• 제어로봇시스템학회논문지
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• 제19권11호
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• pp.979-983
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• 2013

The three-dimensional measurement method of confocal systems is a spot scanning method which has a high resolution and good illumination efficiency. However, conventional confocal systems had a weak point in that it has to perform XY axis scanning to achieve FOV (Field of View) vision through spot scanning. There are some methods to improve this problem involving the use of a galvano mirror [1], pin-hole array, etc. Therefore, in this paper we propose a method to improve a parallel mode confocal system using a micro-lens and pin-hole array in a dual microscope configuration. We made an area scan possible by using a combination MLA (Micro Lens Array) and pin-hole array, and used an objective lens to improve the light transmittance and signal-to-noise ratio. Additionally, we made it possible to change the objective lens so that it is possible to select a lens considering the reflection characteristic of the measuring object and proper magnification. We did an experiment using 5X, 2.3X objective lens, and did a calibration of height using a VLSI calibration target.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2011년도 춘계학술대회 논문집
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• pp.205-206
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• 2011

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.320-320
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• 2012

III-V 화합물 태양전지는 실리콘, CdTe, CIGS, 염료, 및 유기 등 다른 태양전지에 비해 1sun 상 30% 이상의 고효율을 갖고 있고 앞으로도 계속 증가할 수 있는 가능성을 갖고 있다. 그 이유는 직접천이형 밴드갭, 높은 이동도 등의 고성능 물질특성과 더불어 3족과 5족의 비율을 조절함으로써 같은 결정구조를 갖고 에너지 밴드갭이 다른 물질들을 만들기에 용의하여, 태양전지 스펙트럼의 넓은 영역을 흡수할 수 있는 장점이 있기 때문이다. 그러나, 셀자체의 물질이 실리콘에 비하여 고가이므로, 고성능이 요구되는 우주 인공위성등에 적용이 되었지만, 2000년대 이후로 집광에 적용가능한 태양전지의 연구를 거듭하여 2005년부터는 값싼 프레넬 렌즈를 이용하여 1sun에 비해 500배 해당하는 빛을 셀에 집광하여 보다 효율을 증가시킴으로써 지상발전용에도 적용가능한 셀을 형성하게 되었다. 더불어 태양전지의 효율을 증가시키기 위한 개선된 구조적 변화의 시도도 많이 이루어지고 있다. 최근 보고에 의하면 실리콘 태양전지의 표면에 texture 또는 나노 구조를 주어 높은 흡수율과 낮은 반사율을 갖게 함으로써 효율을 증가시키는 사례가 많아지고, III-V 화합물 태양전지도 texturing에 의해 증가된 효율을 발표한바 있다. 본 연구에서는 태양전지의 효율을 증가시키기 위하여 III-V 화합물 태양전지 표면에 micro-hole array texture 구조를 형성한 후 나노 particle을 이용한 나노 texture 구조를 형성하였다. Photo-lithography와 chemical wet etching으로 micro-hole array texture 구조를 형성하였으며 micro-hole의 직경은 $5{\sim}20{\mu}m$, hole과 hole의 간격은 $3{\sim}15{\mu}m$로 다양하게 변화를 주었다. 형성된 micro-hole array texture 구조위에 수십 nm 크기의 particle을 만들어 chemical wet etching으로 나노 texture 구조를 형성하였다. 태양전지 표면에 texture 구조가 있는 경우와 없는 경우에 각각 효율을 측정, 비교 분석하였다.

• 한국정밀공학회지
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• 제25권7호
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• pp.139-144
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• 2008

Micro electrochemical machining was investigated to machine micro internal features. This method uses a micro disk tool electrode and can easily machine micro features inside of a micro hole, which are very difficult to make by the conventional processes. In order to limit the machining area and localize the electrochemical dissolution, ultra short pulses were used as power source and a micro disk electrode with insulating layer on its surface was used as a tool electrode. By electrochemical process, internal features, such as groove array, were fabricated on the stainless steel plate.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2005년도 금형가공,미세가공,플라스틱가공 공동 심포지엄
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• pp.193-197
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• 2005

This paper presents a method by which multiple holes of ultra small size can be punched simultaneously. Silicon wafers were used to fabricate punching die. Workpiece used in the present investigation were the rolled pure copper of $3{\mu}m$ in thickness and CP titanium of $1.5{\mu}m$ in thickness. The metal foils were punched with the dies and arrays of circular and rectangular holes were made. The diameter of holes ranges from $2-10{\mu}m$. The process set-up is similar to that of the flexible rubber pad forming or Guerin process. Arrays of holes were punched successfully in one step forming. The punched holes were examined in terms of their dimensions, surface qualities, and potential defect. The effects of the die hole dimension on ultra small size hole formation of the thin foil were discussed. The optimum process condition such as proper die shape and diameter-thickness ratio (d/t) were also discussed. The results in this paper show that the present method can be successfully applied to the fabrication of ultra small size hole array in a one step operation.

• 반도체디스플레이기술학회지
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• 제10권1호
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• pp.91-94
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• 2011

This paper presents light transmission efficiency by optical adhesive thickness between MLA and aperture layer and by aperture hole size. The gap between MLA and Aperture layer is adjusted by the shim. The more optical adhesive thickness increases, the better light transmission efficiency increases up to a point. After that, the light transmission efficiency decreases because stray lights cannot transmit through the aperture layer owing to cut-off by aperture layer. And as a result of light transmission efficiency with changing aperture hole size, the light transmission efficiency is proportional to area of aperture hole. The more specified process is made, the better data and sample will be got.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.1294-1298
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• 2005

In this study, combined micro press and surface finishing process are proposed to fabricate the micro nozzle array on a stainless steel sheet metal. In micro hole punching process the burr occurs inevitably, but the burr must be minimized in order to improve the quality and accuracy of the product. For this reason, subsequent magnetic field-assisted finishing technique is applied to remove the burr which exists around the nozzles for ink-jet printer head and proved to be a feasible for deburring by experiment. The deburring characteristics of sheet metals were investigated changing with polishing time and magnetic abrasive size. After the deburring, the burr size has remarkably reduced and roundness of the hole also has improved.

• Smart Structures and Systems
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• 제4권6호
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• pp.727-740
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• 2008

A down hole vertical seismic array is a sequence of instruments installed at various depths in the earth to record the ground motion at multiple points during an earthquake. Numerous studies demonstrate the unique utility of vertical seismic arrays for studying in situ site response and soil behavior. Examples are given of analyses made at two sites to show the value of data from vertical seismic arrays. The sites examined are the Lotung, Taiwan SMART1 array and a new site installed at Jingliao, Taiwan. Details of the installation of the Jingliao array are given. ARX models are theoretically the correct process models for vertical wave propagation in the layered earth, and are used to linearly map deeper sensor input signals to shallower sensor output signals. An example of Event 16 at the Lotung array is given. This same data, when examined in detail with a Bayesian inference model, can also be explained by nonlinear filters yielding commonly accepted soil degradation curves. Results from applying an ARMAX model to data from the Jingliao vertical seismic array are presented. Estimates of inter-transducer soil increment resonant frequency, shear modulus, and damping ratio are presented. The shear modulus varied from 50 to 150 MPa, and damping ratio between 8% and 15%. A new hardware monitoring system - TerraScope - is an affordable 4-D down-hole seismic monitoring system based on independent, microprocessor-controlled sensor Pods. The Pods are nominally 50 mm in diameter, and about 120 mm long. An internal 16-bit micro-controller oversees all aspects of instrumentation, eight programmable gain amplifiers, and local signal storage.

• 한국정밀공학회지
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• 제28권12호
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• pp.1347-1352
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• 2011

Recently, as the aged population grows around the world, many medical instruments, devices, and their fabrication processes are developing. Among the devices, a drug delivery stent is a good example for precision machining. Conventional drug delivery stent has problem of the remaining polymer because the drug is coated on the surface with it. If the drug is impregnated into the micro hole array on the stent surface, the polymer can be perfectly eliminated. Micro sized holes are generally fabricated by laser machining however, the fabricated holes do not have an enough aspect ratio to contain the drug or a good surface finish to deliver the stend to blood vessel tissue. To overcome these problems, we propose a vibration-assisted machining mechanism with PZT (Piezoelectric Transducers) for abrication of micro sized holes better. The results indicated that the burr size can be significantly decreased with vibration assisted in nanosecond pulse laser drilling test.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2008년도 추계학술대회 논문집
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• pp.401-404
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• 2008

In the present investigation, a high precision thermal imprint system for micro ceramic products was developed and the net-shape manufacturing of multi-layer ceramic reflector for LED (Light Emitting Diode) was conducted with a precision metal die. Workpiece used in the present investigation were the multi-layer laminated ceramic sheets with pre-punched holes. The cavity with arbitrary angle was formed on the circular and rectangular holes of the ceramic sheets. During the imprinting process, the ambient temperature of the imprint system was kept over the transition temperature of the ceramic sheet and then rapidly cooled. The results in this paper show that the present method can be successfully applied to the fabrication of very small size hole array for ceramic reflector in a one step operation.