• Title/Summary/Keyword: Micro-current

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Influence of Current Density on Corrosion Properties of AZ91 Mg Alloy Coated by Plasma Electrolytic Oxidation Method (인가전류밀도에 따른 플라즈마 전해산화코팅된 AZ91 마그네슘 합금의 내식성 변화)

  • Lee, Byung Uk;Hwang, In Jun;Lee, Jae Sik;Ko, Young Gun;Shin, Dong Hyuk
    • Korean Journal of Metals and Materials
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    • v.49 no.8
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    • pp.601-607
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    • 2011
  • The study investigated the influence of current density on the corrosion-protection properties of an AZ91 Mg alloy subjected to plasma electrolytic oxidation coating. The present coatings were carried out under an AC condition at three different current densities, i.e., 100, 150, and $200mA/cm^2$. From microstructural observations, the micro cracks connecting each micro pore were pronounced on the oxide surface of the samples coated at current densities higher than $150mA/cm^2$ since increasing the current density in this study led to an increment in the relative volume fraction of the MgO compound. Based on potentio dynamic polarization and immersion tests, the sample coated at a current density of $100mA/cm^2$ showed superior corrosion resistance.

Manufacturing and Tests of Cryostat for SMES (I) (SMES용 Cryostat 시제작 및 평가 (I))

  • 조전욱;심기덕;하홍수;김해종;김봉태;성기철;권영길;류강식;고득용
    • Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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    • 2001.02a
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    • pp.117-120
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    • 2001
  • In this paper we present the results of manufacturing and tests of prototype cryostat for micro-SMES. The prototype cryostat with HTS current leads and refrigerator had been designed and manufactured for micro-SMES. The cryostat had been tested the helium boil-off and mechanical stress during transfer and vibration test. These results will be applied to micro-SMES cryostat.

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Fabrication Of Ultraviolet LED Light Source Module Of Current Limiting Diode Circuit By Using Flip Chip Micro Soldering (마이크로솔더링을 이용한 정전류다이오드 회로 자외선 LED 광원모듈 제작)

  • Park, Jong-Min;Yu, Soon Jae;Kawan, Anil
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.29 no.4
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    • pp.237-240
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    • 2016
  • The improvement of irradiation intensity and irradiation uniformity is essential for large area and high power UVA light source application. In this study, large number of chips bonded by micro soldering technique were driven by low current, and current limiting diodes were configured to supply constant current to parallel circuits consisting of large number of series strings. The dimension of light source module circuit board was $350{\times}90mm^2$ and 16,650 numbers of 385 nm flip chip LEDs were used with a configuration of 90 parallel and 185 series strings. The space between LEDs in parallel and series strings were maintained at 1.9 mm and 1.0 mm distance, respectively. The size of the flip chip was $750{\times}750{\mu}m^2$ were used with contact pads of $260{\times}669{\mu}m^2$ size, and SAC (96.5 Sn/3.0 Ag/0.5 Cu) solder was used for flip chip bonding. The fabricated light source module with 7.5 m A supply current showed temperature rise of $66^{\circ}C$, whereas irradiation was measured to be $300mW/cm^2$. Inaddition, 0.23% variation of the constant current in each series string was demonstrated.

Optical Assembly and Fabrication of a Micro-electron Column (마이크로 전자렌즈의 광학적 정렬과 조립)

  • Park, Jong-Seon;Jang, Won-Kweon;Kim, Ho-Seob
    • Korean Journal of Optics and Photonics
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    • v.17 no.4
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    • pp.354-358
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    • 2006
  • A silicon lens and an insulator of pyrex, components of a micro-electron column, should be assembled by aligning and stacking simultaneously. An optical alignment of a diffraction beam and a laser welding were employed for the assembly of a source lens and an Einzel lens with precision within $\pm$4% for the maximum aperture size. The experimental condition for optical alignment and laser welding are explained. Anodic bonding was used to assist in stacking lenses. A micro-electron column of smaller apertures assembled with precise alignment and fabrication was tested with a current image of a Cu grid of 9$\mu$m in linewidth, and showed a higher resolution in acceleration mode.

Improvement on Surface Properties of Engineering Plastic with Adding Micro-$Al_2O_3$, Nano-$Al(OH)_3$ (Micro-$Al_2O_3$와 Nano-$Al(OH)_3$ 첨가에 따른 엔지니어링 플라스틱의 표면특성 개선)

  • Jung, Eui-Hwan;Lee, Han-Ju;Lim, Kee-Joe;Heo, Jun;Kang, Seong-Hwa
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2010.03b
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    • pp.29-29
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    • 2010
  • Surface contamination and leakage current have caused operating problems. A flashover in a substation may result in destruction of an insulator or many others electrical equipment. Engineering plastics have good characteristic (light weight, good productivity and little of void) as compare with epoxy or porcelain insulators. Outdoor insulator must have resistance to contamination. However, it isn't suited to outdoor insulator because it is not hydrophobic. RTV(Room temperature vulcanizing) has a good property of hydrophobic and micro-filler. nano-filler have characteristics of obstructing exothermic reaction. In order to reduce the incidence of insulator flashover and damage, the silicon rubber contained with micro, nano-filler coating on surface of engineering plastics. In this paper, it compares tracking resistance, leakage current of the engineering plastic coated RTV with that of non-coated engineering plastic. And filled-composites performed much better than non-filled composites.

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A Study on the Micro Stepping Drive to reduce Vibration of Step motor (스텝모터의 진동 저감을 위한 마이크로 스텝 구동에 관한 연구)

  • 신규범;이정우;오준호
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1996.04a
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    • pp.448-455
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    • 1996
  • In this study, to reduce vibration of step motor we use Microstep control. Microstep control of stepmotor is usually thought of as an extension of conventional stepmotor control technology. The essence ofmicro stepping is that we divide the full step of a stepmotor into a number of substep called microstep and cause the stepmotor to move through a substep per input pulse. In ideal case, bycontrolling the individual phase currents of a two-phase step motor sinusoidally we can get uniform torque and step angles. But due to the monlinear characteristics of the step motor, we need to compensate current waveform to improve the overall smoothness of the conventional micro stepping system. We implement digital Pulse Width Modulation(PWM) driver to drive step motor and microphone was used for detecting vibration. Driver enables speed change automatically byincreasing or decreasing micro stepping ratio which we call Automatic Switching on the Fly. To compensate the torque harmonics, Neural Networks is applied to the system and we foundcompensated optimal input current waveform. Finally we can get smooth motion of step motor in a wide range of motor speed.

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Fabrication of Micro Structure Using Electro Discharge Deposition (Electro Discharge Deposition (EDD)을 이용한 미세 구조물 제작)

  • 오석훈;민병권;박성준;이상조
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2003.06a
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    • pp.1865-1868
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    • 2003
  • This paper provides a new method for hybrid machining, particularly suited to micro fabrication applications such as micro point, micro line, micro structure, micro partition and so on. Developed micro fabrication process by electrical discharge machining (EDM) and electrical discharge deposition (EDD) with metal powder (Ti, Fe) has been studied to build TiC or FeC structure. Titanium powder or iron powder is supplied from working fluid (kerosene or de-ionized water with powder) and adheres on a workpiece by the heat and electric power caused by the electrical discharge. The use of a tool electrode is expected to keep powder concentration high in the gap between a workpiece and a tool electrode and to accrete powder material on the workpiece. The deposition is tried under various electrical conditions (workpiece. tool electrode, working fluid, discharge current, voltage and powder etc.). On the other hand. using electrical discharge machining (EDM) with the same tool electrode, it can be used as a removal process (cutting) by electro erosion at the same time. Therefore. this new method can do a hybrid machining to build up and down a structure with the workpiece.

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Micro Mold Fabrication and the Micro Patterning by RTP Process (Micro Mold 제작 및 RTP 공정에 의한 미세 패턴의 성형)

  • Kim H. K.;Ko Y. B.;Kang J. J.;Rhim S. H.;Oh S. I.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2004.10a
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    • pp.294-297
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    • 2004
  • RTP(Rapid Thermal Pressing) is to fabricate desired pattern on polymer substrate by pressing patterned mold against the substrate heated around glass transition temperature. For a successful RTP process, the whole process including heating, molding, cooling and demolding should be conducted 'rapidly' as possible. As the RTP process is effective in replicating patterns on flat large surface without causing shape distortion after cooling, it is being widely used for fabricating various micro/bio application components, especially with channel-type microstructures on surface. This investigation finally aims to develop a RTP process machine for mass-producing micro/bio application components. As a first step for that purpose, we intended to examine the technological difficulties for realizing mass production by RTP process. Therefore, in the current paper, 4 kinds of RTP machines were examined and then the RTP process was conducted experimentally for PMMA film by using one of the machines, HEX 03. The micro-patterned molds used for RTP experiment was fabricated from silicon wafer by semi-conduct process. The replicated micro patterns on PMMA films were examined using SEM and the causes of defect observed in the replicated patterns were discussed.

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An Experimental Study on Evaporative Heat Transfer Characteristics in Micro-Fin Tubes Before and After Expansion Process (마이크로핀관의 확관 전후 증발열전달 특성에 관한 실험적 연구)

  • 전상희;황윤욱;윤석호;김민수
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.12 no.10
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    • pp.932-940
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    • 2000
  • An experimental study on evaporative heat transfer characteristics in micro-fin tubes before and after expansion process has been performed with R-22. Single-grooved micro-fin tubes with outer diameter of 9.52 mm were used as test sections, and it was uniformly heated by applying direct current to the test tubes. Experiments were conducted at mass flow rates of 20 and 30 kg/hr. For each mass flow rate condition, evaporation temperature was set at 5 and $15^{\circ}C$and heat flux was changed from 6 to 11 kW/$m^2$ The evaporative heat transfer coefficient of micro-fin tubes after expansion is decreased because of the crush of fins and enlargement of inner diameter compared to that before expansion. Convective boiling effect decreased remarkably at higher quality range in the micro-fin tube after expansion, and the difference of the heat transfer coefficient in micro-fin tubes before and after expansion was greater for higher quality region. The evaporative heat transfer coefficient of the micro-fin tube after expansion was 19.9% smaller on the average than that before expansion.

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