• 제목/요약/키워드: Mold Crack

검색결과 71건 처리시간 0.024초

유한요소법을 이용한 하수슬러지 소각재의 인공경량골재 제조시 압출성형해석 (The Numerical Analysis of Extrusion Forming on the Manufactured Artificial Lightweight Aggregate Made of Incinerated Sewage Sludge Ash by a Finite Element Method)

  • 정병길;배진우;성낙창
    • 한국환경과학회지
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    • 제16권10호
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    • pp.1169-1177
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    • 2007
  • The main objective of this research was to evaluate the effects of process variables which were forming ability, flow displacement, effective stress, effective strain, fluid vector and products defects on manufactured artificial lightweight aggregate made of both incinerated sewage sludge ash and clay by means of the numerical analysis of a rigid-plastic finite element method. CATIA (3D CAD program) was used for an extrusion metal mold design that was widely used in designing aircraft, automobile and metallic molds. A metal forming analysis program (ATES Co.) had a function of a rigid-plastic finite element method was used to analyze the program. The result of extrusion forming analysis indicated clearly that a shape retention of the manufactured artificial light-weight aggregate could be maintained by increasing the extrusion ratio (increasing compressive strength inside of extrusion die) and decreasing the die angle. The stress concentration of metal mold was increased by increasing an extrusion ratio, and it was higher in a junction of punch and materials, friction parts between a bottom of the punch and inside of a container, a place of die angle and a place of die of metal mold. Therefore, a heat treatment as well as a rounding treatment for stress distribution in the higher stress concentration regions were necessary to extend a lifetime of the metallic mold. A deformity of the products could have made from several factors which were a surface crack, a lack of the shape retention and a crack of inside of the products. Specially, the surface crack in the products was the most notably affected by the extrusion ratio.

Al-Si-Mg-Cu 합금계의 열간 균열 특성 평가방법에 관한 연구 (Evaluation of Hot Tear Susceptibility of Al-Si-Mg-Cu Alloy System)

  • 손광석;박태은;김진수;강성민;김동규
    • 대한금속재료학회지
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    • 제48권5호
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    • pp.436-444
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    • 2010
  • The hot tear susceptibility of Al alloys was investigated by using a constrained-rod mold designed to quantify 8 types of tear tendency. The severity of the crack was scored by 5 grades on a scale of 0 to 4, with 0 being "no crack formed" and 4 being "complete separation by crack". The Hot Tear Susceptibility index (HTS) which consists of crack type scores and position scores, was proposed to compare the hot tear tendency of Al alloys. A356.0 cast alloy and AA6061 wrought Al alloy showed an HTS value of 27.5 and 53 respectively. The effects of Si, Cu, and Mg content on hot tear tendency were also investigated with a constrained-rod mold. The variation of HTS values with alloying elements represents similar behavior in the variation of the solidification range in a pseudo binary phase diagram.

테프론 균열 주형법 開發에 관한 硏究 (A study on the Teflon crack Molding Method)

  • 최상인;최선호;황재석
    • 대한기계학회논문집
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    • 제11권6호
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    • pp.945-952
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    • 1987
  • 본 연구에서는 이런 점을 감안하여 테프론 주형법의 장점들을 이용하되 에폭 시 덩이를 만드는 주형상자 대신에 에폭시 판과 테프론 균열이 수직성과 직선성을 유 지할 수 있도록 새로 주형대(molding table)를 개발하여 필요한 균열길이와 두께의 에 폭시판을 만들고 기계가공없이 직접시편으로 사용하여 광탄성장치에서 무늬사진을 얻 음으로서 기계 가공시에 일어나는 여러 문제들을 일소하고 시간과 경비를 크게 절약 하려고 하였으며 지금까지의 어떤 실험방법 보다도 정밀한 측정으로 응력확대계수 해 석상의 오차를 줄이는데 목적이 있다.

석고 몰드에서 용출된 Ca이 주입성형 알루미나 소결체의 미세구조 및 파괴인성에 미치는 영향 (Effects of Dissolved Ca from Plaster Mold During Slip Casting on the Microstructure and Fracture Toughness of Sintered Alumina)

  • 박재관;임동기;김인태;김윤호
    • 한국세라믹학회지
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    • 제28권12호
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    • pp.1019-1025
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    • 1991
  • The effect of dissolved Ca ion from plaster mold during slip casting on the microstructure and fracture toughness of high-purity sintered alumina were investigated. When the alumina slip containing 1000 ppm MgO was casted on a calcined alumina mold, the sintered compact had a homogeneous microstructure with equiaxed grains. However, when the same slip was casted on a plaster mold, the sintered compact consisted of the mixture of equiaxed and elongated grains. This inhomogeneous microstructure was also observed in the sintered alumina doped with 100o ppm MgO and 100 ppm CaO whose compact was prepared on the calcined alumina mold indicating that the inhomogeneity was caused by CaO. It was found that the specimen containing both MgO and CaO had higher fracture toughness than that containing MgO only. The enhanced fracture toughness by CaO is probably due to the crack deflection along the boundaries of the elongated grains.

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몰딩공정을 응용한 플립칩 언더필 연구 (Studies on Flip Chip Underfill Process by using Molding System)

  • 한세진;정철화;차재원;서화일;김광선
    • 반도체디스플레이기술학회지
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    • 제1권1호
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    • pp.29-33
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    • 2002
  • In the flip-chip process, the problem like electric defect or fatigue crack caused by the difference of CTE, between chip and substrate board had occurred. Underfill of flip chip to overcome this defects is noticed as important work developing in whole reliability of chip by protecting the chip against the external shock. In this paper, we introduce the underfill methods using mold and plunge and improvement of process and reliability, and the advantage which can be taken from embodiment of device.

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치과용 아말감의 파절에 관한 연구 (A STUDY ON THE FRACTURE OF DENTAL AMALGAM)

  • 허현도;엄정문
    • Restorative Dentistry and Endodontics
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    • 제9권1호
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    • pp.101-106
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    • 1983
  • It was the purpose of this study to investigate the fracture mode of dental amalgam by observing the crack propagation, and to relate this to the microstructure of the amalgam. Caulk 20th Century Regular, Caulk Spherical, Dispersalloy, and Tytin amalgam alloys were used for this study. After each amalgam alloy and Hg measured exactly by the balance was triturated by the mechanical amalgamator (Capmaster, S.S. White), the triturated mass was inserted into the cylindrical metal mold which was 4 mm in diameter and 12 mm in height and was pressed by the Instron Universal Testing Machine at the speed of 1mm/min with 120Kg. The specimen removed from the mold was stored in the room temperature for a week. This specimen was polished with the emery papers from #100 to #200 and finally on the polishing cloth with 0.06${\mu}Al_2O_3$ powder suspended in water. The specimen was placed on the Instron testing machine in the method similar to the diametral tensile test and loaded at the crosshead speed of 0.05mm/min. The load was stopped short of fracture. The cracks on the polished surface of specimen was examined with scanning electron microscope (JSM-35) and analyzed by EPMA (Electron probe microanalyzer). The following results were obtained. 1. In low copper lathe-cut amalgam, the crack went through the voids and ${\gamma}_2$ phase, through the ${\gamma}_1$ phase around the ${\gamma}$ particles. 2. In low copper spherical amalgam, it was observed that the crack passed through the ${\gamma}_2$ and ${\gamma}_1$ phase, and through the boundary between the ${\gamma}_1$ and ${\gamma}$ phase. 3. In high copper dispersant (Dispersalloy) amalgam, the crack was found to propagate at the interface between the ${\gamma}_1$ matrix and reaction ring around the dispersant (Ag-Cu) particles, and to pass through the Ag-Sn particles. 4. In high copper single composition (Tytin) amalgam, the crack went through the ${\gamma}_1$ matrix between ${\eta}$ crystals, and through the unreacted alloy particle (core).

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초음파 나노 결정 표면개질된 SCM435의 특이한 피로 파괴 특성 (Peculiar Fatigue Fracture Behavior of Ultrasonic Nanocrystal Surface Modified SCM435)

  • 김재훈;윤서현;남기우
    • 한국산업융합학회 논문집
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    • 제25권2_2호
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    • pp.239-245
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    • 2022
  • Using the fatigue limit (∆σunsm) and residual stress (σr) of the UNSM smooth specimen, the harmless maximum crack depth (ahlm) according to the crack aspect ratio (As) was evaluated. In addition, the relationship between the minimum crack depth (aNDI1, aNDI2) detectable by non-destructive inspection(NDI), the crack depth (a25, a50) that reduces the fatigue limit by 25% and 50%, and ahlm were evaluated. The harmless crack condition was determined by the deepest crack point (point A). Since ahlm is larger than a25 and a50, a25 and a50 can secure the safety and reliability of steel via UNSM. Because aNDI1 and aNDI2 are larger than a25 and a50, cracks in a25 and a50 cannot be detected by non-destructive testing. Therefore it is necessary to apply more precise NDI.

수화발열량차 및 열전달계수 변화를 고려한 매스콘크리트의 수화열 해석 (Hydration Heat Analysis of Mass Concrete considering Heat Transfer Coefficient and Hydration Heat Difference)

  • 한승백;이성수;신효범;김호수
    • 한국콘크리트학회:학술대회논문집
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    • 한국콘크리트학회 2008년도 추계 학술발표회 제20권2호
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    • pp.249-252
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    • 2008
  • 최근 대규모화된 건축 구조물에서 매스콘크리트 형식의 구조체가 많이 적용됨에 따라 수화열에 의한 온도균열의 발생이 가장 큰 문제점으로 대두되고 있다. 매스콘크리트의 온도균열은 타설 후 시멘트의 수화열에 의한 온도상승 및 강하에 따라 생기는 체적변화가 내부 또는 외부적으로 구속을 받아 발생하는 것으로, 이를 제어하기 위한 수화열 저감대책이 필요하다. 따라서 본 연구에서는 저발열배합 및 수화발열량차를 이용하여 분할타설된 매스콘크리트를 대상으로 양생조건에 따른 열전달계수 변화를 고려한 수화열 해석을 수행한다. 이를 위한 해석모델은 분할타설을 고려하여 상부층은 일반콘크리트를 타설하고 하부층은 저발열배합 콘크리트를 타설한다. 분할타설된 매스콘크리트는 외기노출 부분과 거푸집 부분, 양생조건부분이 다르기 때문에 그에 따른 대류경계조건을 설정한다. 이에 따라 저발열배합 및 분할타설, 열전달계수 변화 등을 고려한 수화열 해석결과를 통해 온도분포 및 응력분포를 확인하고, 온도균열저감효과를 분석한다.

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카본 도포에 따른 Cu-Epoxy 접촉면에서 발생하는 크랙방지에 관한 연구 (A Study on the Prevention of Crack Generated in Interface Cu and Epoxy with Painting of Carbon)

  • 송재주;김성훈;황종선;박종광;한병성
    • 한국전기전자재료학회논문지
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    • 제14권7호
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    • pp.578-583
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    • 2001
  • The bushing for high voltage and large and power should endure weight of itself and force of pushing from contact with circuit breaker. Like this, epoxy mold bushing has to be strong without fault. However, the external circumstances and internal factors was caused by partial discharge, flashover and dielectric breakdown. Therefore, to remove external factor of defect and to prevent the internal cracks and cavity generated from the contraction on interface of Cu-Epoxy, we should form semi-conductive layer on Cu bar by carbon. Then, the PD properties and the insulation qualities of epoxy mold type bushing was able to improved by roles of cushions for the direction of diameter and by effects fo natural sliding like as separated from conductor for the direction of length. So, in this work, we could prove the method of semi-conductive layer in making the long conductor.

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원형포밍 성형 시 크랙 발생 최소화 방안에 관한 연구 (A Study on the cracks ways minimizing at circular forming)

  • 손종민;김세환;이춘규
    • Design & Manufacturing
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    • 제10권3호
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    • pp.20-24
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    • 2016
  • Foaming is a step of forming by the ratio of the internal combustion chamber in a state where the in flow of the material is suppressed, if the diameter is small and a high to a crack generated on the molding is not possible. The present study, we studied using as part experiments for forming the circular shape of the forming height of 10 mm without the occurrence of cracks, results preformed primary, the need to set the height of the forming than the height of the product, preformed secondary. It was able to increase the height of the molded product with less than the height of the next step to be carried out compression processing to create a small comer of the desired shape. In addition, it was found that on a great influence on the quality of the final quality on the final molding of the primary preformed, secondary.