• Title/Summary/Keyword: Micro-deformation

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Fabrication of Aluminum Alloy Composites Reinforced with SiC whisker an $Al_2O_3-SiO_2$ Short Fiber by Squeeze Casting (용탕단조에 의한 $Al_2O_3-SiO_2$ 단섬유 및 SiC whisker강화 알루미늄 합금기 복합재료의 제조)

  • Hong, Sung-Kil;Yun, Jung-Yul;Choi, Jung-Chul
    • Journal of Korea Foundry Society
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    • v.17 no.1
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    • pp.28-35
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    • 1997
  • SiC whisker and $Al_2O_3-SiO_2$ short fiber reinforced AC8A, AC8B and AC8B(J) marix composites were fabricated by squeeze casting method. Preform deformation, change of reinforcement volumefraction and formation of macro-segregation in two composites were investigated by using micro Vickers hardness test, analysis of macro and micro structures with OM, SEM and EDAX. $Al_2O_3-SiO_2$ short fiber preform manufactured with 5% $SiO_2$ binder in this study was considerably deformed and cracked, nevertheless, the short fibers were distributed homogeneously in the composites. In SiC whisker reinforced composites, on the other hand, preform deforming and cracking were not occurred, however, macro segregation zone formed along the infiltration routes by interface reaction during infiltration of molten metal into the preform was observed at center-low area in the composites. The decrease of hardness in the macro segregation zone resulted from the depletion of Si and Mg atoms.

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Effect of Pressure on Edge Delamination in Chemical Mechanical Polishing of SU-8 Film on Silicon Wafer

  • Park, Sunjoon;Im, Seokyeon;Lee, Hyunseop
    • Tribology and Lubricants
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    • v.33 no.6
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    • pp.282-287
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    • 2017
  • SU-8 is an epoxy-type photoresist widely used for the fabrication of high-aspect-ratio (HAR) micro-structures in micro-electro-mechanical systems (MEMS). To fabricate highly integrated structures, chemical mechanical polishing (CMP) has emerged as the preferred manufacturing process for planarizing the MEMS structure. In SU-8 CMP, an oxidizer decomposes organic impurities and particles in the CMP slurry remove the chemically reacted surface of SU-8. To fabricate HAR microstructures using the CMP process, the adhesion between SU-8 and substrate material is important to avoid the delamination of the SU-8 film caused by the mechanical-dominant material removal characteristic. In this study, the friction force during the CMP process is measured with a CMP monitoring system to detect the delamination phenomenon and investigate the delamination of the SU-8 film from the silicon substrate under various pressure conditions. The increase in applied pressure causes an increase in the frictional force and wafer-edge stress concentration. The frictional force measurement shows that the friction force changes according to the delamination phenomenon of the SU-8 film, and that it is possible to monitor the delamination phenomenon during the SU-8 CMP process. The delamination at a high applied pressure is explained by the effect of stress distribution and pad deformation. Consequently, it is necessary to control the pressure of polishing, which can avoid the delamination in SU-8 CMP.

Prediction of Microstructural Changes during Cryogenic Rolling of Al alloys using an Eulerian Analysis (알루미늄 합금 극저온 압연의 오일러리안 해석에서 미세조직 변화 예측)

  • Yoon S. H.;Nam W. J.;Park K. T.;Lee Y. S.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2005.10a
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    • pp.381-383
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    • 2005
  • This paper is concerned with the prediction of micro structural changes of Al alloys during cryogenic rolling using an Eulerian finite element analysis. The main objective of cryogenic rolling is to obtain ultra-fine grains by severe plastic deformation at the extremely low temperature. Thereby, this simulation focuses on micro structural developments - the texture development and the changes in the size and shape of grains. The former one may be modeled using a crystal plasticity theory while the other can be predicted by a streamline technique. Applications to three pass rolling are given.

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Impact analysis of composite plate by multiscale modeling (멀티스케일 모델링에 의한 복합재료 평판의 충격해석)

  • Ji Kuk Hyun;Paik Seung Hoon;Kim Seung Jo
    • Proceedings of the Korean Society For Composite Materials Conference
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    • 2004.04a
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    • pp.67-70
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    • 2004
  • An investigation was performed to study the impact damage of the laminated composite plates caused by a low- velocity foreign object with multi-scale modeling based on the concepts of Direct Numerical Simulation (DNS)[4]. In the micro-scale part, we discretize the composite plates through separate modeling of fiber and matrix for the local microscopic analysis. A micro-scalemodel was developed for predicting the initiation of the damage and the extent of the final damage as a function of material properties, laminate configuration and the impactor's mass, etc. Anda macro-scale model was developed for description of global dynamic behavior. The connection betweenmicroscopic and macroscopic is implemented by the tied interface constraints of LS-DYNA contact card. A transient dynamic finite element analysis was adopted for calculating the contact force history and the stresses and strains inside the composites during impact resulting from a point-nose impactor. The low-velocity impact events such as contact force, deformation, etc. are simulated in the macroscopic sense and the impact damages, fiber-breakage, matrix cracking and delamination etc. are examined in the microscopic sense.

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A Study on the Optimal Conditions of Hole Machining of Microplate by Application of Response Surface Methodology in Wire-Pulse Electrochemical Machining (와이어 펄스전해가공에서 반응표면분석법을 응용한 미세박판의 홀 가공 최적 조건에 관한 연구)

  • Song, Woo-Jae;Lee, Eun-Sang
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.16 no.5
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    • pp.141-149
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    • 2017
  • Due to the inaccuracy of micro-machining, various special processing methods have been investigated recently. Among them, pulse electrochemical machining is a promising machining method with the advantage of no residual stress and thermal deformation. Because the cross section of the wire electrode used in this study is circular, wire-pulse electrochemical machining is suitable for micro-hole machining. By applying the response surface methodology, the experimental plan was made of three factors and three levels: machining time, duty factor, and voltage. The regression equation was obtained through experiments. Then, by referring to the main effect diagram, we fixed the duty factor and machining time with little relevance, and solved the equation for the target 900 microns to obtain the voltage value. The results obtained from the response surface methodology were approximately those of the target value when the actual experiment was carried out. Therefore, it is concluded that the optimal conditions for hole processing can be obtained by the response surface methodology.

A variably compliable probe system for the in-circuit test of a PCB (인쇄회로기판의 통전검사를 위한 가변순응력을 갖는 프로브 시스템)

  • Shim, Jae-Hong;Cho, Hyung-Suck;Kim, Sung-Kwun
    • Journal of Institute of Control, Robotics and Systems
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    • v.3 no.3
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    • pp.323-331
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    • 1997
  • A new probing mechanism and an active compliance control algorithm have been developed for the in-circuit test of a PCB( printed circuit board ). Commercially available robotic probing devices are incapable of controlling contact force generated through rigid probe contacts with a solder joint, at high speed. The uncontrollable excessive contact force often brungs about some defects on the surface of the solder joint, which is plastically deformable over some limited contact force. This force also makes unstable contact motions resulting in unreliable test data. To overcome these problems, we propose that a serially connected macro and micro device with active compliance provide the best potential for a safe and reliable in-circuit test. This paper describes the design characteristics, modeling and control scheme of the newly proposed device. The experimental results clearly show the effectiveness of the proposed system.

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Structural Analysis of High-Density Mobile Micro-Connector (초소형 고집적 모바일 커넥터부품 구조해석)

  • Jeon, Yong-Jun;Shin, Kwang-Ho;Heo, Young-Moo
    • Design & Manufacturing
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    • v.9 no.2
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    • pp.1-5
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    • 2015
  • Recently, as small-sized display products such as mobile phones and digital cameras have become lighter and smaller, the size of electric signal delivery part, connector for the mobile display products, also, needs to become smaller, so high-density integration like shortening the distance between signal delivery media, conductors is necessary. With the micro and high-density integration of the connector, it is necessary to maintain contact to a certain degree for keeping intensity and delivering electric signal smoothly to prevent a defect with a specific impact. Accordingly, this study carried out a structural analysis according to the operating mechanisms of 0.16CHP Class Bottom Contact FPC Connector and 0.24CHP Class BTB Connector mostly used in small-sized mobile display products such as mobile phones and digital cameras. As a result of the analysis, both connectors had lower than 997MPa, yield strength of connector material C5240-XSH, so it is judged that permanent plastic deformation would not occur, and that a contact force between the connector and FPC film occurs to a certain degree, so that there would not be any defect in electric signal delivery.

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The effect of ball diameter upon surface accuracy in surface rolling with cast iron (주철의 서어피스 로울링에 있어서 가압 볼의 직경이 표면정밀도에 미치는 영향)

  • 허명규;최홍식;육광수
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.12 no.5
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    • pp.1071-1082
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    • 1988
  • Surface rolling is one of the micro plastic processes which yields local deformation of surface, and improves surface roughness, hardness and fatigue strength. With the use of gray cast iron (GC 30) as material for experiment, the changes in surface roughness were investigated. A number of previous theses were refered to the effects of surface rolling for this study. With the use of steel ball of excellent in surface roughness and hardness, and with the applied force 20Kgf, surface rolling was performed. The summary of the experiment is as follows: (1) With the fixed applied force 20Kgf and the ball of 8.726mm in diameter, surface roughness was found to be the most excellent. (2) Increase in hardness was most prominent in the first rolling, but less effective in the succeeding rolling. (3) Reduction on diameter was affected by the previous process before rolling, and about 70 to 90% of reduction was made in the first rolling.

An exact solution for mechanical behavior of BFRP Nano-thin films embedded in NEMS

  • Altabey, Wael A.
    • Advances in nano research
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    • v.5 no.4
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    • pp.337-357
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    • 2017
  • Knowledge of thin films mechanical properties is strongly associated to the reliability and the performances of Nano Electro Mechanical Systems (NEMS). In the literature, there are several methods for micro materials characterization. Bulge test is an established nondestructive technique for studying the mechanical properties of thin films. This study improve the performances of NEMS by investigating the mechanical behavior of Nano rectangular thin film (NRTF) made of new material embedded in Nano Electro Mechanical Systems (NEMS) by developing the bulge test technique. The NRTF built from adhesively-bonded layers of basalt fiber reinforced polymer (BFRP) laminate composite materials in Nano size at room temperature and were used for plane-strain bulging. The NRTF is first pre-stressed to ensure that is no initial deflection before applied the loads on NRTF and then clamped between two plates. A differential pressure is applying to a deformation of the laminated composite NRTF. This makes the plane-strain bulge test idea for studying the mechanical behavior of laminated composite NRTF in both the elastic and plastic regimes. An exact solution of governing equations for symmetric cross-ply BFRP laminated composite NRTF was established with taking in-to account the effect of the residual strength from pre-stressed loading. The stress-strain relationship of the BFRP laminated composite NRTF was determined by hydraulic bulging test. The NRTF thickness gradation in different points of hemisphere formed in bulge test was analysed.

Evaluation of a new proposed seismic isolator for low rise masonry structures

  • Kakolvand, Habibollah;Ghazi, Mohammad;Mehrparvar, Behnam;Parvizi, Soroush
    • Structural Engineering and Mechanics
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    • v.77 no.4
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    • pp.481-493
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    • 2021
  • Low rise masonry structures are relatively inexpensive and easier to construct compared to other types of structures such as steel and reinforced concrete buildings. However, masonry structures are relatively heavier and less ductile and more vulnerable to damages in earthquakes. In this research, a new innovative low-cost seismic isolator using steel rings (SISR) is employed to reduce the seismic vulnerability of masonry structures. FEA of a masonry structure, made of concrete blocks is used to evaluate the effect of the proposed SISR on the seismic response of the structure. Two systems, fixed base and isolated from the base with the proposed SISRs, are considered. Micro-element approach and ABAQUS software are used for structural modeling. The nonlinear structural parameters of the SISRs, extracted from a recent experimental study by the authors, are used in numerical modeling. The masonry structure is studied in two separate modes, fixed base and isolated base with the proposed SISRs, under Erzincan and Imperial Valley-06 earthquakes. The accelerated response at the roof level, as well as the deformation in the masonry walls, are the parameters to assess the effect of the proposed SISRs. The results show a highly improved performance of the masonry structure with the SISRs.