• 열처리공학회지
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• 제20권1호
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• pp.1-10
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• 2007

The deformation behaviors of full annealed and T6 treated 6061, 7075 aluminum tubes are investigated at various temperature performing uniaxial tensile test. Full annealed Al 6061 and Al7075 tubes, and T6 treated Al7075 tube don't show sharp local necking with an elongation of 50% at $300^{\circ}C$. So it is expected that influenced by elevated tempterature. At $300^{\circ}C$ and strain rate of 0.001/s, many micro-cracks are observed in T6 treated Al 6061 tube, which is believed to be responsible for the decrease of total elongation.

• Smart Structures and Systems
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• 제2권4호
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• pp.357-363
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• 2006

Equations describing deformation defects, damage accumulation, and fracture condition have been suggested. Analytical and numerical solutions have been obtained for defects produced by a shear in a fixed direction. Under cyclic loading the number of cycles to failure well fits the empirical Koffin-Manson law. The developed model is expanded to the case of the micro-plastic deformation, which accompanies martensite accommodation in shape memory alloys. Damage of a shape memory specimen has been calculated for two regimes of loading: a constant stress and cyclic variation of temperature across the interval of martensitic transformations, and at a constant temperature corresponding to the pseudoelastic state and cyclic variation of stress. The obtained results are in a good qualitative agreement with available experimental data.

• Journal of Welding and Joining
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• 제7권4호
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• pp.38-45
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• 1989

In this study, in order to evaluate the shape and the size of the plastic zone at the notch tip before stable crack growth, a newly developed technique for plastic strain measurement, that is, the recrystallization-etching technique was applied to observe the intense strain zone at the notch tip of weld HAZ. 1) The recrystallized specimens showed that the amount of the intense strain zone, more than 20% plastic zone, was quantitatively observed as the plane strain state during the growth of the plastic zone. 2) The behavior of plastic deformation at midsection are different for parent and weld HAZ. In addition, the micro crack initiation occurs at midsection, parent and weld HAZ when the crack opening displacement(COD) value is .delta.$_{t}$=0.4mm. 3) The plastic zone for parent proceeds in the forward direction at notch tip and for weld HAZ in the right and left direction at the notch tip. 4) The relation between plastic strain energy(Wp) and COD(.delta.$_{t}$) depended on yield stress, gradient and plastic strain size.ize.

• 한국정밀공학회지
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• 제23권8호
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• pp.163-170
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• 2006

By removing sacrificial layer through ashing process, movable MEMS structure on substrate can be fabricated in surface micromachining. However, MEMS structure includes, during the ashing process, the warping or buckling effects due to stress gradient along the vertical direction of thin film. In this study, we presented method for counteracting the unwanted deflection of MEMS structure and designed using character of deposit process to overcome limited design conditions. Unit cell patterns were designed with character of deposit shape, and their final shapes were adopted using Finite Element Method. Finally, RF MEMS switch was fabricated by surface micro machining as test vehicles. We checked out that alleviation effect for deformation of switch improved by 35%.

• 대한원격탐사학회지
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• 제21권3호
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• pp.221-228
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• 2005

Baekdusan is a Cenozoic stratovolcano in which a series of micro-seismic events and gaseous emissions have been reported in 1990s. Two-pass DInSAR technique was applied to determine displacement in the volcano by using 10 ERS SAR and 41 JERS-1 SAR datasets. Most interferometric phases out of 58 JERS-1 differential interferograms showed concentric fringe patterns that correlated with elevation. From an analysis of fringe-duration relation, the fringe patterns were found to be severely distorted specifically by stratified troposphere. To estimate the tropospheric delay, we used the data in the Sobaeksan located about 20 km away from the summit of Baekdusan. The maximum and mean magnitudes of the phase delay in the Baekdusan were respectively 13.8 cm and 3.8 cm over 1200 m in altitude. After removing tropospheric effects, a mean inflation rate was estimated to be about 3 mm per year from 1992 to 1998. Although the inflation rate of the volcano is inconclusive without ground truth data, the results indicate that there exists slow upward deformation in the Baekdusan volcano.

• Advances in nano research
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• 제10권4호
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• pp.313-325
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• 2021

This paper is concerned with the buckling behavior of 2D and quasi-3D problem of functionally graded nanobeam founded on high order shear deformation beams theory and made by two different types of porous distribution materials in Nano- and micro-scales. The used Quasi-3D formulation takes into account the transverse shear effect and uses only three variables. Both formulations do not include the correction factor that is required in the first shear deformation theory proposed by Timoshenko. Governing equations are derived using the principle of virtual work. Analytical resolutions for buckling of FG nanobeam are introduced under tow different boundary conditions, and the results obtained are compared to those proposed in literatures.

• 대한기계학회논문집A
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• 제26권5호
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• pp.851-863
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• 2002

Recent industrial requirements for highly precise shape processing have brought the electric discharge machining (EDM) in great need. High precision in EDM is primarily achieved by high performance controllers. However there exists inherent precision loss due to structural micro-deformation. On this background, we study structural deformation characteristics of wire cut EDM via finite element (FE) analysis and axiomatic design. Two different wire cut EDMs are selected as analysis models. 3D CAD package I-Deas is first used to construct FE models of wire cut EDMs, and then ABAQUS FE code is used for following structural analysis. Pertinency of FE mesh refinement is discussed in terms of η -factor. It is shown that performance accuracy of EDM depends strongly on the structural characteristics. Some design enhancements are suggested in an axiomatic design point of view. Finally we provide weight and temperature induced displacement discrepancies between wire end points as position functions of each subframe.

• Smart Structures and Systems
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• 제15권6호
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• pp.1601-1623
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• 2015

Electroactive polymers have attracted considerable attention in recent years due to their sensing and actuating properties which make them a material of choice for a wide range of applications including sensors, biomimetic robots, and biomedical micro devices. This paper presents an effective modeling strategy for nonlinear large deformation (small strains and moderate rotations) dynamic analysis of polymer actuators. Considering that the complicated electro-chemo-mechanical dynamics of these actuators is a drawback for their application in functional devices, establishing a mathematical model which can effectively predict the actuator's dynamic behavior can be of paramount importance. To effectively predict the actuator's dynamic behavior, a comprehensive mathematical model is proposed correlating the input voltage and the output bending displacement of polymer actuators. The proposed model, which is based on the rigid finite element (RFE) method, consists of two parts, namely electrical and mechanical models. The former is comprised of a ladder network of discrete resistive-capacitive components similar to the network used to model transmission lines, while the latter describes the actuator as a system of rigid links connected by spring-damping elements (sdes). Both electrical and mechanical components are validated through experimental results.

• 한국정밀공학회지
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• 제22권11호
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• pp.165-172
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• 2005

In MEMS (Micro-Electro-Mechanical System), packaging induced stress or stress induced structure deformation becomes increasing concerns since it directly affects the performance of the device. In the decoupled vibratory MEMS gyroscope, the main factor that determines the yield rate is the frequency difference between the sensing and driving modes. The gyroscope, packaged using the anodic bonding at the wafer level and EMC (epoxy molding compound) molding, has a deformation of MEMS structure caused by thermal expansion mismatch. This effect results in large distribution in the frequency difference, and thereby a lower yield rate. To improve the yield rate we propose a packaged SiOG (Silicon On Glass) process technology. It uses a silicon wafer and two glass wafers to minimize the wafer warpage. Thus the warpage of the wafer is greatly reduced and the frequency difference is more uniformly distributed. In addition. in order to increase robustness of the structure against deformation caused by EMC molding, a 'crab-leg' type spring is replaced with a semi-folded spring. The results show that the frequency shift is greatly reduced after applying the semi-folded spring. Therefore we can achieve a more robust vibratory MEMS gyroscope with a higher yield rate.

• 소성∙가공
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• 제18권4호
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• pp.342-346
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• 2009

Forming characteristics for the bundle extrusion of Cu-Ti bimetal wires are investigated, which can identify the process conditions for weak mechanical bonding at the contact surface during the direct extrusion of a Cu-Ti bimetal wire bundle. Bonding mechanism between Cu and Ti is assumed as a cold pressure welding. Then, the plastic deformation at the contact zone causes mechanical bonding and a new bonding criterion for pressure welding is developed as a function of the principal stretch ratio and normal pressure at the contact surface by analyzing micro local extrusion at the contact zone. The averaged deformation behavior of Cu-Ti bimetal wire is adopted as a constitutive behavior at a material point in the finite element analysis of Cu-Ti wire bundle extrusion. Various process conditions for bundle extrusions are examined. The deformation histories at the three points, near the surface, in the middle and near the center, in the cross section of a bundle are traced and the proposed new bonding criterion is applied to predict whether the mechanical bonding at the Cu-Ti contact surface happens. Finally, a process map for the direct extrusion of Cu-Ti bimetal wire bundle is proposed.