제 선정 및 가공조건 확립 등에 대해서 실험고찰을 하였으며, 얻어진 주요 결과는 다음과 같다. (1) 신발의 갑피용 및 안창용 최적소재로서 경편직물을 선정하였으며, PET필름의 최적 요구특성은 내수성 9460mmH2O, 투습성 10,000g/m2/24hrs, 인장강도42kgf/cm2, 신도249% 였다. (2) Hot-melt 라미네이팅 공정에서의 투습방수성을 좌우하는 Dot roll No, Coating gap의 최적조건은 CP75(Engraved dot roll no), -0.2mm(Coating Unit gap) 였다. (3) EVA base polymer 및 기타 조제의 최적 배합비를 확립하고 이를 바탕으로 compound를 제조하여 Press로 molding하여 안창용 Sponge를 얻었다. (4) 안창 sponge 위에 점착된 knit 소재의 소취효과는 우수하였으며, 갑피용 투습방수 경편직물의 보온성도$15{\sim}20%$로 우수하였다.

• Proceedings of the KSME Conference
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• 2001.06a
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• pp.90-95
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• 2001

Thermo-mechanical and flexural behavior of a wire-bond plastic ball grid array (WB-PBGA) are characterized by high sensitive $moir{\acute{e}}$ interferometry. $Moir{\acute{e}}$ fringe patterns are recorded and analyzed at several various bending loads and temperature steps. At the temperature higher that $100^{\circ}C$, the inelastic deformation in solder balls became more dominant. As a result the bending of the molding compound decreased while temperature increased. The strain results show that the solder ball located at the edge of the chip has largest shear strain by the thermal load while the maximum average shear strain by the bending moment occurs in the end solder. The results also show that $moir{\acute{e}}$ interferometry is a powerful and effective tool in experimental studies of electronic packaging.

• Journal of the Korean Society of Industry Convergence
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• v.11 no.3
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• pp.121-125
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• 2008

Commutator which plays the major role in switching electric currents from AC to DC is composed of copper and molding compound. The longevity of the DC motors are mostly hampered by the improper machining of the parts. Smooth surface will be mandatory to create the proper air gap of the commutator. In this thesis the selection of the proper materials and tools, the design and analysis of machine structure and the final test procedures have been investigated to achieve the smooth cut surface of the commutators. The performance and the product of the newly manufactured machine has been compared with those of the existing one. And the test result shows the new sawing machine has better overall efficiency and durability.

• Journal of the Korean institute of surface engineering
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• v.32 no.6
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• pp.647-657
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• 1999

Due to the inherently poor adhesion strength of Cu-based leadframe/EMC (Epoxy Molding Compound) interface, popcorn cracking of thin plastic packages frequently occurs during the solder reflow process. In the present work, in order to enhance the adhesion strength of Cu-based leadframe/EMC interface, black-oxide layer was formed on the leadframe surface by chemical oxidation of leadframe, and then oxidized leadframe sheets were molded with EMC and machined to form SDCB (Sandwiched Double-Cantilever Beam) and SBN (Sandwiched Brazil-Nut) specimens. SDCB and SBN specimens were designed to measure the adhesion strength between leadframe and EMC in terms of critical energy-release rate under quasi-Mode I ($G_{IC}$ ) and mixed Mode loading ($G_{C}$ /) conditions, respectively. Results showed that black-oxide treatment of Cu-based leadframe initially introduced pebble-like X$C_2$O crystals with smooth facets on its surface, and after the full growth of $Cu_2$O layer, acicular CuO crystals were formed atop of the $Cu_2$O layer. According to the result of SDCB test, $Cu_2$O crystals on the leadframe surface did not increase ($G_{IC}$), however, acicular CuO crystals on the $Cu_2$O layer enhanced $G_{IC}$ considerably. The main reason for the adhesion improvement seems to be associated with the adhesion of CuO to EMC by mechanical interlocking mechanism. On the other hand, as the Mode II component increased, $G_{C}$ was increased, and when the phase angle was -34$^{\circ}$, crack Kinking into EMC was occured.d.

• The Journal of Korean Academy of Prosthodontics
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• v.55 no.1
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• pp.32-37
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• 2017

In this case report, an alternative impression technique for fabricating removable partial dentures was used in a patient with very few remaining teeth. In this technique, an individual tray was made on the cast, which was made by relining interim denture and taking overimpression with irreversible hydrocolloid according to McLean's functional impression concept. This method showed the following advantages: the no need for border molding with modeling compound, time saving for denture impression without overextension and accurate seating of the individual tray.

• Journal of Welding and Joining
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• v.16 no.4
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• pp.92-97
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• 1998

Because of the low melting temperature of solder, each temperature cycle initiates an irrecoverable creep deformation at the solder interconnection which connects the package body with the PCB. The crack starts and propagates from the position where the creep deformation is maximized. This work has tried to compare and analyze the thermal fatigue life of solder interconnection which is affected by the lead material, the size of die pad, chip thickness, and interface delamination of 48-Pin TSOP under the temperature cycle ($0^{\circ}C$~1$25^{\circ}C$). The crack initiation position and thermal fatigue life which are calculated by using FEA method are well matched with the results of experiments. The thermal Fatigue life of copper lead frame is extended around 3.6 times longer than that of alloy 42 lead frame. It is maximized when the chip size is matched with the length of the lead. It tends to be extended as the thickness of chip got thinner. As the interfacial delamination between die pad and EMC is increased, the thermal fatigue life tends to decrease in the beginning of delamination, and increase after the delamination grew after 45% of the length of die pad.

• Journal of the Earthquake Engineering Society of Korea
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• v.17 no.4
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• pp.151-157
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• 2013

In this study, an externally reinforced structural system for SMC(Sheet Molding Compound) panel water tank, designed according to the Japanese design code, is experimented to evaluate its seismic performance. The test tank is 3m long, 2m wide and 3m high, considering the capacity and size of the shaking table. The measured hydrodynamic pressures are found to be approximately 70% of the Japanese design code values. It may be partially due to the convex shape effect of the unit panels. The analytical results of externally reinforced system based on the measured dynamic water pressures are found in good agreement with the test results. If the design hydrodynamic pressures are estimated properly, the proposed analytical model for the externally reinforced water tank becomes a useful design tool and the Japanese design code is found to provide a safe design for the external frames of SMC panel water tank.

• Journal of Power Electronics
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• v.13 no.6
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• pp.1080-1089
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• 2013

In this paper, the superposition principle of a heat sink temperature rise is verified based on the mathematical model of a plate-fin heat sink with two mounted heat sources. According to this, the distributed coupling thermal impedance matrix for a heat sink with multiple devices is present, and the equations for calculating the device transient junction temperatures are given. Then methods to extract the heat sink thermal impedance matrix and to measure the Epoxy Molding Compound (EMC) surface temperature of the power Metal Oxide Semiconductor Field Effect Transistor (MOSFET) instead of the junction temperature or device case temperature are proposed. The new thermal impedance model for the power converters in Switched Reluctance Motor (SRM) drivers is implemented in MATLAB/Simulink. The obtained simulation results are validated with experimental results. Compared with the Finite Element Method (FEM) thermal model and the traditional thermal impedance model, the proposed thermal model can provide a high simulation speed with a high accuracy. Finally, the temperature rise distributions of a power converter with two control strategies, the maximum junction temperature rise, the transient temperature rise characteristics, and the thermal coupling effect are discussed.

• Journal of Korean Society of Occupational and Environmental Hygiene
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• v.22 no.1
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• pp.52-59
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• 2012

Objectives: The purpose of this study was to evaluate the exposure possibility of by-products during the semiconductor manufacturing processes. Methods: The authors investigated types of chemicals generated during semiconductor manufacturing processes by the qualitative experiment on generation of by-products at the laboratory and a literature survey. Results: By-products due to decomposition of photoresist by UV-light during the photo-lithography process, ionization of arsine during the ion implant process, and inter-reactions of chemicals used at diffusion and deposition processes can be generated in wafer fabrication line. Volatile organic compounds (VOCs) such as benzene and formaldehyde can be generated during the mold process due to decomposition of epoxy molding compound and mold cleaner in semiconductor chip assembly line. Conclusions: Various types of by-products can be generated during the semiconductor manufacturing processes. Therefore, by-products carcinogen such as benzene, formaldehyde, and arsenic as well as chemical substances used during the semiconductor manufacturing processes should be controlled carefully.