• Clean Technology
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• v.29 no.4
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• pp.244-248
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• 2023

Recently, displays play an important role in quickly delivering a lot of information. Research is underway to reproduce various colors close to natural colors. In particular, research is being conducted on the light emitting structure of displays as a method of expressing accurate and rich colors. Due to the advancement of technology and the miniaturization of devices, the need for small but high visibility displays with high efficiency in energy consumption continues to increase. Efforts are being made in various ways to improve OLED efficiency, such as improving carrier injection, structuring devices that can efficiently recombine electrons and holes in a numerical balance, and developing materials with high luminous efficiency. In this study, the electrical and optical properties of the seven-layer stacked structure rear-light emitting blue OLED device were analyzed. 4,4'-Bis(carazol-9-yl)biphenyl:Ir(difppy)2(pic), a blue light emitting material that is easy to manufacture and can be highly efficient and brightened, was used. OLED device manufacturing was performed via the in-situ method in a high vacuum state of 5×10-8 Torr or less using a Sunicel Plus 200 system. The experiment was conducted with a seven-layer structure in which an electron or hole blocking layer (EBL or HBL) was added to a five-layer structure in which an electron or hole injection layer (EIL or HIL) or an electron or hole transport layer (ETL or HTL) was added. Analysis of the electrical and optical properties showed that the device that prevented color diffusion by inserting an EBL layer and a HBL layer showed excellent color purity. The results of this study are expected to greatly contribute to the R&D foundation and practical use of blue OLED display devices.

• Proceedings of the KIPE Conference
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• 2003.11a
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• pp.214-217
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• 2003

The connectorless power supply system on that multi-contact causes confidence when the wiring reconstructed in the rear. As you see above, contact points between sets and indoor space cause inferior function of audio frequency so it needs to be eliminated. This paper explains the structure of connectorless power supply to supply the system with power crossing the air gap in the part of inductively in the connectorless power supply of both magnetic and electrical model. To get maximum output of electrical load, compensating capacitor compensates to show inter-inductance, lequeage-inductance reducing the track-inductance and access the conditions for resonance. At that time it accesses the maximum electric power. The small change of the value of compensating capacitor causes the changes of maximum electric power. Here the power electronics technology is used not only in the industrial machinery but also in the home appliances so the switching power supply is used to actualize the miniaturization, lightweight, and high efficiency. Generally the condenser input methods are widely used in the rectification circuit of switching power supply, but condenser input method generate great quantity of high frequency components because with this method the current flows in the power input filtering condenser only around value of peak of ac input voltage. To solve these problems, installation of power factor improve circuit on the front of filtering capacitence was considered. Several methods were suggested regarding, but the active filter method which makes smalliging and highly power factor possible are the produce main stream. IC for power factor improvement can be utilized by CMOS process proposing low power consumption. When the high power factor is considered seriously in the power factor improvement circuit, active filter method is selected. In the active filter method, the boost converter is used. Regarding this ·the boost converter is needed.

• Resources Recycling
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• v.11 no.5
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• pp.30-33
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• 2002

Recently in the progress of electronic equipment, power transformer was considered an important part. To make power transformer with miniaturization, lightening, low Power, we need a high efficiency core material. In this paper, we added $V_2$$O_{5}$ and $CaCo_3$ to Mn-Zn Ferrite to make a high efficiency, low loss core material. The compositions are MnO : ZnO : $Fe_2$$O_3$=37 : 11 : 52 mol%. They were sintered at 1250 for Three hours. Initial permeability was measured at 0.1 MHz. At 200 mT, Power loss was measured by temperature changing at 25 KHz, 50 KHz, 100 KHz. When we added $V_2$$O_{5}$ and $CaCo_3$, 0.08 wt%, 0.05 wt% respectively, we get 415 ㎾/㎥ at 200 mT, 100 KHz, $60^{\circ}C$. We can reduce eddy current loss as a main loss of high frequency by addition of a little mount of $V_2$$O_{5}$ $CaCo_3$. So we can decrease the power transformer's power loss.

• KIEE International Transactions on Electrophysics and Applications
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• v.5C no.3
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• pp.102-110
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• 2005

Piezoelectric transformers(PT) are expected to be small, thin and highly efficient, and which are attractive as a transformer with high power density for step down voltage. For these reasons, we have attempted to develop a step-down PT for the miniaturized adaptor. We propose a PT, operating in thickness extensional vibration mode for step-down voltage. This PT consists of a multi-layered construction in the thickness direction. In order to develop the step-down PT of 10 W class and turn ratio of 0.1 with high efficiency and miniaturization, the piezoelectric ceramics and PT designs are estimated with a variety of characteristics. The basic composition of piezoelectric ceramics consists of ternary yPb(Zr$_{x}$Ti$_{1-x}$)O$_{3}$-(1-y)Pb(Mn$_{1/3}$Nb1$_{1/3}$Sb$_{1/3}$)O$_{3}$. In the piezoelectric characteristics evaluations, at y=0.95 and x=0.505, the electromechanical coupling factor(K$_{p}$) is 58$\%$, piezoelectric strain constant(d$_{33}$) is 270 pC/N, mechanical quality factor(Qr$_{m}$) is 1520, permittivity($\varepsilon$/ 0) is 1500, and Curie temperature is 350 $^{\circ}C$. At y = 0.90 and x = 0.500, kp is 56$\%$, d33 is 250 pC/N, Q$_{m}$ is 1820, $\varepsilon$$_{33}$$^{T}$/$\varepsilon$$_{0}$ is 1120, and Curie temperature is 290 $^{\circ}C$. It shows the excellent properties at morphotropic phase boundary regions. PZT-PMNS ceramic may be available for high power piezoelectric devices such as PTs. The design of step-down PTs for adaptor proposes a multi-layer structure to overcome some structural defects of conventional PTs. In order to design PTs and analyze their performances, the finite element analysis and equivalent circuit analysis method are applied. The maximum peak of gain G as a first mode for thickness extensional vibration occurs near 0.85 MHz at load resistance of 10 .The peak of second mode at 1.7 MHz is 0.12 and the efficiency is 92$\%$.

• Journal of the Korea Convergence Society
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• v.8 no.11
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• pp.43-48
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• 2017

Semiconductors are leading the development of industrial technology, leading to miniaturization and weight reduction of electronic products as a leading technology, we are dragging the electronic industry market Especially, the semiconductor manufacturing process is composed of highly accurate and complicated processes, and effective production is required Recently, a vision system combining a computer and a camera is utilized for defect detection In addition, the demand for a system for measuring the shape of a fine pattern processed by a special process is rapidly increasing. In this paper, we propose a vision algorithm using mask image to detect scratch defect of semiconductor pockage. When applied to the manufacturing process of semiconductor packages via the proposed system, it is expected that production management can be facilitated, and efficiency of production will be enhanced by failure judgment of high-speed packages.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.53-58
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• 2013

An innovative packaging solution, Flip Chip with Copper (Cu) Column bond on lead (BOL) Enhanced Process (fcCuBE$^{(R)}$) delivers a cost effective, high performance packaging solution over typical bond on capture pad (BOC) technology. These advantages include improved routing efficiency on the substrate top layer thus allowing conversion functionality; furthermore, package cost is lowered by means of reduced substrate layer count and removal of solder on pad (SOP). On the other hand, as electronic packaging technology develops to meet the miniaturization trend from consumer demand, reliability testing will become an important issue in advanced technology area. In particular, electromigration (EM) of flip chip bumps is an increasing reliability concern in the manufacturing of integrated circuit (IC) components and electronic systems. This paper presents the results on EM characteristics on BOL and BOC structures under electrical current stressing in order to investigate the comparison between two different typed structures. EM data was collected for over 7000 hours under accelerated conditions (temperatures: $125^{\circ}C$, $135^{\circ}C$, and $150^{\circ}C$ and stress current: 300 mA, 400 mA, and 500 mA). All samples have been tested without any failures, however, we attempted to find morphologies induced by EM effects through cross-sectional analysis and investigated the interfacial reaction characteristics between BOL and BOC structures under current stressing. EM damage was observed at the solder joint of BOC structure but the BOL structure did not show any damage from the effects of EM. The EM data indicates that the fcCuBE$^{(R)}$ BOL Cu column bump provides a significantly better EM reliability.

• The Transactions of the Korean Institute of Electrical Engineers P
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• v.63 no.4
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• pp.361-367
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• 2014

This paper is related to a new solar power conditioner for a built-in step-up chopper function. In the first step-up chopper proposed solar PV power conditioner for mutually connected in series with the input voltage of the bypass diodes are respectively connected to the positive terminal should install the mutual boosting chopper diode connected in series with the boost chopper switching element between the two power supply and at the same time the first and the second was connected to a second diode and a resonance inductor and a snubber capacitor in series with each other. And the common connection point between the bypass diode and the step-up chopper and the step-up chopper diode common connection point of the switching elements of the input voltage was set to the boost inductor for storing energy. In addition, between the step-up chopper and the step-up chopper diode and a switching element of a joint connection point of the first auxiliary diode and the second common connection point of the auxiliary diode was provided, the resonance capacitor. Between the step-up chopper and the step-up chopper diode and a switching element of a joint connection point and the common connection point of the resonance inductor snubber capacitor and connecting the third secondary diode, between two power supply lines is characterized by configuring the DC link capacitor bus lines in parallel. Therefore, it is possible to suppress the switching loss through, DC link bus lines, as well as there could seek miniaturization and weight reduction of the power conditioner itself by using a common capacitor of the non-polar non-polar electrolytic capacitor having a capacitor, the service life of the circuit can be extended and it is possible to greatly reduce the loss can be greatly improve the reliability of the product and the operation of the product itself.

• Journal of the Institute of Electronics Engineers of Korea TE
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• v.37 no.1
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• pp.63-69
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• 2000

The high-$T_c$ Superconducting (HTS) antenna which consists of "H" type resonator has the benefits for the miniaturization of antenna in comparison with the microstrip antenna of the similar dimension. To fabricate the "H" type antenna, HTS $YBa_2Cu_3O_{7-x}$ (YBCO) thin films were deposited on MgO substrates using rf-magnetron sputtering. Standard etching processes were performed for the patterning of the "H" type antenna. For comparison between normal conducting antennas and superconducting antennas, the gold antennas with the same dimension were also fabricated. An aperture coupling was used for impedance matching between $50{\Omega}$ feed line and HTS radiating patch. The diverse experimental results were reported in terms of the resonant frequency, the return loss and the characteristics impedance. The "H" type superconducting antenna showed the performance of 1.36 in SWR, 24% in efficiency, and 14.6 dB in the return loss superior of the normal conducting counterpart.

• The Journal of the Korea institute of electronic communication sciences
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• v.13 no.5
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• pp.1093-1100
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• 2018

Fast progress in miniaturization and reducing power consumption of semiconductors for wearable devices makes it possible to develop extremely small wearable systems for various application services. This results recent wearable applications to be powered from extremely low-power energy harvesters based on solar, piezo, and TENG sources. In most cases, the harvesters generate power in non-linear manner. Therefore, we implemented and experimented the device platforms to utilize natural frequency of around 3Hz. We also designed two-stage power storages and high efficiency conversion platform to consider such non-linear power harvesting sources. The experiment showed power generation of about 4.67mW/min from these non-linear sources with provision of stable energy storages.

• Journal of the Korean Magnetics Society
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• v.21 no.2
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• pp.77-82
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• 2011

The use of soft magnetic materials have been increasing in the various industrial fields according to the increasing demand for high performance, automatic, miniaturing equipments in the recent our life. In this study, we investigated the effect of factors on the core loss and magnetic properties of electrical steel and soft magnetic composites. Furthermore, we reviewed the major efforts to reduce the core loss and improve the soft magnetic properties in the two main soft magnetic materials. Domain purification which results from reduced density of defects in cleaner electrical steels is combined with large grains to reduce hysteresis loss. The reduced thickness and the high electrical conductivity reduce the eddy current component of loss. Furthermore, the coating applied to the surface of electrical steel and texture control lead to improve high permeability and low core loss. There is an increasing interest in soft magnetic composite materials because of the demand for miniaturization of cores for power electronic applications. The SMC materials have a broad range of potential applications due to the possibility of true 3-D electromagnetic design and higher frequency operation. Grain size, sintering temperature, and the degree of porosity need to be carefully controlled in order to optimize structure-sensitive properties such as maximum permeability and low coercive force. The insulating coating on the powder particles in SMCs eliminates particle-to-particle eddy current paths hence minimizing eddy current losses, but it reduces the permeability and to a small extent the saturation magnetization. The combination of new chemical composition with optimum powder manufacturing processes will be able to result in improving the magnetic properties in soft magnetic composite materials, too.