• The Journal of Korean Institute of Communications and Information Sciences
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• v.39C no.3
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• pp.234-238
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• 2014

Multichip packaging was achieved the best solution to significantly reduce thermal resistance at the same time, to increase luminance intensity in LEDs packaging application. For the packaging, thermal spreading resistance is an important parameter to get influence the total thermal performance of LEDs. In this study, silicon-based multichip light emitting diodes (LEDs) packaged module has been examined for thermal characteristics in several parameters. Compared to the general conventional single LED packaged chip module, multichip LED packaged module has many advantages of low cost, low density, small size, and low thermal resistance. This analyzed module is comprised of multichip LED array, which consists of 32 LED packaged chips with supplement power of 0.2 W at every single chip. To realize the extent of thermal distribution, the computer-aided design model of 6.4 W Si-based multichip LED module was designed and was performed by the simulation basis of actual fabrication flow. The impact of thermal distribution is analyzed in alternative ways both optimizing numbers of fins and the thickness of that heatsink. In addition, a thermal resistance model was designed and derived from analytical theory. The optimum simulation results satisfies the expectations of the design goal and the measurement of IR camera results. tart after striking space key 2 times.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.32A no.5
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• pp.737-748
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• 1995

In this paper, we studyed the variables in the design of multichip memory modules with 4M$\times$1bit DRAM chips to construct high capacity and high speed memory modules. The configuration of the module was 8 bit, 16 bit, and 32 bit DRAM modules with employing 0.6 W, 70 nsec 4M$\times$1 bit DRAM chips. We optimized routing area and wiring density by performing the routing experiment with the variables of the chip allocation, module I/O terminal, the number of wiring, and the number of mounting side of the chips. The multichip module was designed to be able to accept MCM-L techiques and low cost PCB materials. The module routing experiment showed that it was an efficient way to align chip I/O terminals and module I/O terminals in parallel when mounting bare chips, and in perpendicular when mounting packaged chips, to set module I/O terminals in two sides, to use double sided substrates, and to allocate chips in a row. The efficient number of wiring layer was 4 layers when designing single sided bare chip mounting modules and 6 layers when constructing double sided bare chip mounting modules whereas the number of wiring layer was 3 layers when using single sided packaged chip mounting substrates and 5 layers when constructing double sided packaged chip mounting substrates. The most efficient configuration was to mount bare chips on doubled substrates and also to increase the number of mounting chips. The fabrication of memory multichip module showed that the modules with bare chips can be reduced to a half in volume and one third in weight comparing to the module with packaged chips. The signal propagation delay time on module substrate was reduced to 0.5-1 nsec.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.31A no.3
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• pp.28-39
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• 1994

We experimented on memory multichip modules to increase the packing density of memory devices and to improve their electrical characteristics. A 128K$\times$8bit SRAM module was made of four 32K$\times$8bit SRAM memory chips. The memory multichip module was constructed on a low-cost double sided PCB(printed circuit boared) substrate. In the process of fabricating a multichip module. we focused on the improvement of its electrical characteristics. volume, and weight by employing bare memory chips. The characteristics of the bare chip module was compared with that of the module with four packaged chips. We conducted circuit routing with a PCAD program, and found the followings: the routed area for the module with bare memory chips reduced to a quarter of that area for module with packaged memory chips. 1/8 in volume, 1/5 in weight. Signal transmission delay times calculated by using transmission line model was reduced from 0.8 nsec to 0.4 nsec only on the module board, but the coupling coefficinet was not changed. Thus, we realized that the electrical characteristics of multichip packages on PCB board be improved greatly when using bare memory chips.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.17 no.4
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• pp.8-12
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• 2003

Characteristics of optical transceiver module in radio frequency(RF) band were investigated with TO-can packaged Fabry-Perot laser diode(FP-LD). R-L-C parameters for equivalent circuit model of the LD were extracted with an impedance analyzer. With this model, impedance matching to the packaged LD could be performed by eliminating inductive components of the leads in the package by using lumped chip capacitors that have opposite reactance, while it shows resonance dip in low frequency band. The resonance dip could be removed using lumped elements for impedance matching by shifting the resonance frequency to the region out of interest.

• Structural Engineering and Mechanics
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• v.69 no.4
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• pp.407-416
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• 2019

This paper develops a wireless sensor for online fatigue crack detection and failure warning based on crack-induced nonlinear ultrasonic modulation. The wireless sensor consists of packaged piezoelectric (PZT) module, an excitation/sensing module, a data acquisition/processing module, a wireless communication module, and a power supply module. The packaged PZT and the excitation/sensing module generate ultrasonic waves on a structure and capture the response. Based on nonlinear ultrasonic modulation created by a crack, the data acquisition/processing module periodically performs fatigue crack diagnosis and provides failure warning if a component failure is imminent. The outcomes are transmitted to a base through the wireless communication module where two-levels duty cycling media access control (MAC) is implemented. The uniqueness of the paper lies in that 1) the proposed wireless sensor is developed specifically for online fatigue crack detection and failure warning, 2) failure warning as well as crack diagnosis are provided based on crack-induced nonlinear ultrasonic modulation, 3) event-driven operation of the sensor, considering rare extreme events such as earthquakes, is made possible with a power minimization strategy, and 4) the applicability of the wireless sensor to steel welded members is examined through field and laboratory tests. A fatigue crack on a steel welded specimen was successfully detected when the overall width of the crack was around $30{\mu}m$, and a failure warnings were provided when about 97.6% of the remaining useful fatigue lives were reached. Four wireless sensors were deployed on Yeongjong Grand Bridge in Souht Korea. The wireless sensor consumed 282.95 J for 3 weeks, and the processed results on the sensor were transmitted up to 20 m with over 90% success rate.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.33A no.3
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• pp.140-151
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• 1996

In this paper, we analyze the variations of thermal characteristics of LD (laser diode) arrays packaged by a flip-chip bonding method. When we simulate the temperature distribution in LD arrays with a BEM (boundary element method) program coded in this paper, we find that thermal crosstalks in LD arrays packaged by the flip-chip bonding method increases by 250-340% compared to that in LD arrays packaged by previous methods. In the LD array module packaged by the flip-chip bonding technique without TEC (thermo-electric cooler), the important parameter is the absolute temperature of the active layer increased due cooler), the important parameter is the absolute temperature of th eactiv elayers of LD arrays to thermal crosstalk. And we find that the temperature of the active layers of LD arrays increases up to 125$^{\circ}C$ whenall four LDs, without a carefully designed heatsink, are turned on, assuming the power consumption of 100mW from each LD. In order to reduce thermal crosstalk we propose a heatsink sturcture which can decrease the temeprature at the active layer by 40%.

• Journal of Hydrogen and New Energy
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• v.30 no.3
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• pp.243-250
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• 2019

In this study, to ensure the safety of the packaged hydrogen refueling system, the improvement plan was derived by using 3-dimensional CFD program (FLACS). We also confirmed the effectiveness of risk reduction and the suitability of safety standard. By ventilation performance evaluation according to the position of the vent, it demonstrated that the vent should be installed at the ceiling to safely ventilate without stagnation of the leaked gas. In case of ventilation system according to KGS standard, risk situation could be resolved after about 5 minutes in the worst leaked condition. The result showed that jet fire and explosion inside the packaged system could affect the surrounding facilities. This proves that the standard for installing flame detectors, emergency shut down system and protection wall is appropriate.

• 제어로봇시스템학회:학술대회논문집
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• 2005.06a
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• pp.2414-2417
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• 2005

Compact Camera Module(CCM) is widely used in PDA, Celluar phone and PC web camera. With the greatly increasing use for mobile applications, there has been a considerable demands for high speed production of CCM. The major burden of production of CCM is assembly of lens module onto CCD or CMOS packaged circuit board. After module is assembled, the CCM is inspected. In this paper, we developed the image capture board for CCM and the imaging processing algorithm to inspect the defects in captured image of assembled CCMs. The performances of the developed inspection system and its algorithm are tested on samples of 10000 CCMs. Experimental results reveal that the proposed system can focus the lens of CCM within 5s and we can recognize various types of defect of CCM modules with good accuracy and high speed.

• Proceedings of the KSRS Conference
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• v.1
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• pp.267-270
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• 2006

COMS has two imaging payloads, MI (Meteorological Imager) and GOCI (Geostationary Ocean Colour Imager). In GOCI case, data are packaged per each slot - one part of 16 two-dimensional arrays for imaging sensors - so its generation algorithm is simple. But MI case, data are made up with sequences of 480 bit blocks and are transmitted to its ground station sequentially. Moreover there is no time information in each 480 bit MI block, so a system in its ground system should be attaching time information at received MI blocks. DM (Decomposition Module) is one module of IMPS that receives Raw Data from DATS and generates Level 0 Products that include time tagging. This paper explains DM design for MI of COMS payloads.

• Korean Journal of Optics and Photonics
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• v.11 no.3
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• pp.179-186
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• 2000

Optical coupling coefficients and misalignment tolerance of 155 Mbps optical transmitter module of passive alignment technology, to be usable in ATM system, B-NT (Broadband Network Termination) system, and 10 G transmission system for information super-highway networks, were calculated, compaired with it's engineer samples, and discussed. These engineer samples of -4.5 dBm maximum output power were packaged in the method of butt coupling of flat-fiber and tested reliability evaluation. Hence the cheap packaging method of optical transmitter module was researched. rched.