• 소성∙가공
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• 제18권4호
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• pp.342-346
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• 2009

Forming characteristics for the bundle extrusion of Cu-Ti bimetal wires are investigated, which can identify the process conditions for weak mechanical bonding at the contact surface during the direct extrusion of a Cu-Ti bimetal wire bundle. Bonding mechanism between Cu and Ti is assumed as a cold pressure welding. Then, the plastic deformation at the contact zone causes mechanical bonding and a new bonding criterion for pressure welding is developed as a function of the principal stretch ratio and normal pressure at the contact surface by analyzing micro local extrusion at the contact zone. The averaged deformation behavior of Cu-Ti bimetal wire is adopted as a constitutive behavior at a material point in the finite element analysis of Cu-Ti wire bundle extrusion. Various process conditions for bundle extrusions are examined. The deformation histories at the three points, near the surface, in the middle and near the center, in the cross section of a bundle are traced and the proposed new bonding criterion is applied to predict whether the mechanical bonding at the Cu-Ti contact surface happens. Finally, a process map for the direct extrusion of Cu-Ti bimetal wire bundle is proposed.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2002년도 금형가공 심포지엄
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• pp.266-273
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• 2002

Milli-structure components are classified as a component group whose size is between macro and micro scales, that is, about less than 20mm and larger than 1mm. The bending of these components of thin sheets has a typical phenomenon of bulk deformation because of the forming size. The recent trend towards miniaturization causes an increased demand for parts with very small dimensions. The conceptual miniature bending process enables the production of such parts with high productivity and accuracy. The stress values of the flow curve decrease with miniaturization, which means that coarse grained materials show a higher resistance against deformation, when the grain size is in the range of the sheet thickness. In this paper, a new numerical approach is proposed to simulate intergranular milli-structure in forming by the finite element method. The grain element and grain boundary element are introduced to simulate the milli-structure of strip in the bending. The grain element is used to analyze the deformation of individual grain while the grain boundary element is for the investigation on the movement of the grain boundary. Also, the result of the finite element analysis is confirmed by a series of milli-sized forming experiments.

• 한국정밀공학회지
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• 제26권10호
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• pp.81-88
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• 2009

Bellows is used to control temperature of a Joule-Thomson micro cryocooler. It is made of Nickelcobalt alloy that retains mechanical properties from cryogenic temperature to temperature of 570K. The geometry of bellows is an axisymmetric shell and Nitrogen with high pressure was charged at temperature of 293K. During cool-down process, the pressure and volume of Nitrogen are changed and must be satisfied with state equation. At cryogenic temperature, Nitrogen can exist as a part liquid and part vapor. Pressure-density-temperature behavior under this vaporliquid phase equilibrium is closely given by the Modified-Benedict-Webb-Rubin(MBWR) state equation. To evaluate deformation of bellows for temperature change, the numerical calculation of the volume within bellows and finite element analysis of bellows under internal pressure were iteratively performed until MBWR state equation is satisfied. The numerical results show that deformation of the bellows can be analyzed by the present method in a wide range of temperature including cryogenic temperature.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2005년도 추계학술대회 논문집
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• pp.393-397
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• 2005

A process map has been developed, which can identify the process conditions for weak mechanical bonding at the contact surface during the direct extrusion of a Cu-Ti bimetal wire bundle. Bonding mechanism between Cu and Ti is assumed as a cold pressure welding. Then, the plastic deformation at the contact zone causes mechanical bonding and a new bonding criterion fur pressure welding is developed as a function of the principal stretch ratio and normal pressure at the contact surface by analyzing micro local extrusion at the contact zone. The averaged deformation behavior of Cu-Ti bimetal wire is adopted as a constitutive behavior at a material point in the finite element analysis of Cu-Ti wire bundle extrusion. Various process conditions for bundle extrusions are examined. The deformation histories at the three points, near the surface, in the middle and near the center, in the cross section of a bundle are traced and the proposed new bonding criterion is applied to predict whether the mechanical bonding at the Cu-Ti contact surface happens. Finally, a process map for the direct extrusion of Cu-Ti bimetal wire bundle is proposed.

• 한국해안해양공학회지
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• 제2권2호
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• pp.59-66
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• 1990

극지방의 해양 환경은 낮은 온도와 함께 여러 가지 형태로 존재하는 얼음의 분포에 의해 큰 영향을 받는다. 빙하와 빙산, 해빙 등 빙역학의 기초적인 이해를 위하여 본 연구는 polycrystalline ice의 재료적 특성과 파괴기구 등을 파악하고 극지 방하유동시 관측되는 creep 변경을 기술하기 위한 constitutive 모델을 제시하였다. 빙변형에 관여되는 여러 가지 물리적 변화 중 microcracking에 의한 재료의 손상을 주요인으로 간주하여 파손역학의 이론을 적용한 3차원 수치모델을 개발하였으며 기발표된 실험 결과와 비교하였다. 1축 균일압축을 받는 경우 실험 데이타와 수치모델은 유사한 거동을 보이고 있으며, 빙변형에 있어서 1, 2기 creep의 소성적 변형특성 뿐 아니라 microcracking에 의한3기(tertiary) creep의 특징까지도 잘 기술해 주고 있다.

• Structural Engineering and Mechanics
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• 제55권2호
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• pp.315-334
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• 2015

This study's primary aim is to check the existence of a representative volume element for granular materials and determine the link between the properties (responses) of macro structures and the size of the discrete particle assembly used to represent a constitutive relation in a two-scale model. In our two-scale method the boundary value problem on the macro level was solved using finite element method, based on the Cosserat continuum; the macro stresses and modulus were obtained using a solution of discrete particle assemblies at certain element integration points. Meanwhile, discrete particle assemblies were solved using discrete element method under boundary conditions provided by the macro deformation. Our investigations focused largely on the size effects of the discrete particle assembly and the radius of the particle on macro properties, such as deformation stiffness, bearing capacity and the residual strength of the granular structure. According to the numerical results, we suggest fitting formulas linking the values of different macro properties (responses) and size of discrete particle assemblies. In addition, this study also concerns the configuration and displacement fluctuation of discrete particle assemblies on the micro level, accompanied with the evolution of bearing capacity and deformation on the macro level.

• 동력기계공학회지
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• 제11권1호
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• pp.115-120
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• 2007

The effect of grain size on the damping capacity of Fe-26Mn-2Al alloy studied in this paper has been investigated after changing the microstructure by cold rolling and changing grain size. Micro structures in Fe-26Mn-2Al at room temperature consist of a large quantity of austenite and a small quantity of ${\varepsilon}\;and\;{\alpha}'$ martensite. And ${\varepsilon}\;and\;{\alpha}'$ martensite was increased by increasing the degree of cold rolling. The content of deformation induced martensite was increased with increasing the degree of cold rolling. Damping capacity was linearly increased with increasing ${\varepsilon}$ martensite content, which suggests that stacking faults and ${\varepsilon}$ martensite variant boundaries are the principle damping sources. With increasing the grain size in Fe-26Mn-2Al alloy, the damping capacity was increased due to increasing the volume fraction of ${\varepsilon}$ martensite by decrement in stability of austenite phase. With decreasing the grain size, the content of deformation induced martensite was decreased and the damping capacity was decreased.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 추계기술심포지움논문집
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• pp.21-26
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• 2002

Solder flip chip bumping and subsequent coining processes on PCB were investigated to solve the warpage problem of organic substrates for high pin count flip chip assembly by providing good co-planarity. Coining of solder bumps on PCB has been successfully demonstrated using a modified tension/compression tester with height, coining rate and coining temperature variables. It was observed that applied loads as a function of coined height showed three stages as coining deformation : (1) elastic deformation at early stage, (2) linear increase of applied load, and (3) rapid increase of applied load. In order to reduce applied loads for coining solder bumps on PCB, effects of coining process parameters were investigated. Coining loads for solder bump deformation strongly depended on coining rates and coining temperatures. As coining rates decreased and process temperature increased, coining loads decreased. Among the effect of two factors on coining loads, it was found that process temperature had more significant effect to reduce applied coining loads during the coining process. Lower coining loads were needed to prevent substrate damages such as micro-via failure and build-up dielectric layer thickness change during applying loads. For flip chip assembly, 97Pb/Sn flip chip bumped devices were successfully assembled on organic substrates with 37Pb/Sn coined flip chip bumps.

• Advances in nano research
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• 제10권3호
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• pp.281-293
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• 2021

This paper presents a new nonlocal Hyperbolic Shear Deformation Beam Theory (HSDBT) for the free vibration of porous Functionally Graded (FG) nanobeams. A new displacement field containing integrals is proposed which involves only three variables. The present model incorporates the length scale parameter (nonlocal parameter) which can capture the small scale effect and its account for shear deformation by a hyperbolic variation of all displacements through the thickness without using the shear correction factor. It has been observed that during the manufacture of Functionally Graded Materials (FGMs), micro-voids and porosities can occur inside the material. Thus, in this work, the investigation of the free vibration analysis of FG beams taking into account the influence of these imperfections is established. Four different porosity types are considered for FG nanobeam. Material characteristics of the FG beam are supposed to vary continuously within thickness direction according to a power-law scheme which is modified to approximate material characteristics for considering the influence of porosities. Based on the nonlocal differential constitutive relations of Eringen, the equations of motion of the nanobeam are derived using Hamilton's principle. The effects of nonlocal parameter, aspect ratio, and the porosity types on the dynamic responses of the nanobeam are discussed.

• 한국정밀공학회지
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• 제13권12호
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• pp.70-77
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• 1996

Fatigue tests were carried out at high temperature on a Cr-Mo-V steel in order to assess the fatigue life of components used in power plants. The characteristics of high temperature fatigue were divided in terms of cycle-dependent fatigue and time-dependent fatigue, each crack propagation rate was examined with respect to fatigue J-integral range, .DELTA. J$_{f}$and creep J-integral range, .DELTA. J$_{c}$. The fatigue life was evaluated by analysis of J-integral value at the crack tip with a dimensional finite element method. The results obtained from the present study are summarized as follows : The propagation characteristics of high temperature fatigue cracks are determined by .DELTA. J$_{f}$for the PP(tensile plasticity-compressive plasticity deformation) and PC(tensile plasticity - compressive creep deformation) stress waveform types, and by .DELTA. J$_{c}$for the CP(tensile creep- compressive plasticity deformation) stress waveform type. The crack propagation law of high temperature fatigue is obtained by analysis of J-integral value at the crack tip using the finite element method and applied to examine crack propagation behavior. The fatigue life is evaluated using the results of analysis by the finite element method. The predicted life and the actual life are close, within a factor of 2.f 2.f 2.