• 한국재료학회지
• /
• 제27권10호
• /
• pp.513-517
• /
• 2017

An optimum route to fabricate a hybrid-structured W powder composed of nano and micro size powders was investigated. The mixture of nano and micro W powders was prepared by a ball milling and hydrogen reduction process for $WO_3$ and W powders. Microstructural observation for the ball-milled powder mixtures revealed that the nano-sized $WO_3$ particles were homogeneously distributed on the surface of large W powders. The reduction behavior of $WO_3$ powder was analyzed by a temperature programmed reduction method with different heating rates in Ar-10% $H_2$ atmosphere. The activation energies for the reduction of $WO_3$, estimated by the slope of the Kissinger plot from the amount of reaction peak shift with heating rates, were measured as 117.4 kJ/mol and 94.6 kJ/mol depending on reduction steps from $WO_3$ to $WO_2$ and from $WO_2$ to W, respectively. SEM and XRD analysis for the hydrogen-reduced powder mixture showed that the nano-sized W particles were well distributed on the surface of the micro-sized W powders.

• Korean Chemical Engineering Research
• /
• 제45권5호
• /
• pp.493-499
• /
• 2007

본 연구에서는 UV photo-lithography 방식의 particle replication in non-wetting templates(PRINT) 법을 이용하여 약물 전달에 운반체로 사용되는 $3{\mu}m{\times}3{\mu}m{\times}2{\mu}m$ 사이즈의 균일한 고분자 하이드로젤 입자를 제조하였다. 몰드(mold)와 기재(substrate)는 PRINT 방식을 통하여 탄성을 지닌 perfluoropolyethers(PFPE)로 제작하였으며 이를 반복적으로 사용할 수 있도록 하였다. 제작된 입자는 점착성이 있는 수용성 고분자를 이용하여 회수하였다. 입자의 주요 성분은 생분해성 고분자인 poly(ethylene glycol) diacrylate(PEG-diA)이며, 세포 uptake에 적합하도록 aminoethylacrylate(AEM)와 2-acryloxyethyltrimethyl ammonium chloride(AETMAC)를 첨가하였다. 본 연구를 통해 균일하고 원하는 크기의 생체분해성 고분자 입자를 제작하는 PRINT 기술이 약물 전달 및 유전자 전달에 필요한 수송체인 비바이럴 벡터를 제작하기 위한 효과적인 기술임을 제시하였다.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2001년도 추계학술대회 논문집 Vol.14 No.1
• /
• pp.185-188
• /
• 2001

Chemical mechanical polishing(CMP) process is widely used for global planarization of inter-metal dielectric (IMD) layer and inter-layer dielectric (ILD) for deep sub-micron technology. However, as the IMD and ILD layer gets thinner, defects such as micro-scratch lead to severe circuit failure, which affect yield. In this paper, for the improvement of CMP process, deionized water (DIW) pressure, purified $N_2 \; (PN_2)$ gas, slurry filter and high spray bar were installed. Our experimental results show that DIW pressure and $PN_2$ gas factors were not related with removal rate, but edge hot-spot of patterned wafer had a serious relation. Also, the filter installation in CMP polisher could reduce defects after CMP process, it is shown that slurry filter plays an important role in determining consumable pad lifetime. The filter lifetime is dominated by the defects. However, the slurry filter is impossible to prevent defect-causing particles perfectly. Thus, we suggest that it is necessary to install the high spray bar of de-ionized water (DIW) with high pressure, to overcome the weak-point of slurry filter. Finally, we could expect the improvements of throughput, yield and stability in the ULSI fabrication process.

• 한국전기전자재료학회논문지
• /
• 제13권9호
• /
• pp.729-734
• /
• 2000

Recently, Very Large Scale Integrated (VLSI) circuit & deep-submicron bulk Complementary Metal Oxide Semiconductor(CMOS) devices require gate electrode materials such as metal-silicide, Titanium-silicide for gate oxides. Many previous authors have researched the improvement sub-micron gate oxide quality. However, few have reported on the electrical quality and reliability on the ultra thin gate oxide. In this paper, at first, I recommand a novel shallow trench isolation structure to suppress the corner metal-oxide semiconductor field-effect transistor(MOSFET) inherent to shallow trench isolation for sub 0.1${\mu}{\textrm}{m}$ gate oxide. Different from using normal LOCOS technology deep-submicron CMOS devices using novel Shallow Trench Isolation(STI) technology have a unique"inverse narrow-channel effects"-when the channel width of the devices is scaled down, their threshold voltage is shrunk instead of increased as for the contribution of the channel edge current to the total channel current as the channel width is reduced. Secondly, Titanium silicide process clarified that fluorine contamination caused by the gate sidewall etching inhibits the silicidation reaction and accelerates agglomeration. To overcome these problems, a novel Two-step Deposited silicide(TDS) process has been developed. The key point of this process is the deposition and subsequent removal of titanium before silicidation. Based on the research, It is found that novel STI structure by the SEM, in addition to thermally stable silicide process was achieved. We also obtained the decrease threshold voltage value of the channel edge. resulting in the better improvement of the narrow channel effect. low sheet resistance and stress, and high threshold voltage. Besides, sheet resistance and stress value, rms(root mean square) by AFM were observed. On the electrical characteristics, low leakage current and trap density at the Si/SiO$_2$were confirmed by the high threshold voltage sub 0.1${\mu}{\textrm}{m}$ gate oxide.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
• /
• pp.50-53
• /
• 2003

CMP (chemical mechanical polishing) process remained to solve several problems in deep sub-micron integrated circuit manufacturing process. especially consumables (polishing pad, backing film, slurry, pad conditioner), one of the most important components in the CMP system is the slurry. Among the composition of slurries (buffer solution, bulk solution, abrasive particle, oxidizer, inhibitor, suspension, antifoaming agent, dispersion agent), the abrasive particles are important in determining polish rate and planarization ability of a CMP process. However, the cost of abrasives is still very high. So, in order to reduce the high COO (cost of ownership) and COC (cost of consumables) in this paper, we have collected the silica abrasive powders by filtering after subsequent CMP process for the purpose of abrasive particle recycling. And then, we have studied the possibility of recycle of reused silica abrasive through the analysis of particle size and hardness. Also, we annealed the collected abrasive powders to promote the mechanical strength of reduced abrasion force. Finally, we compared the CMP characteristics between self-developed KOH-based silica abrasive slurry and original slurry. As our experimental results, we obtained the comparable removal rate and good planarity with commercial products. Consequently, we can expect the saving of high cost slurry.

• Restorative Dentistry and Endodontics
• /
• 제29권4호
• /
• pp.378-385
• /
• 2004

The purpose of this study was to compare the effects of preparation with GT files and profiles .04 in shaping of root canals and reconstruct the three-dimensional root canal system using micro computed tomography 40 canals of the extracted human mandibular molars were used, and randomly distributed into two experimental groups. In group 1. canals were prepared by GT files. In group 2, Profiles .04. were used. Apical preparation size was #30. For each tooth pre and post operative cross-sectional images were obtained by the micro CT at 50 micron intervals. Pre and post operative cross-sectional images of 1, 2, 3, 5, and 8mm from the apex were compared. For each section. canal area and centering ratio were determined. For each tooth pre- and post-operative root canal volume from the furcation to the apex of the roots was calculated by three-dimensional image software. Following results were obtained: 1. At 8mm from the apex, area of dentin removed by GT rotary file was significantly larger than that by Profile .04. And at the other levels there was not a significant difference. 2. There was a trend for GT rotary file to remain more centered in the canals than Profile .04 at all levels. But at 3mm level. there was a statistically significant difference. 3. In root canal volume increments after instrumentation, there was no significant difference between two groups.

• 한국농업기계학회:학술대회논문집
• /
• 한국농업기계학회 2000년도 THE THIRD INTERNATIONAL CONFERENCE ON AGRICULTURAL MACHINERY ENGINEERING. V.II
• /
• pp.227-235
• /
• 2000

Agricultural products are easily deformable its shape because of some external forces. However, these force behavior is difficult to measure quantitatively. Until now, many researches on the mechanical property was performed with various methods such as material testing, chemical analysis and non-destructive methods. In order to investigate force behavior on the cellular unit of agricultural products, electro-microscope based 3D image processing method will contribute to analysis of plant cells behavior. Before image measurement of plant cells, plant sample was cut off cross-sectioned area in a size of almost 300-400 ${\mu}$ m units using the micron thickness device, and some of preprocessing procedure was performed with fixing and dyeing. However, the wall structure of plant cell is closely neighbor each other, it is necessary to separate its boundary pixel. Therefore, image merging and shrinking algorithm was adopted to avoid disconnection. After then, boundary pixel was traced through thinning algorithm. Each image from the electro-microscope has a information of x,y position and its height along the z axis cross sectioned image plane. 3D image was constructed using the continuous image combination. Major feature was acquired from a fault image and measured area, thickness of cell wall, shape and unit cell volume. The shape of plant cell was consist of multiple facet shape. Through this measured information, it is possible to construct for structure shape of unit plant cell. This micro unit image processing techniques will contribute to the filed of agricultural mechanical property and will use to construct unit cell model of each agricultural products and information of boundary will use for finite element analysis on unit cell image.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2006년도 춘계학술대회 논문집
• /
• pp.159-160
• /
• 2006

A novel approach to the manufacture of biocompatible ceramic scaffold for tissue engineering using micro-stereolithography system is introduced. Micro-stereolithography is a newly proposed technology that enables to make a 3D micro structure. The 3D micro structures made by this technology can have accurate and complex shape within a few micron error. Therefore, the application based on this technology can vary greatly in nano-bio fields. Recently, tissue-engineering techniques have been regarded as alternative candidate to treat patients with serious bone defects. So many techniques to design and fabricate 3D scaffolds have been developed. But the imperfection of scaffold such as random pore size and porosity causes a limitation in developing optimum scaffold. So scaffold development with controllable pore size and fully interconnected shape have been needed for a more progress in tissue engineering. In this paper, bone scaffold was developed by applying the micro-stereolithography to the mold technology. The scaffold material used was HA(Hydroxyapatite) nano powder. HA is a type of calcium phosphate ceramic with similar characteristic to human inorganic bone component. The bone scaffold made by HA is expected, in the near future, to be an efficient therapy for bone defect.

• 한국진공학회지
• /
• 제12권2호
• /
• pp.144-149
• /
• 2003

주사전자현미경을 이용한 전자빔의 직접조사에 의해 실리콘 캔틸레버 위에 탄소상 탐침을 성장하였다. 오일확산 펌프의 잔류가스 분위기에서 실리콘 캔틸레버와 전자빔을 수직으로 정렬한 다음 전자현미경의 스폿 모드를 통해 전자빔을 일정시간 동안 조사시켜 탄소상 탐침을 성장시켰다. 주사전자현미경의 제어변수인 조사시간, 가속전압, 방출 전류, 전자빔 프로브 전류 등을 변화시킴으로써 다양한 종횡비를 가지는 탐침을 성장시킬 수 있었으며, 성장 위치의 표면 형상과 무관하게 탐침을 성장시킬 수 있었다. 그 결과 유효길이 0.5 $\mu\textrm{m}$, 바닥직경 90 nm,콘의 반각 $3.5^{\circ}$인 탐침을 성장시켰다. 탐침이 없는 캔틸레버에 고종횡비 탄소상 탐침을 성장시킬 수 있는 기술은 PZT 박막구동기가 집적화된 AFM 캔틸레버의 탐침 형성 과정에서 발생하는 제작과정의 번거로움을 극복하는데 적용될 수 있다.

• 한국진공학회지
• /
• 제7권2호
• /
• pp.118-126
• /
• 1998

반도체 접촉구를 메우기 위하여 소오스의 직진성을 향상시키기 위한 연구를 수행하 였다. 이온화클러스터빔 증착법을 이용하는 동시에 셀의 구조를 개선하여 직진성 향상을 도 모하였다. 중성클러스터 만으로 구리를 증착할 경우 직진성은 매우 우수하였으나 소오스의 표면 이동이 적어 박막은 주상형으로 성장하며 측벽에의 증착은 거의 일어나지 않았으며 성 장에 따라 그림자효과로 인한 단차에서의 벽개가 관찰되었다. 그러나, 가속전압을 인가하여 전하를 띤 클러스터를 형성시켜 증착하였을 때 주상형 성장 모드는 사라졌으며, 직경 0.5$\mu$ m, aspect ratio 2의 접촉구에서 완벽한 바닥면의 도포성을 나타내었고, 측벽에의 증착성도 향상되어 막의 연결성이 개선되었다. 이로써 이온화 클러스터빔 증착법이 직진성을 향상시 켜 작은 접촉구의 메움을 향상시킬수 있는 물리적 증착 방법임을 확인하였다.