• 제목/요약/키워드: Micro-holes

검색결과 180건 처리시간 0.027초

Investigation of Water Transport in Newly Developed Micro Porous Layers for Polymer Electrolyte Membrane Fuel Cells

  • Alrwashdeh, Saad S.;Markotter, Henning;Haussmann, Jan;Hilger, Andre;Klages, Merle;Muller, Bernd R.;Kupsch, Andreas;Riesemeier, Heinrich;Scholta, Joachim;Manke, Ingo
    • Applied Microscopy
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    • 제47권3호
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    • pp.101-104
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    • 2017
  • In this investigation, synchrotron X-ray imaging was used to investigate the water distribution inside newly developed gas diffusion media in polymer electrolyte membrane fuel cells. In-situ radiography was used to reveal the relationship between the structure of the microporous layer (MPL) and the water flow in a newly developed MPL equipped with randomly arranged holes. A strong influence of these holes on the overall water transport was found. This contribution provides a brief overview to some of our recent activities on this research field.

극초단 레이저를 이용한 PC-TEMs 초정밀 가공에 대한 연구 (Polycarbonate Track-Etched Membrane Micromachining by Ultrafast Pulse Laser)

  • 최혜운
    • 한국정밀공학회지
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    • 제28권1호
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    • pp.24-30
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    • 2011
  • PC-TEMs (Polycarbonate Track-Etched membranes) were micro-drilled for biomedical applications by ultrafast pulsed laser. The ablation and damage characteristics were studied on PE-TEMs by assuming porous thin membranes. The experiments were conducted in the range of 2.02 $J/cm^2$ and 8.07$J/cm^2$. The ablation threshold and damage threshold were found to be 2.56$J/cm^2$ and 1.14$J/cm^2$, respectively. While a conical shaped drilled holes was made in lower fluence region, straight shaped holes were drilled in higher fluence region. Nanoholes made the membrane as porous material and ablation characteristics for both bulk and thin film membranes were compared.

Ultra Thin 실리콘 웨이퍼를 이용한 RF-MEMS 소자의 웨이퍼 레벨 패키징 (Wafer Level Packaging of RF-MEMS Devices with Vertical feed-through)

  • 김용국;박윤권;김재경;주병권
    • 한국전기전자재료학회논문지
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    • 제16권12S호
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    • pp.1237-1241
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    • 2003
  • In this paper, we report a novel RF-MEMS packaging technology with lightweight, small size, and short electric path length. To achieve this goal, we used the ultra thin silicon substrate as a packaging substrate. The via holes lot vortical feed-through were fabricated on the thin silicon wafer by wet chemical processing. Then, via holes were filled and micro-bumps were fabricated by electroplating. The packaged RF device has a reflection loss under 22 〔㏈〕 and a insertion loss of -0.04∼-0.08 〔㏈〕. These measurements show that we could package the RF device without loss and interference by using the vertical feed-through. Specially, with the ultra thin silicon wafer we can realize of a device package that has low-cost, lightweight and small size. Also, we can extend a 3-D packaging structure by stacking assembled thin packages.

Patterning of Diamond Micro-Columns

  • Cho, Hun-Suk;Baik, Young-Joon;Chung, Bo-Keon;Lee, Ju-Yong;Jeon, D.;So, Dae-Hwa
    • The Korean Journal of Ceramics
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    • 제3권1호
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    • pp.34-36
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    • 1997
  • We have fabricated a patterned diamond field emitter on a silicon substrate. Fine diamond particles were planted on a silicon wafer using conventional scratch method. A silicon oxide film was deposited on the substrate seeded with diamond powder. An array of holes was patterned on the silicon oxide film using VLSI processing technology. Diamond grains were grown using a microwave plasma-assisted chemical vapor deposition. Because diamond could not grow on the silicon oxide barrier, diamond grains filled only the patterned holes in the silicon oxide film, resulting in an array of diamond tips.

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Microstructuring of Optical Fibers Using a Femtosecond Laser

  • Sohn, Ik-Bu;Kim, Young-Seop;Noh, Young-Chul;Ryu, Jin-Chang;Kim, Jin-Tae
    • Journal of the Optical Society of Korea
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    • 제13권1호
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    • pp.33-36
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    • 2009
  • Laser ablation with femtosecond lasers is highly promising for microfabrication of materials. Also, the high peak power of femtosecond lasers could induce a multiphoton absorption to ablate transparent materials. Similar results have also been were obtained in the case of optical fibers. In this paper, we present our experimental results of femtosecond laser microstructuring of optical fiber and its applications to microelectronic components and fiber optic devices. Finally, we directly produced micro holes with femtosecond laser pulses in a single step by moving an optical fiber in a preprogrammed structure. When water was introduced into a hole drilled from the bottom surface of the optical fiber, the effects of blocking and redeposition of ablated material were greatly reduced and the aspect ratio of the depth of the hole was increased. We have presented circular and rectangular-shaped holes in optical fiber.

Low Loss Highly Birefringent Porous Core Fiber for Single Mode Terahertz Wave Guidance

  • Habib, Md. Ahasan;Anower, Md. Shamim
    • Current Optics and Photonics
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    • 제2권3호
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    • pp.215-220
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    • 2018
  • A novel porous-core hexagonal lattice photonic crystal fiber (PCF) is designed and analyzed for efficient terahertz (THz) wave propagation. The finite element method based Comsol v4.2 software is used for numerical analysis of the proposed fiber. A perfectly matched layer boundary condition is used to characterize the guiding properties. Rectangular air-holes are used inside the core to introduce asymmetry for attaining high birefringence. By intentionally rotating the rectangular air holes of porous core structure, an ultrahigh birefringence of 0.045 and low effective material loss of $0.086cm^{-1}$ can be obtained at the operating frequency of 0.85 THz. Moreover, single-mode properties, power fraction in air core and confinement loss of the proposed PCF are also analyzed. This is expected to be useful for wideband imaging and telecom applications.

영상을 이용한 미세 드릴비트 측정에 관한 연구 (A Study on Micro Drill-Bit Measurement Using Images)

  • 곽동규;최한고
    • 융합신호처리학회논문지
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    • 제16권3호
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    • pp.90-95
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    • 2015
  • 본 연구에서는 인쇄회로 기판(PCB)의 홀 가공에 사용되는 초소형 및 경량의 마이크로 드릴비트를 검사하기 위한 방법을 제안하고 있다. 고배율의 현미경을 통해 마이크로 드릴 비트의 영상을 획득한 후 드릴비트의 주요 지점들을 검출하는 영상처리 알고리즘을 개발하였고 주요지점을 근거로 하여 드릴비트의 다양한 요소들을 측정하였다. 또한, 드릴비트의 정상 및 비정상 상태를 자동으로 분별할 수 있는 윈도우 기반 검사 시스템을 개발하였다. 본 연구에서 개발한 시스템의 상대적인 성능비교를 위해 시험영상들을 사용하여 기존 검사장비와 비교하였다. 실험결과에 의하면 제안된 시스템은 기존 검사기보다 성능을 조금 향상시켰으며 기존 시스템에서 발생된 오판단된 일부 에러를 정확하게 분류하였다.

초미세 천공 펀치의 성형에 대한 연구 (Study on the Fabrication of Ultrathin Punch)

  • 임형준;임영모;김수현;곽윤근
    • 한국정밀공학회지
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    • 제17권12호
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    • pp.145-150
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    • 2000
  • Micro punching is one of general methods to fabricate simple holes such as permanent ink-jet printer nozzles. A thin punch, that is need for micro punching, usually has been obtained by mechanical machining. There are some method to obtain a thin punch from a cylindrical rod, e.g., microgrinding and WEDG (Wire Electro-Discharge Grinding). Inefficiently, only one punch can be obtained from these machining methods. In contrast with these methods, many punches can be fabricated simultaneously by electrochemical process. Electrochemical process has usually aimed to obtain very sharp probe for atomic force microscopy (AFM) or scanning tunneling microscopy (STM), and it has not been considered the whole shape of a probe in spite of good merits. In this paper, an ultrathin punch with a tapered shape and a cylindrical tip is newly fabricated by electrochemical process.

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슬라이딩 모드 제어를 이용한 마으크로 드릴의 절삭력 제어 (Cutting force regulation of microdrilling using the sliding mode control)

  • 정만실;조동우
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1997년도 춘계학술대회 논문집
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    • pp.842-846
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    • 1997
  • Micro-hole drilling (holes less than 0.5 mm in diameter with aspect ratios larger than 10) is gaining increased attention in a wide spectrum of precision production industries. Alternative methods such as EDM, laser drilling, etc. can sometimes replace mechanical micro-hole drilling but are not acceptable in PCB manufacture because they yield inferior hole quality and accuracy. The major difficulties in micro-hold drilling are related to wandering motions during the inlet stage, high aspect ratios, high temperature,etc. However, of all the difficulties, the most undesirable one is the increase of drilling force as the drill penetrates deeper into hold. This is caused mainly by chip related effects. Peck-drilling is thus widely used for deep hole drilling despite the fact that it leads to low productivity. Therefore, in this paper, a method of cutting force regulation is proposed to achieve continuous drilling. A proportional plus derivative (PD) and a sliding modecontrol algorithm will be implemented for controlling the spinle rotational frequeency. Experimental results will show that sliding mode control reduces the nominal cutting force and its variation better than the PD control, resulting in a number of advantages such as an increase in drill life, fast stabilization of the wandering motion, and precise positioning of the hole.

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연마재 워터젯 가공을 이용한 유리 미세 가공 성능 평가 (Evaluation of Efficiency on Glass Precision Machining by using Abrasive Water-jet)

  • 박연경;박강수;김형훈;신보성;고종수;고정상
    • 한국정밀공학회지
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    • 제27권7호
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    • pp.87-93
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    • 2010
  • This paper presents an evaluation of efficiency on glass precision machining by using abrasive water-jet machine. In this study, problems of conventional water-jet machining are examined experimentally and are analysized numerically. Especially, the reason of whitening on the machined surface of biochip glass is determined. It is found that the mass flow rate of abrasive input and transverse speed of water-jet are key parameters to control the direct machining of micro hole and channel on a glass substrate. Based on results of experimental analysis, possibility of direct fabrication of micro holes and channels on a glass substrate is successfully confirmed.