• Journal of the Korea Institute of Information and Communication Engineering
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• v.10 no.9
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• pp.1641-1647
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• 2006

A dual micro gas sensor way for detecting reducing gas and bad order was fabricated using nano sized $SnO_2$ thin film fabrication method. To make nano-sized thin gas sensitive $SnO_2$ thin rilm, thin tin metal layer $2500{\AA}$ thick was oxidized between 600 and $800^{\circ}C$ by thermal oxidation. The gas sensing layers such as $SnO_2,\;SnO_2(+Pt)\;and\;SnO_2(+CuO)$ were patterned by metal shadow mask for simple fabrication process on the silicon substrate. The micro gas sensors with $SnO_2(Pt)$ and $SnO_2(+CuO)$ showed good selectivity to CO gas among reducing gases and good sensitivity to $H_2S$ that is main component of bad odor, separately.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.65 no.1
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• pp.135-141
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• 2016

Recently, the needs for the development and application of marine robots are increasing as marine accidents occur frequently. However, it is very difficult to acquire the information by utilizing marine robots in the marine environment. Therefore, the needs for the researches of sensor networks which are composed of underwater, surface and aerial robots are increasing in order to acquire the information effectively as the information from heterogeneous robots has less limitation in terms of coverage and connectivity. Although various researches of the sensor network which is based on marine robots have been executed, all of the underwater, surface and aerial robots have not yet been considered in the sensor network. To solve this problem, a collaborative control method based on the acoustic information and image by the sonars of the underwater robot, the acoustic information by the sonar of the surface robot and the optical image by the camera of the static-floating aerial robot is proposed. To verify the performance of the proposed method, the collaborative control of a MUR(Micro Underwater Robot) with an OAS(Obstacle Avoidance Sonar) and a SSS(Side Scan Sonar), a MSR(Micro Surface Robot) with an OAS and a BMAR(Balloon-based Micro Aerial Robot) with a camera are executed. The test results show the possibility of real applications and the need for additional studies.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.40 no.1
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• pp.11-19
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• 2003

A micro sensor array with 4 discrete sensors integrated on a microhotplate was developed for identifying the kinds and quantities of explosive gases. The sensor array consisited of four tin oxide-based thin films with the high and broad sensitivity to the tested explosive gases and uniform thermal distribution on the plate. The microhotplate, using silicon substrate with N/O/N membrane, dangling in air by Al bonding wires, and controlling the thickness by chemical mechanical process (CMP), has been designed and fabricated. By employing the sensitivity signal of the sensor array at 40$0^{\circ}C$, we could reliably classily the kinds and quantities of the explosive gases like butan, propane, LPG, and carbon monoxide within the range of threshold limit values (TLVs), employing principal component analysis (PCA).

• Journal of the Microelectronics and Packaging Society
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• v.9 no.3
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• pp.19-23
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• 2002

This paper presents a micro fluxgate magnetic sensor in printed circuit board (PCB). In order to observe the effect of the closed magnetic path, the magnetic cores of rectangular-ring and two bars were each fabricated. Each fluxgate sensor consists of five PCB stack layers including one layer magnetic core and four layers of excitation and pick-up coils. The center layer as a magnetic core is made of a Co-based amorphous magnetic ribbon with extremely high DC permeability of ~100,000. Four outer layers as an excitation and pick-up coils have a planar solenoid and are made of copper foil. In case of the fluxgate sensor having the rectangular-ring shaped core, excellent linear response over the range of -100 $\mu$T to ＋ 100 $\mu$T is obtained with 540 V/Tsensitivity at excitation square wave of 3 $V_{p-p}$ and 360 KHz. The chip size of the fabricated sensing element is $7.3 \times 5.7\textrm{mm}^2$. The very low power consumption of ~8 mW was measured. This magnetic sensor is very useful for various applications such as: portable navigation systems, telematics, VR game and so on.n.

• Journal of Sensor Science and Technology
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• v.19 no.1
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• pp.31-35
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• 2010

High temperature micro pressure sensors were fabricated by using polycrystalline 3C-SiC piezoresistors grown on oxidized SOI substrates by APCVD. These have been made by bulk micromachining under $1{\times}1mm^2$ diaphragm and Si membrane thickness of $20{\mu}m$. The pressure sensitivity of implemented pressure sensors was 0.1 mV/$V{\cdot}bar$. The nonlinearity and the hysteresis of sensors were ${\pm}0.44%{\cdot}FS$ and $0.61%{\cdot}FS$. In the temperature range of $25^{\circ}C{\sim}400^{\circ}C$ with 5 bar FS, TCS (temperature coefficient of sensitivity), TCR (temperature coefficient of resistance), and TCGF (temperature coefficient of gauge factor) of the sensor were -1867 ppm/$^{\circ}C$, -792 ppm/$^{\circ}C$, and -1042 ppm/$^{\circ}C$, respectively.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.8
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• pp.65-72
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• 2004

For the burrs formed in machining are irregular and very sharp in shape, it is usually very difficult to measure burr accurately. It was proved that micro burr geometry can be measured imprecision by the Conoprobe sensor using conoscopic holography method. We developed 3D burr measurement system using this sensor. The system is composed of Conoprobe sensor, XY table, controller and 3D measurement program. Some measurements using the developed system are conducted for the burrs formed in micro drilling and piercing. Specific software fur burr measurement includes several function, calculation of burr volume, average burr height. Burs formed on a curved surface were compensated and measured successfully using the basic surface compensation function.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.4 no.4
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• pp.34-38
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• 2005

This is a widespread requirement for low cost lightweight thermal imaging sensors for both military and civilian applications. Today, a large number of uncooled infrared detector developments are under progress due to the availability of silicon technology that enables realization of low cost IR sensor. System prices are continuing to drop, and swelling production volume will soon drive process substantially lower. The feasibility of micromechanical optical and infrared (IR) detection using microcantilevers is demonstrated. Microcantilevers provide a simple Structurefor developing single- and multi-element sensors for visible and infrared radiation that are smaller, more sensitive and lower in cost than quantum or thermal detectors. Microcantilevers coated with a heat absorbing layer undergo bending due to the differential stress originating from the bimetallic effect. This paper reports a micromachined silicon uncooled thermal imager intended for applications in automated process control. This paper presents the design, fabrication, and the behavior of cantilever for thermomechanical sensing.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.951-954
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• 2003

Generally, for the burrs formed in machining are irregular and very sharp in shape, it is usually very difficult to measure burr accurately. But, it is proved that precision measurement for micro burr using the conoprobe sensor by conoscopic holography method is possible. We developed 3D burr measurement system using this sensor. The system is composed of Conoscopic laser Sensor, X-Y table, controller and 3D measurement program. Some measurements using the developed system are applied to burrs formed in micro drilling and piercing.

• Proceedings of the KIEE Conference
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• 2006.04a
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• pp.165-167
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• 2006

In this paper we present a new-generation sensor network processor which is not optimized in circuit level, but in system architecture level. The new design build on a conventional processor architecture, improving the design by focusing on application oriented specification, ISA, and micro-architectural optimization that reduce overall design size and advance energy-per-instruction. The design employs harvard architecture, 8-bit data paths, and an compact 19 bit wide RISC ISA. The design also features a unique interrupt handler which offloads periodical monitoring jobs from the main part of CPU. Our most efficient design is capable of running at 300 KHz (0.3 MIPS) while consuming only about few pJ/instruction.

• Journal of Sensor Science and Technology
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• v.31 no.2
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• pp.71-78
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• 2022

Wearable devices have the potential to revolutionize future medical diagnostics and personal healthcare. The integration of biosensors into scalable form factors allow continuous and noninvasive monitoring of key biomarkers and various physiological indicators. However, conventional wearable devices have critical limitations owing to their rigid and obtrusive interfaces. Recent developments in functional biocompatible materials, micro/nanofabrication methods, multimodal sensor mechanisms, and device integration technologies have provided the foundation for novel skin-interfaced bioelectronics for advanced and user-friendly wearable devices. Nonetheless, it is a great challenge to satisfy a wide range of design parameters in fabricating an authentic skin-interfaced device while maintaining its edge over conventional devices. This review highlights recent advances in skin-compatible materials, biosensor performance, and energy-harvesting methods that shed light on the future of wearable devices for digital health and personalized medicine.