• Journal of the Korean Ceramic Society
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• v.44 no.9
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• pp.502-509
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• 2007

This paper investigated how Fine Fly Ash (FFA) with $14,000\;cm^2/g$ of Fineness affects the micro structure and material properties of High-Performance Concrete (HPC) before and after hardening from Material Test of HPC and Cement Paste. FFA is applied as a substitute of Silica Fume which is used necessarily in producing HPC. As a Material Test results, 5% FFA series specimen shows the lower fluidity than SF series specimen. When, however, the Fluidity of 10% FFA series specimen is increased reversely to the similar value of SF series specimen. The Porosity of FFA series specimen of 3 day age is displayed to $21{\sim}24%$, which is higher than $19{\sim}20%$ porosity of SF series specimen, while that of 28 day age is reached to $8{\sim}9%$, which is improved compared with 10% fo SF series specimen. It can be thought that FFA has better influence on the porosity of HPC in case of long term age. The Compressive strength of FFA series specimen shows the similar result with the property of porosity. The compressive strength of 28 day age FFA series specimen is $98{\sim}106%$ of SF series specimen and 107% of plain specimen to reveal better strength development.

• Resources Recycling
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• v.26 no.6
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• pp.97-101
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• 2017

Metal foams have a cellular structure consisting of a solid metal containing a large volume fraction of pores. In particular, open pores which are penetrable pores are necessary for industrial applications such as in high temperature filters and as support for catalysts. In this study, Fe foam with greater than 90% porosity and 2-mm pore size was successfully fabricated using a slurry coating process and the pore properties were characterized. The Fe and $Fe_2O_3$ powder mixing ratios were controlled to produce Fe foam samples with different pore sizes and porosity. First, the slurry was prepared through the uniform mixing of powders, distilled water, and polyvinyl alcohol(PVA). The amount of slurry coated with the PU foam increased with increasing $Fe_2O_3$ mixing powder ratio, but the shrinkage and porosity of the Fe foams decreased, respectively, with increasing $Fe_2O_3$ mixing powder ratio.

• Korean Chemical Engineering Research
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• v.46 no.4
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• pp.722-726
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• 2008

Silica microsphere is a world leading innovative material used in adsorbent packing materials in HPLC technology. The application of microsphere lies in the ability to the surface modification of silica with the special materials such as polymers, metals and bio-active materials. Collagen is a major structural protein of connective tissues and has a good biocompatibility. In this study, we prepared the purified silica porous microsphere, having micro diameters in the range of a pore volume at least 50% by the aggregation procedure of colloidal silica with the polymerization method (PICA). The microspheres were modified by collagen hydrogel to improve the biocompatible properties for biomedical product. The silica/collagen microsphere composite doped with silver nanoparticles was prepared and investigated the capabilities of biomaterial application through the evaluation of the structure characteristics of the microsphere composit.

• Journal of Information Display
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• v.2 no.2
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• pp.52-60
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• 2001

The electrical and mechanical properties in indium-tin-oxide films deposited on polymer substrate were examined. The materials of substrates were polyethersulfone (PES) which have gas barrier layer and anti-glare coating for plastic-based devices. The experiments were performed by rf-magnetron sputtering using a special instrument and buffer layers. Therefore, we obtained a very flat polymer substrate deposited ITO film and investigated the effects of buffer layers, and the instrument. Moreover, the influences of an oxygen partial pressure and post-deposition annealing in ITO films deposited on polymer substrates were clarified. X-ray diffraction observation, measurement of electrical property, and optical microscope observation were performed for the investigation of micro-structure and electro-mechanical properties, and they indicated that as-deposited ITO thin films are amorphous and become quasi-crystalline after adjusting oxygen partial pressure and thermal annealing above $180^{\circ}C$. As a result, we obtained 20-25 ${\Omega}/sq$ of ITO films with good transmittance (above 80 %) of oxygen contents with under 0.2 % and vacuum annealing. Furthermore, using organic buffer layer, we obtained ITO films which have a rather high electrical resistance (40-45 ${\Omega}/sq$) but have improved optical (more than 85 %) and mechanical characteristics compared to the counterparts. Consequently, a prototype reflective color plastic film LCD was fabricated using the PES polymer substrates to confirm whether the ITO films could be realized in accordance with our experimental results.

• Smart Structures and Systems
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• v.26 no.3
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• pp.331-343
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• 2020

In this paper, based on the CPT, motion equations for a sandwich plate containing a core and two integrated face-sheets have derived. The structure rests on the Visco-Pasternak foundation, which includes normal and shear modules. The piezo-magnetic core is made of CoFe₂O₄ and also is subjected to 3D magnetic potential. Two face sheets at top and bottom of the core are under electrical fields. Also, in order to obtain more accuracy, the effect of flexoelectricity has took into account at face sheets' relations in this work. Flexoelectricity is a property of all insulators whereby they polarize when subject to an inhomogeneous deformation. This property plays a crucial role in small-scale rather than macro scale. Employing CPT, Hamilton's principle, flexoelectricity considerations, the governing equations are derived and then solved analytically. By present work a detailed numerical study is obtained based on Piezoelectricity, Flexoelectricity and modified couple stress theories to indicate the significant effect of length scale parameter, shear correction factor, aspect and thickness ratios and boundary conditions on natural frequency of sandwich plates. Also, the figures show that there is an excellent agreement between present study and previous researches. These finding can be used for automotive industries, aircrafts, marine vessels and building industries.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.1
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• pp.35-41
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• 2002

Flip-chip interconnection that uses solder bump is an essential technology to improve the performance of micro-electronics which require higher working speed, higher density, and smaller size. In this paper, the shear strength of Cr/Cr-Cu/Cu UBM structure of the high-melting solder bump and that of low-melting solder bump after aging is evaluated. Observe intermetallic compound and bump joint condition at the interface between solder and UBM by SEM and TEM. And analyze the shear load concentrated to bump applying finite element analysis. As a result of experiment, the maximum shear strength of Sn-97wt%Pb which was treated 900 hrs aging has been decreased as 25% and Sn-37wt%Pb sample has been decreased as 20%. By the aging process, the growth of $Cu_6/Sn_5$ and $Cu_3Sn$ is ascertained. And the tendency of crack path movement that is interior of a solder to intermetallic compound interface is found.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.3
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• pp.101-108
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• 2004

A 16-bit adiabatic ALU(arithmetic logic unit) is designed. A simplified four-phase clock generator is also designed to provide supply clocks for the adiabatic circuits. All the clock line charge on the capacitive interconnections is recovered to recycle energy. Adiabatic circuits are designed based on ECRL (efficient charge recovery logic) using a 0.35${\mu}{\textrm}{m}$ CMOS technology. The post-layout simulation results show that the power consumption of the adiabatic ALU including supply clock generator is reduced by a factor of 1.15-1.77 compared to the conventional CMOS ALU with the same structure.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.8
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• pp.37-44
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• 2004

This paper describes a new GaAs-based surface-micromachined microstrip line supported by dielectric post and air-gapped signal line with ground metal. This new type of dielectric-supported air-gapped microstripline(DAML) structure is developed using surface micromachining techniques to provide easy means of airbridge connection between the signal lines and to archive low losses at millimeter-wave frequency band with wide impedance range. Each DAMLs with the length of 5 mm are fabricated and the measured characteristics are compared with those of the conventional microstrip transmission line. These transmission lines are composed of 10 ${\mu}{\textrm}{m}$ height of signal line, post size of 10 ${\mu}{\textrm}{m}$ ${\times}$ 10 ${\mu}{\textrm}{m}$ and post height of 9 ${\mu}{\textrm}{m}$. By elevating the signal lines from the substrate using the micromachining technology, the substrate dielectric loss can be reduced Compared with of the conventional microstrip transmission line showing 7.5 dB/cm loss at 50 GHz, the loss can be reduced to 1.1 dB/cm loss at 50 GHz.

• Journal of the korean academy of Pediatric Dentistry
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• v.25 no.1
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• pp.47-61
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• 1998

The purpose of this study was to compare the microleakage pattern of glass ionomer with resin restoration in microleakage pattern of primary and permanent teeth. Microscopical observation of interface between tooth structure and restoration was also performed. 80 and 8 sound molar teeth were used for the microleakage test and SEM study respectively. Data were analyzed statistically using ANOVA test and/or t-Test. The results of the present study were as follows: 1. According to the result of microleakage pattern between primary and permanent tooth, primary tooth generally showed more micro leakage than permanent tooth in all groups (p<.05). 2. In the resin-filled groups, occlusal margin was shown to have more microleakage than gingival margin(p<.05). Whereas the glass ionomer-filled groups showed no statistically significant differences between them(p>.05). 3. No statistically significant differences in microleakage could be found between two different resin groups(p>.05), while Fuji II LC group showed less microleakage than Ketac-Fil group(p>.05). 4. The various type hybrid layer was evident under SEM in resin-filled groups both in primary and permanent teeth with generally thicker layer in primary group. Among glass-ionomer group, Fuji II LC group showed more intact adhesion to tooth surface than Ketac-Fil group

• Korean Journal of Materials Research
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• v.21 no.6
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• pp.309-313
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• 2011

The power capacitors used as vehicle inverters must have a small size, high capacitance, high voltage, fast response and wide operating temperature. Our thin film capacitor was fabricated by alumina layers as a dielectric material and a metal electrode instead of a liquid electrolyte in an aluminum electrolytic capacitor. We analyzed the micro structures and the electrical properties of the thin film capacitors fabricated by nano-channel alumina and metal electrodes. The metal electrode was filled into the alumina nano-channel by electroless nickel plating with polyethylene glycol and a palladium catalyst. The spherical metals were formed inside the alumina nano pores. The breakdown voltage and leakage current increased by the chemical reaction of the alumina layer and $PdCl_2$ solution. The thickness of the electroless plated nickel layer was 300 nm. We observed the nano pores in the interface between the alumina layer and the metal electrode. The alumina capacitors with nickel electrodes had a capacitance density of 100 $nF/cm^2$, dielectric loss of 0.01, breakdown voltage of 0.7MV/cm and leakage current of $10^4{\mu}A$.