• 한국분무공학회지
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• 제2권4호
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• pp.29-35
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• 1997

Liquid film thickness is measured by $moir\acute{e}$ topography which monitored liquid surface. $Moir\acute{e}$ fringe measurement techniques share the inherent simplicity found in optical interferometric techniques have the advantage of use over a greater range of displacement. $Moir\acute{e}$ fringe are the geometric interference patterns observed when two dense line grating are superposed. Light transmitted through a fixed line grating is deviated by the liquid film surface, producing a distored image of the grating. The $moir\acute{e}$ fringe produced by projection of this optically distored grating onto a second stationary grating permit visualization of the liquid surface and measurement of the liquid film thickness. This study measured the small amplitude of liquid film thickness to the $moir\acute{e}$ fringe pattern produced when spherical metal was dropped glycerin put)1 And the measurement of liquid film thickness flowing down an inclined plate are required to calculate the liquid slope in a position.

• 한국정밀공학회지
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• 제22권4호
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• pp.7-12
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• 2005

• Journal of the Optical Society of Korea
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• 제18권5호
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• pp.500-506
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• 2014

A new 3-D reconstruction algorithm for the human face is proposed using the derivative Moir$\acute{e}$ topography which ensures fast and robust reconstruction even for rough surfaces. The Moir$\acute{e}$ interference fringe pattern is initially obtained through the projection Moir$\acute{e}$ topography based on phase shifting, and then differentiated to provide a full unwrapped phase map for a human face. $2{\pi}$ ambiguity, which has been a chronically unsolved problem with Moir$\acute{e}$ topography, is successfully surmounted by differentiating the Moir$\acute{e}$ fringe patterns both in x- and y-directions when the object is located in the x-y plane. A real human face is used for verifying the proposed derivative Moir$\acute{e}$ topography. A human face of 4 different phase-shifted images taken in the fixed plane is almost fully reconstructed in 3-D format in 0.1 mm lateral resolution.

• 마이크로전자및패키징학회지
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• 제24권1호
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• pp.57-65
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• 2017

모바일 기기 내부에 있는 전자부품들은 반도체 칩이나 그 밖의 여러 가지 재료로 구성되어 있다. 이러한 전자부품들은 매우 얇고, 구성된 재료들은 다양한 열팽창 계수를 가지고 있으므로 온도 변화나 외부 하중에 의해서 쉽게 굽힘이 일어난다. 그림자 무아레 방법은 비접촉으로 전체 영역에 걸친 면외변위를 측정하는 광학적 방법이지만 측정 감도를 $50{\mu}m/fringe$ 이내로 하기 어려워서 반도체 패키지의 굽힘변형을 측정하기에는 적당하지 않은 면이 있었다. 본 논문에서는 그림자 무아레 기법의 여러 실험조건들을 최적화하여 $25{\mu}m/fringe$의 향상된 감도를 갖는 측정 방법을 구현하였다. 또한 이로부터 위상이동에 의해 기록되는 4장의 그림자 무늬를 영상 처리하여 감도가 4배 향상된 그림자 무늬를 얻어내고 이를 스마트폰의 소형 전자부품들에 적용하여 온도변화에 따라 발생하는 굽힘 변위를 $5{\mu}m/fringe$의 고감도로 측정하였다.

• 대한기계학회논문집A
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• 제32권2호
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• pp.186-193
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• 2008

[ $Moir{\acute{e}}$ ] interferometry is an optical method, providing whole field contour maps of in-plane displacements with high resolution. The demand for enhanced sensitivity in displacement measurements leads to the technique of microscopic $moir{\acute{e}}$ interferometry. The method is an extension of the $moir{\acute{e}}$ interferometry, and employs an optical microscope for the required spatial resolution. In this paper, the sensitivity of $moir{\acute{e}}$ interferometry is enhanced by an order of magnitude using an immersion interferometry and the optical/digital fringe multiplication(O/DFM) method. In fringe patterns, the contour interval represents the displacement of 52 nm per fringe order. In order to estimate the reliability and the applicability of the optical system implemented, the measurements of rigid body displacements of grating mold and the coefficient of thermal expansion(CTE) for an aluminium block are performed. The system developed is applied to the measurement of thermal deformation in a flip chip plastic ball grid array package.

• 한국정밀공학회지
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• 제23권11호
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• pp.34-41
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• 2006

Nanoimprint lithography is an emerging technology which has an ability to make patterns under 100nm width. Recently many researches have been focused to develop multilayer patterning function in nanoimprint lithography and aligning method is attracting attention as a key technology. $Moir\'{e}$ has been used widely to measure dislocation or deformation of objects and considered one of the best solutions to detect aligning error in nanoimprint lithography. Concentric circular patterns are used to generate a $moir\'{e}$ fringe in this paper and aligning offset and direction are extracted from it. Especially this paper shows the difference of fringe equation of $moir\'{e}$ which can be obtained in nanoimprint process atmosphere from normal one.

• 마이크로전자및패키징학회지
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• 제22권3호
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• pp.57-65
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• 2015

반도체 패키지는 여러 가지 다양한 재료로 구성되어 있으며, 제조시나 사용 환경에서 온도가 변하면 각 재료의 열팽창 계수의 차이로 인하여 굽힘변형이 발생하게 된다. 그림자 무아레 방법은 비접촉으로 전체 영역에 걸친 면외변위를 측정하는 광학적 방법이지만 측정 감도가 $50{\mu}m/fringe$ 이상이어서 반도체 패키지의 굽힘변형을 측정하기에는 적당하지 않은 면이 있었다. 본 논문에서는 그림자 무아레 시스템에 위상이동 기법을 적용하여 $12.5{\mu}m/fringe$의 향상된 감도를 갖는 측정장치를 구성하였다. 그림자 무아레 측정에서 나타나는 탈봇 현상을 고려하여 1/2 탈봇 영역에서 변형을 측정할 수 있도록 실험을 수행하였다. 위상이동에 의해 기록되는 4장의 그림자 무늬를 영상처리하여 감도가 4배 향상된 그림자 무늬를 얻어내었다. 본 논문에서 개발한 측정방법을 기존의 섬유강화 패키지 기판과 무섬유 패키지 기판에 적용하여 상온과 약 $100^{\circ}C$의 환경에서 발생하는 굽힘변형을 측정하였다.

• 한국정밀공학회지
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• 제22권7호
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• pp.88-93
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• 2005

$Moir\acute{e}$ topography method is a well-known non-contacting 3-D measurement method. Recently, the automatic 3-D measurement by $Moir\acute{e}$ topography has been required, since the method was frequently applied to the engineering and medical fields. The 3-D measurement using projection $Moir\acute{e}$ topography is very attractive because of its high measuring speed and high sensitivity. In this paper, using two-wavelength method of projection $Moir\acute{e}$ topography was tested to measuring object with $2\pi-ambiguity$ problems. The experimental results prove that the proposed scheme is capable of finding absolute fringe orders, so that the $2\pi-ambiguity$ problems can be effectively overcome so as to treat large step discontinuities in measured objects.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2003년도 추계학술대회
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• pp.1027-1032
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• 2003

Thermo-mechanical behavior of flip-chip plastic ball grid array (FC-PBGA) packages are characterized by high sensitive $Moir{\acute{e}}$ interferometry. $Moir{\acute{e}}$ fringe patterns are recorded and analyzed for several temperatures. Deformation analysis of bending displacements of the packages and average strains in the solder balls for a single-sided package assembly and a double-sided package assembly are presented. The bending displacement of the double-sided package assembly is smaller than that of the single-sided one. The largest of effective strain occurred in the solder ball located at the edge of the chip and its magnitude of the double-sided package assembly is greater than that of single-sided one.

• 대한기계학회논문집A
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• 제23권7호
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• pp.1129-1138
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• 1999

[$Moir\acute{e}$] technique is now being extensively investigated as a fast non-contact means of three-dimensional profile measurement especially for reverse engineering. One problem with $moir\acute{e}$ technique is so called $2\pi$-ambiguity problem that limits the maximum step height difference between two neighboring sampling points to be less than half the equivalent wavelength of $moir\acute{e}$ fringes. In this investigation, a new two-wavelength scheme of projection $moir\acute{e}$ topography is proposed and tested to cope with the $2\pi$-ambiguity problem. Experimental results are discussed to assess the new method in measuring large objects with high step discontinuities.