• Journal of the Microelectronics and Packaging Society
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• v.7 no.3
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• pp.37-44
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• 2000

The corrosion behavior of aluminum pad coated with epoxy molding compound (EMC) was investigated using electrochemical impedance spectroscopy (EIS). The impedance change was evaluated by the absorption of deionized water (DI water) to EMC coating and the interface between EMC and aluminum. During the absorption a decrease in resistance and thus an increase in capacitance of EMC as well as the interface of EMC/Al could be observed. Up to about 170 hours of absorption the EMC was saturated with the water molecules and ions generated from EMC. Subsequently the ionic water was penetrated to the interface and finally the corrosion of aluminum was occurred by the Dl water and ions. From measuring the adhesion strength with the Dl water absorption it was expected that the saturation of water and ions in the interface decreased the adhesion strength. The higher filler content of EMC should be necessary to inhibit the corrosion of aluminum electrode in microelectronic packages.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.2
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• pp.55-60
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• 2002

The recent trend in electronic devices has been towards light weight, low cost, high performance and improved reliability. Passive components are very important parts of microelectronic devices. The number of passive components used in hand held devices and computers continue to increase. To achieve improvements in costs, component density, performance, and reliability, embedding of these passive components into the printed circuit boards (PCBs) is required. This paper introduces the embedding of passive components, and discusses the remained challenges in the commercialization of this technique.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.3
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• pp.1-7
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• 2012

Electroplating technology is widely used in semiconductor microelectronic industry. With the development of semiconductor integrated circuit to high density and light-small scale, Extremely high quality and plated uniformity of the deposited metals are needed. Simulation technique can help to obtain better plating results. Although a few plating simulation softwares have been commercialized, plating simulation is not widely prevalent in Korea. In this paper, principle of electroplating and mathematical modeling of plating simulation are discussed. Also introduced are some cases enhancing plating thickness uniformity on leadframe, PCB and wafer by using plating simulation.

• Journal of Sensor Science and Technology
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• v.24 no.5
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• pp.287-290
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• 2015

Liquid crystal polymer (LCP) is a thermoplastic polymer with superior mechanical and thermal properties. In addition, its characteristics include very low water absorption rate and possibility to apply bonding process under low temperature. In this study, LCP is utilized as a packaging material for a microelectronic system (MEMS) based safety device with suggestion of a low temperature packaging process. Highly sensitive and stable capacitive type humidity sensor is fabricated to investigate hermeticity of the packaged MEMS device.

• Journal of Welding and Joining
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• v.18 no.3
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• pp.89-96
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• 2000

As solder becomes small and fine, the reliability and solderability of solder joint are the critical issue in present electronic packaging industry. Besides the use of lead(Pb) containing solders for the interconnections of microelectronic subsystem assembly and packaging has enviromental problem. In this study, using Sn/Pb and Sn/Ag eutectic solder paste, in order to obtain decrease of solder joint strength with increasing aging time, initial solder joint strength and aging strength after 1000 hour aging at $100^{\circ}C$ were measured by peel test. And in order to obtain the growth of intermetallic compound(IMC) layer thickness, IMC layer thickness was measured by scanning electron microscope(SEM). As a result, solder joint strength was decreased with increasing aging time. The mean IMC layer thickness was increased linearly with the square root of aging time. The diffusion coefficient(D) of IMC layer was found to $1.29{\times}10^{-13}{\;}cm^2/s$ at using Sn/Pb solder paste, 7.56{\times}10^{-14}{\textrm}{cm}^2/s$ at using Sn/Ag solder paste.

• Polymer Science and Technology
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• v.3 no.1
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• pp.36-43
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• 1992

Trifluoromethyl group을 내열성고분자의 주쇄에 도입하면 내열성의 큰 손실없이 용해도의 증가 및 유전상수의 감소등 절연재료로서의 성능을 향상시켜 주지만, 유연한기의 도입에 따른 $T_g$의 저하등 부정적인 효과도 나타낸다. 분자구조설계에 의해 기존 고분자재료의 성능을 향상시키려는 시도는 흔히 향상되어지는 성질들에 반비례하여 어는 다른 성질의 저하를 초래하는 경향이 있으나, 유전상수나 가공성 이외에도 낮은 열팽창계수를 갖는 polyimides, 열경화성수지인 poly(benzocyclobutene) 등의 packaging 재료로서의 개발등, 낮은 절연율, 내열성, 가공성, 접착력, 적절한 열팽창계수 및 기계적 성질 등 가능한 모든 필요성질을 동시에 최대한 만족시키는 고분자재료에 대한 개발노력이 계속되어지고 있으며 장차 혁신적인 새로운 고분자 재료의 등장도 이루어지리라고 본다.

• Journal of the Korean Institute of Telematics and Electronics
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• v.27 no.8
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• pp.1250-1254
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• 1990

The cordierite (MgO, SiO2, Al2O3) is of great interest for microelectronic packaging of integrated circuits. Its main advantages are low dielectric constant and low thermal expansion. The cordierite precursor is obtained by sol-gel synthesis using organic and inorganic compounds. The obtained cordierite precursor is an amorphous state at about 900\ulcorner. Green and fired cordierite samples were studied by SEM. Microanalysis X and TEM for microscopic properties. The fired cordierite shows forte diminution of Mg in comparison with its value at volume and the deficit of Mg compensates by sugmentation of Al and Si \ulcornercordierite and \ulcornercordierite are present near the surface (< 100) and small quantities of magnesium aluminate (MgAl2O4)is presented spinnel phase.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.11a
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• pp.232-233
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• 2015

The effects of various bath conditions such as surfactant concentration, bath pH, bath temperature, agitation of bath; as well as pulse parameters such as cathodic current density, pulse duty cycle and frequency, on the grain size, surface finish, and appearance of the tin plated coatings have been investigated. The plating bath under investigation is an aqueous acidic solution composed of a mixture of $SnSO_4$, $H_2SO_4$, and a surfactant. The bath conductivity and pH are measured by a glass pH electrode. The microstructure of the coatings produced is characterized by X-ray diffraction (XRD), scanning electron microscopy (SEM), and surface profilometry. XRD analysis shows that the deposits consist of tetragonal ${\beta}$-Sn crystal structure irrespective of plating conditions. The mechanism involved in the morphology evolution in response to various parameters and conditions has also been discussed.

• Journal of the Semiconductor & Display Technology
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• v.3 no.4
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• pp.33-37
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• 2004

As the high speed and high integration of semiconductor devices and the generation of heat increases resulted in the effective heat dissipation influences on the performance and lifetime of semiconductor devices. The heat resistance or heat spread function of EMC(epoxy molding compound) which protects these devices became one of very important factors in the evaluation of semiconductor chips. Recently, silica, alumina, AlN(aluminum nitride) powders are widely used as the fillers of EMC. The filler loading in encapsulants was high up to about 80 vol%. A high loading of filler was improved low water absorption, low stress, high strength, better flowability and high thermal conductivity. In this study, the thermal properties were investigated through thermal, mechanical and microstructure. Thermophysical properties were investigated by laser flash and differential scanning calorimeter(DSC). For detailed inspection of materials, the samples were examined by SEM.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.844-845
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• 2006

For microelectronic circuits, the main type of failure is thermal fatigue. Therefore, the search for matched coefficients of thermal expansion (CTE) of packaging materials in combination with a high thermal conductivity is the main task for developments of heat sink materials electronics, and good mechanical properties are also required. The aim of this work is to develop copper matrix composites reinforced with carbon nanofibers to meet these requirements. In this paper, a technology for obtaining a homogeneous mixture of copper and nanofibers will be presented and the microstructure and properties of consolidated samples will be discussed.