• Title/Summary/Keyword: Migration reliability

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CloudSwitch: A State-aware Monitoring Strategy Towards Energy-efficient and Performance-aware Cloud Data Centers

  • Elijorde, Frank;Lee, Jaewan
    • KSII Transactions on Internet and Information Systems (TIIS)
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    • v.9 no.12
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    • pp.4759-4775
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    • 2015
  • The reduction of power consumption in large-scale datacenters is highly-dependent on the use of virtualization to consolidate multiple workloads. However, these consolidation strategies must also take into account additional important parameters such as performance, reliability, and profitability. Resolving these conflicting goals is often the major challenge encountered in the design of optimization strategies for cloud data centers. In this paper, we put forward a data center monitoring strategy which dynamically alters its approach depending on the cloud system's current state. Results show that our proposed scheme outperformed strategies which only focus on a single metric such as SLA-Awareness and Energy Efficiency.

Electro-migration Phenomenon in Flip-chip Packages (플립칩 패키지에서의 일렉트로마이그레이션 현상)

  • Lee, Ki-Ju;Kim, Keun-Soo;Suganuma, Katsuaki
    • Journal of the Microelectronics and Packaging Society
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    • v.17 no.4
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    • pp.11-17
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    • 2010
  • The electromigration phenomenon in lead-free flip-chip solder joint has been one of the serious problems. To understand the mechanism of this phenomenon, the crystallographic orientation of Sn grain in the Sn-Ag-Cu solder bump has been analyzed. Different time to failure and different microstructural changes were observed in the all test vehicle and bumps, respectively. Fast failure and serious dissolution of Cu electrode was observed when the c-axis of Sn grain parallel to electron flow. On the contrary of this, slight microstructural changes were observed when the c-axis of Sn perpendicular to electron flow. In addition, underfill could enhance the electromigration reliability to prevent the deformation of solder bump during EM test.

Design of Web-based Parallel Processing System using Performance-based Task Allocation (성능 기반 태스크 할당을 이용한 웹 기반 병렬처리 시스템의 설계)

  • Han, Youn-Hee;Park, Chan-Yeol;Jeong, Young-Sik;Hwang, Chong-Sun
    • Journal of KIISE:Computer Systems and Theory
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    • v.27 no.3
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    • pp.264-276
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    • 2000
  • Recent advances of technologies make easy sharing various information and utilizing system resources on the Internet. Especially, code migration using applets of Java supports the distribution of programs on the web environment, and also browsers executing the applets guarantee the reliability of a migrated codes. In this paper, we describe the design and implementation of a web-based parallel processing system, which distributes migratable codes of a large job, makes the distributed codes to execute in parallel, and controls and gathers the results of each execution. The hosts participate in the computation reside on the Internet, spreaded out geographically, and the heterogeneity and the variability among them are severe. Thus, task allocation considering the performance differences and the adaptability to the severe variability are necessary. We present an adaptive task allocation algorithm applied to our system and the performance evaluation.

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Current Status and Tasks of Contaminant Migration Experiment Using Underground Research Laboratory (지하연구시설을 이용한 오염물질 이동실험 현황 및 과제)

  • Park, Chung-Kyun;Baik, Min-Hoon;Choi, Jong-Won
    • Tunnel and Underground Space
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    • v.17 no.1 s.66
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    • pp.17-25
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    • 2007
  • Research and development for disposal of contaminants including radioactive wastes in deep underground have been carried out from laboratory works. However, validation and reliability of the data from the laboratory are arguing issues because they are not obtained from real disposal situations. Underground research laboratory (URL) is not only a solution to overcome such limitations, but also a valuable facility for performance assessment as an engineering scale. However, it requires much budget, and environmental issues can give rise to social conflicts easily. Such considering points related to URL are discussed as well as current status of worldwide URLs are introduced. Furthermore study plans for solute transport in a small-scale underground research tunnel (KURT), which was authorized recently as an non-radioactive facility in Korea, also described.

Reformation Methods of Environmental Impact Assessment in Water Resources Development Project by Examining Local Resident Opinions (수자원 개발사업 주민의견 유형분석을 통한 환경영향평가 개선방안)

  • Yang, Kee-Hyoun;Park, Jae-Chung;Ryu, Young-Han;Jeong, Yong-Moon;Song, Sang-Jin;Shin, Jae-Ki
    • Journal of Environmental Impact Assessment
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    • v.20 no.3
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    • pp.397-409
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    • 2011
  • This study was carried out for improving the effectiveness of water resources development project through local resident opinions in the environmental impact assessment(EIA). The EIA reports of seven dams were examined. Four dams -Youngju Dam, Seongduck Dam, Buhang Dam and Hantangang Dam- which included many local opinions including 470 opinions of 341 local residents were selected to be analyzed. Local residents submitted their opinions in the six fields which are meteorological phenomena, water quality, land use, fauna and flora, noise and vibration, and residence, and the major opinions of those opinions came from the atmosphere environment field which is 32% of total opinions and social and economic field which is 38% of total opinions, respectively. In submerged area, opinions of the measure for migration and compensation were 91% and in non-submerged area, opinions of the measure for meteorological phenomena was 86%. Those percentages were maximum in each area. Opinions concerned meteorological phenomena were 86% and 53% in Youngju Dam and Seongduck Dam where area is surrounded by existing dam, but there was only 9% and 0% of opinions in Buhang Dam and Hantangang Dam where area is without existing dam nearby. The reformation methods which reflected the resident's opinions were suggested on EIA in dam development projects. First of all, reliability and objectivity of the field of meteorological phenoma should be enhanced by scientific prediction of the phenomenon days. Secondly, techniques reducing uncertainty of various water quality prediction models ought to be developed and effectiveness of the reduction strategies in environmental impact should be quantified. Finally, the draft of EIA report should involve the detailed plans of migration and compensation's procedures, criteria and measures to support.

Charge Formation in PCB Insulations (PCB 절연체에서 전하 형성)

  • Lee, Joo-Hong;Choi, Yong-Sung;Hwang, Jong-Sun;Lee, Kyung-Sup
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.11a
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    • pp.264-265
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    • 2008
  • While the reliability of bulk insulation has become important particularly in multilayer boards and embedded boards, electronics are to be used under various environments such as at high temperature and in high humidity. We observed internal space charge behavior for two types of epoxy composites under dc electric fields to investigate the influence of water at high temperature. In the case of glass/epoxy specimen, homocharge is observed at water-treated specimen, and spatial oscillations become clearer in the water-treated specimens. Electric field in the vicinity of the electrodes shows the injection of homocharge. In aramid/epoxy specimens, heterocharge is observed at water-treated specimens, i.e. negative charge accumulates near the anode, while positive charge accumulates near the cathode. Electric field is enhanced just before each electrode. In order to further examine the mechanism of space charge formation, we have developed a new system that allows in situ space charge observation during ion migration tests at high temperature and high humidity. Using this in situ system.

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Characteristics of Sediment and Flow with Channel Patterns in Alluvial Rivers (충적하천(沖積河川)의 수로양상(水路樣相)에 따른 유사(流砂) 및 흐름특성(特性))

  • Lee, Jong Seok;Lee, Dae Cheol;Pai, Dong Man;Cha, Young Kee
    • KSCE Journal of Civil and Environmental Engineering Research
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    • v.14 no.5
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    • pp.1177-1189
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    • 1994
  • This paper aims to develop the numerical model for prediction of the channel migration by analyzing of sediment and flow characteristics with patterns of channel in alluvial rivers. Flow in rivers constitutes to be the meandering or the braided form and rarely straight channel through morphologically stable patterns with mutual actions between the flowing water and bed materials. In order to develop the model for simulation of the channel migration, the channels are divided into two types with positive or negative sign by the direction of curvature radius of the centerline channel ($r_c$). That is, the single bend-channel consists of only one curvature of positive or negative sign and the multi-bend channel consists of two more curvatures of positive or negative sign, respectively. The model analyzes the sediment and flow characteristics under the influence of superelevation, spiral motion, irregularity in bed topography and depth-averaged velocity of channels. For reliability of this model, the single bend-channel and the multi bend channel are compared with experiment data in other models and the measured field data in the Keum-River, respectively. As a result, the both com parisians turn out to be excellent.

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In-situ Analysis of Temperatures Effect on Electromigration-induced Diffusion Element in Eutectic SnPb Solder Line (공정조성 SnPb 솔더 라인의 온도에 따른 Electromigration 확산원소의 In-situ 분석)

  • Kim Oh-Han;Yoon Min-Seung;Joo Young-Chang;Park Young-Bae
    • Journal of the Microelectronics and Packaging Society
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    • v.13 no.1 s.38
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    • pp.7-15
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    • 2006
  • In-situ observation of electromigration in thin film pattern of 63Sn-37Pb solder was performed using a scanning electron microscope system. The 63Sn-37Pb solder had the incubation stage of electromigration for edge movement when the current density of $6.0{\times}10^{4}A/cm^2$ was applied the temperature between $90^{\circ}C\;and\;110^{\circ}C$. The major diffusion elements due to electromigration were Pb and Sn at temperatures of $90-110^{\circ}C\;and\;25-50^{\circ}C$, respectively, while no major diffusion of any element due to electromigration was detected when the test temperature was $70^{\circ}C$. The reason was that both the elements of Sn and Pb were migrated simultaneously under such a stress condition. The existence of the incubation stage was observed due to Pb migration before Sn migration at $90-110^{\circ}C$. Electromigration behavior of 63Sn-37Pb solder had an incubation time in common for edge drift and void nucleation, which seemed to be related the lifetime of flip chip solder bump. Diffusivity with $Z^*$(effective charges number) of Pb and Sn were strongly affect the electromigration-induced major diffusion element in SnPb solder by temperature, respectively.

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Effects of hydrogen and ammonia partial pressure on MOCVD $Co/TaN_x$ layer for Cu direct electroplating

  • Park, Jae-Hyeong;Mun, Dae-Yong;Han, Dong-Seok;Yun, Don-Gyu;Park, Jong-Wan
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2012.05a
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    • pp.84-84
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    • 2012
  • 소자가 고집적화 됨에 따라, 비저항이 낮고 electro migration (EM), Stress Migration (SM) 특성이 우수한 구리(Cu)를 배선재료로서 사용하고 있다. 그러나, 구리는 Si과 $SiO_2$의 내부로 확산이 빠르게 일어나, Si 소자 내부에 deep donor level을 형성하고, 누설 전류를 증가시키는 등 소자의 성능을 저하시킬 수 있는 문제점을 가지고 있다. 그러나, electroplating 을 이용하여 증착한 Cu 박막은 일반적으로 확산 방지막으로 쓰이는 TiN, TaN, 등의 물질과의 접착 (adhesion) 특성이 나쁘다. 따라서, Cu CMP 에서 증착된 Cu 박막의 벗겨지거나(peeling), EM or SM 저항성 저하 등의 배선에서의 reliability 문제를 야기하게된다. 따라서 Cu 와 접착 특성이 좋은 새로운 확산방지막 또는 adhesion layer의 필요성이 대두되고 있다. 본 연구에서는 이러한 Cu 배선에서의 접착성 문제를 해결하고자 Metal organic chemical vapor deposition (MOCVD)을 이용하여 제조한 코발트(Co) 박막을 $Cu/TaN_x$ 사이의 접착력 개선을 위한 adhesion layer로 적용하려는 시도를 하였다. Co는 비저항이 낮고, Cu 와 adhesion이 좋으며, Cu direct electroplating 이 가능하다는 장점을 가지고 있다. 하지만, 수소 분위기에서 $C_{12}H_{10}O_6(Co)_2$ (dicobalt hexacarbonyl tert-butylacetylene, CCTBA) 전구체에 의한 MOCVD Co 박막의 경우 탄소, 산소와 같은 불순물이 다량 함유되어 있어, 비저항, surface roughness 가 높아지게 된다. 따라서 구리 전착 초기에 구리의 핵 생성(nucleation)을 저해하고 핵 생성 후에도 응집(agglomeration)이 발생하여 연속적이고 얇은 구리막 형성을 방해한다. 이를 해결하기 위해, MOCVD Co 박막 증착 시 수소 반응 가스에 암모니아를 추가로 주입하여, 수소/암모니아의 분압을 1:1, 1:6, 1:10으로 변화시켜 $Co/TaN_x$ 박막의 특성을 비교 분석하였다. 각각의 수소/암모니아 분압에 따른 $Co/TaN_x$ 박막을 TEM (Transmission electron microscopy), XRD (X-ray diffraction), AES (Auger electron spectroscopy)를 통해 물성 및 조성을 분석하였고, AFM (Atomic force microscopy)를 이용하여, surface roughness를 측정하였다. 실험 결과, $Co/TaN_x$ 박막은 수소/암모니아 분압 1:6에서 90 ${\mu}{\Omega}-cm$의 낮은 비저항과 0.97 nm 의 낮은 surface roughness 를 가졌다. 뿐만 아니라, MOCVD 에 의해 증착된 Co 박막이4-6 % concentration 의 탄소 및 산소 함량을 가지는 것으로 나타났고, 24nm 크기의 trench 기판 위에 약 6nm의 $Co/TaN_x$ 박막이 매우 균일하게 형성된 것을 확인 할 수 있었다. 이러한 결과들은, 향후 $Co/TaN_x$ 박막이 Cu direct electroplating 공정이 가능한 diffusion barrier로서 성공적으로 사용될 수 있음을 보여준다.

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Deign of Small-Area Differential Paired eFuse OTP Memory for Power ICs (Power IC용 저면적 Differential Paired eFuse OTP 메모리 설계)

  • Park, Heon;Lee, Seung-Hoon;Jin, Kyo-Hong;Ha, Pan-Bong;Kim, Young-Hee
    • The Journal of Korea Institute of Information, Electronics, and Communication Technology
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    • v.8 no.2
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    • pp.107-115
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    • 2015
  • In this paper, a small-area 32-bit differential paired eFuse OTP memory for power ICs is designed. In case of smaller number of rows than that of columns for the OTP memory cell array, a scheme for the cell array reducing the number of SL driver circuits requiring their larger layout areas by routing the SL (source line) lines supplying programming currents for eFuse links in the row direction instead of the column direction as well as a core circuit is proposed. In addition, to solve a failure of being blown for non-blown eFuse links by the electro-migration phenomenon, a regulated voltage of V2V ($=2V{\pm}0.2V$) is used to a RWL (read word line) driver circuit and a BL (bit line) pull-up driver circuit. The layout size of the designed 32-bit eFuse OTP memory is $228.525{\mu}m{\times}105.435{\mu}m$, which is confirmed to be 20.7% smaller than that of the counterpart using the conventional cell array routing, namely $197.485{\mu}m{\times}153.715{\mu}m$.