• 대한치과보철학회지
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• 제41권3호
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• pp.351-359
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• 2003

Statement of problem: Regardless of any restoration, most of case, we used in screw connection between abutment and implant. For this reason, implant screw loosening has been remained problem in restorative practices. Purpose: The purpose of this study was to compare surface of coated/plated screw with titanium and gold alloy screw and to evaluate physical property of coated/plated material after scratch test in FESEM investigation Material and methods: GoldTite, titanium screw provided by 3i (Implant Innovation, USA) and TorqTite, titanium screw by Steri-Oss (Nobel Biocare, USA) and gold screw, titanium screw by AVANA (Osstem Implant, korea) - were selected for this study. Each abutment screw surface was observed at 100 times, and then screw crest, root, and slope were done more detailed numerical value, at 1000 times with FESEM. A micro-diamond needle was also prepared for the scratch test. Each abutment screw was fixed, micro-diamond scratch the surface of head region was made at constant load and then was observed central region and periphery of fine trace through 1000 times with FESEM. Results: The surface of GoldTite was smoother than that of other kinds of screw and had abundant ductility and malleability compared with titanium and gold screw. The scratch test also showed that teflon particles were exfoliated easily in screw coated with teflon. Titanium screw had a rough surface and low ductility. Conclusion: It was recommended that the clinical use of gold-plated screw would prevent a screw from loosening. CLINICAL IMPLICATIONS Clinical use of gold-plated screw would prevent a screw from loosening because it had abundant ductility and malleability compared with titanium and gold screw.

• 한국재료학회지
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• 제26권5호
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• pp.229-234
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• 2016

In this study, the degree of particle melting in $Y_2O_3$ plasma spraying and its effects on coating characteristics have been investigated in terms of microstructural features, microhardness and scratch resistance. Plasma sprayed $Y_2O_3$ coatings were formed using two different powder feeding systems: a system in which the powder is fed inside the plasma gun and a system in which the powder is fed externally. The internal powder spraying method generated a well-defined lamellae structure that was characterized by a thin porous layer at the splat boundary and microcracks within individual splats. Such micro-defects were generated by the large thermal contraction of splats from fully-molten droplets. The external powder spraying method formed a relatively dense coating with a particulate deposition mode, and the deposition of a higher fraction of partially-melted droplets led to a much reduced number of inter-splat pores and intra-splat microcracks. The microhardness and scratch resistance of the $Y_2O_3$ coatings were improved by external powder spraying; this result was mainly attributed to the reduced number of micro-defects.

• 한국재료학회지
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• 제31권7호
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• pp.403-408
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• 2021

Various surface colors are predicted and implemented using the interference color generated by controlling the thickness of nano-level diamond like carbon (DLC) thin film. Samples having thicknesses of up to 385 nm and various interference colors are prepared using a single crystal silicon (100) substrate with changing processing times at low temperature by plasma-enhanced chemical vapor deposition. The thickness, surface roughness, color, phases, and anti-scratch performance under each condition are analyzed using a scanning electron microscope, colorimeter, micro-Raman device, and scratch tester. Coating with the same uniformity as the surface roughness of the substrate is possible over the entire experimental thickness range, and more than five different colors are implemented at this time. The color matched with the color predicted by the model, assuming only the reflection mode of the thin film. All the DLC thin films show constant D/G peak fraction without significant change, and have anti-scratch values of about 19 N. The results indicate the possibility that nano-level DLC thin films with various interference colors can be applied to exterior materials of actual mobile devices.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집 Vol.14 No.1
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• pp.171-175
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• 2001

Chemical mechanical polishing(CMP) process has been widely used to planarize dielectrics and metal, which can apply to employed in integrated circuits for sub-micron technology. Despite the increased use of CMP process, it is difficult to accomplish the global planarization of free-defects in inter level dielectrics and metal. Especially, defects like (micro-scratch) lead to severe circuit failure, and affects yield. Current conditioning method - bladder type, orbital pad motion- usually provides unsuitable pad profile during ex-situ conditioning near the end of pad life. Since much of the pad wear occurs by the mechanism of bladder type conditioning and its orbital motion without rotation, we need to implement new ex-situ conditioner which can prevent abnormal regional force on pad caused by bladder-type and also need to rotate the pad during conditioning. Another important study of ADPC is related to the orbital scratch of which source is assumed as diamond grit dropped from the strip during ex-situ conditioning. Scratch from diamond grit damaged wafer severely so usually scraped. Figure 1 shows the typical shape of scratch damaged from diamond. e suspected that intensive forces to the edge area of bladder type stripper accelerated the drop of Diamond grit during conditioning. so new designed Flat stripper was introduced.

• 한국정밀공학회지
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• 제21권4호
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• pp.24-31
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• 2004

The objective of this work is to suggest a mastless pattern fabrication technique using the combination of machining by Nanoindenter(equation omitted) XP and HF wet etching. Sample line patterns were machined on a borosilicate surface by constant load scratch (CLS) of the Nanoindenter(equation omitted) XP with a Berkovich diamond tip, and they were etched in HF solution to investigate chemical characteristics of the machined borosilicate surface. All morphological data of scratch traces were scanned using atomic force microscope (AFM).

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 춘계학술대회 논문집 반도체재료
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• pp.30-33
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• 2001

Chemical mechanical polishing(CMP) process has been widely used to planarize dielectrics, which can apply to employed in integrated circuits for sub-micron technology. Despite the increased use of CMP process, it is difficult to accomplish the global planarization of free-defects in inter-level dielectrics (ILD). Especially, defects like micro-scratch lead to severe circuit failure, and affects yield. CMP slurries can contain particles exceeding $1{\mu}m$ size, which could cause micro-scratch on the wafer surface. The large particles in these slurries may be caused by particle agglomeration in slurry supply line. To reduce these defects, slurry filtration method has been recommended in oxide CMP. In this work, we have studied the effects of filtration and the defect trend as a function of polished wafer count using various filters in inter-metal dielectric(IMD)-CMP. The filter installation in CMP polisher could reduce defect after IMD-CMP. As a result of micro-scratches formation, it shows that slurry filter plays an important role in determining consumable pad lifetime.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2015년도 춘계학술대회 논문집
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• pp.171-172
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• 2015

$Ni-W-Si_3N_4$ alloy composite coatings were prepared by pulse electro-deposition method using nickel sulfate bath with different contents of tungsten source, $Na_2WO_4.2H_2O$, and dispersed $Si_3N_4$ nano-particles. The structure and micro-structure of coatings was separately analyzed by X-ray diffraction (XRD) and scanning electron microscope (SEM). Results indicated that nano $Si_3N_4$ and W content in alloy had remarkable effect on micro-structure, micro-hardness and scratch resistant properties. Tungsten content in Ni-W and $Ni-W-Si_3N_4$ alloy ranged from 7 to 14 at.%. Scratch test results suggest that as compared to Ni-W only, $Ni-W-Si_3N_4$ prepared from Ni/W molar ratio of 1:1.5 dispersed with 20 g/L $Si_3N_4$ has shown the best result among different samples.

• 반도체디스플레이기술학회지
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• 제10권2호
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• pp.7-12
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• 2011

In this paper, a laser scattering mechanism are designed to detect micro defects such as dent, scratch, pinhole, etc. Its influential parameters are experimentally selected and scattering patterns of micro defects have been analyzed for silicon wafer in solar cell. As a result of experiments, scattered lights are rather increased in wafer surface with micro defects, in comparison to no micro ones. Scattering parameters are optimally selected for obtaining robust and high quality laser scattering images of micro defects. It is shown that scattered light components are linearly increased according to the increase of micro defect sizes, and the depth of micro-defects give a large influence on optical deflection.

• 열처리공학회지
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• 제15권3호
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• pp.118-126
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• 2002

TiCN thin films were deposited on tool steels at $510^{\circ}C$ by PECVD from a $TiCl_4+N_2+CH_4+H_2+Ar$ gaseous mixture. The microstructures and preferred orientation were investigated. The micro-scratch tests were performed using a system equipped with an acoustic emission sensor. Critical loads were determined to evaluate the adhesion of TiCN to substrate. The influences of the microstructures of substrates, double layered coatings, and coatings after nitriding(duplex coating) were investigated. The experimental results showed that the microstructures of substrates and double layered coating did not affect the critical loads considerably. By the duplex coating, critical loads were not always increased. In some cases, duplex coatings decreased critical loads significantly despite of absence of black layer. In this study, we tried to relate the results of scratch test to the residual stress analysis. Nitriding before the coating reduces the tensile residual stress in the film, which gives rise to low critical load in scratch test.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2004년도 춘계학술대회 논문요약집
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• pp.140-140
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• 2004

마이크로 기술을 대변하는 Micro-Electro-Mechanical-Systems (MEMS)와 반도체, 각종 micro-sensor 및 actuator 등은 실리콘 위에 박막 코팅한 재료를 주로 사용하고 있다. 따라서 1 Um 이하의 박막코팅에 의해 원하는 성능을 얻으려는 시도가 널리 진행되고 있다 Hard Disk Drive (HDD)의 Head-Disk Interface (HDI)와 MEMS 접촉면에서는 발생하는 마찰 및 마멸에 대한 문제 등은 중요한 고려대상이다. 특히 코팅 층의 표면 파손 현상은 코팅 층의 파손 특성과 코팅 층과 기판 사이의 결합상태가 큰 영향을 미친다.(중략)