• Transactions of the Society of Information Storage Systems
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• v.2 no.2
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• pp.100-104
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• 2006

Stamper surface temperature is very critical in replicating the high density optical disc substrates using injection molding as the pit or land/groove patterns on the optical disc substrate have decreased due to the rapid increase of areal density. During the filling stage, the polymer melt in the vicinity of the stamper surfaces rapidly solidifies and the solidified layer generated during polymer filling greatly deteriorates transcribability and fluidity of polymer melt. To improve transcribability and fluidity of polymer melt, stamper surface temperature should be controlled such that the growth of the solidified layer is delayed during the filling stage. In this study, the effect of heating on replication process was simulated numerically. Then, an injection mold equipped with instant active heating system was designed and constructed to raise the stamper surface temperature over the glass transition temperature during filling stage of the injection molding. Also, the closed loop controller using the Kalman filter and the linear quadratic Gaussian regulator was designed. As a result. the stamper surface temperature was controlled according to the desired reference stamper surface temperature.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.352-353
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• 2006

가스센서용 마이크로 히터 제작에는 표연 마이크로 머시닝 또는 벌크 마이크로머시닝 기술을 이용한다. 표면 마이크로 머시닝에 의한 마이크로 히터 (MHP) 구조의 경우, 기판과 박막간의 폭이 좁기 때문에 에칭 공정 후 세정이 잘 이루어지지 않으면 열적 절연이 잘 이루어지지 않아서 히터와 센서의 성능을 저하시키는 원인이 된다. 본 연구에서는 표면 마이크로 머시닝 기술에 의한 가스 센서용 마이크로 히터를 제작한다. $SiO_2$와 $Si_3N_4$를 성분으로 하며, $100{\mu}m\;{\times}\;100{\mu}m$의 면적과 350 nm 의 두께를 갖는 가스 센서용 마이크로 히터를 제작하였다. 이를 위하여 ANSYS를 통한 유한요소해석에 의한 열분포 해석으로 최적구조를 확인하였다. 센서로의 열 전달 효율을 높이기 위해 센서 박막은 히터 위에 적층하였다. 실리콘 표면과 마이크로 히터와의 간격은 에칭 공정을 통하여 $2{\mu}m$로 하였으며, 이 공간에서는 에칭 및 세정 후에 이물질이 깨끗이 세정되지 않고 남아 있거나, 습식 공정 중에 수분의 장력에 의한 열전연성이 나빠질 수 있는 등 단점이 있다. 이는 건식 등방성 에칭 공정을 통하여 해결하였다.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.30 no.1 s.244
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• pp.74-81
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• 2006

Experiments to measure the pool boiling heat transfer on the micro-fin surfaces were performed with PF5060. The effects of various orientation and subcooling of heat surface on pool boiling performance were investigated under various heat-flux conditions for plain and micro-fin surfaces. The comparison between the results of this study and those of previous work shows a similar trend at the same conditions. From the results, it is proved that nucleate boiling performance is strongly dependent on the orientation, the micro-fin structure and the subcooling of heat surface. The heat flux on the surface with orientation angles of $45^{\circ}$ and $90^{\circ}$ was larger than that on horizontal surface(${\theta}=0^{\circ}$) at same wall superheat because of the effect of bubble sweeping. The nucleate boiling performance of micro-fin surfaces is enhanced by decreasing the fin size(WxL) and the pitch, respectively. The subcooling makes nucleate boiling performance lower for both micro-fin and plain surfaces.

• JSTS:Journal of Semiconductor Technology and Science
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• v.6 no.4
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• pp.293-298
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• 2006

Thermopiezoelectric method, using poly silicon heater and a piezoelectric sensor, was proposed for writing and reading in a probe based data storage system. Resistively heated tip writes data bits while scanning over a polymer media and piezoelectric sensor reads data bits from the self-generated charges induced by the deflection of the cantilever. 34${\times}$34 array of thermopiezoelectric nitride cantilevers were fabricated by a single step wafer level transfer method. We analyzed the noise level of the charge amplifier and measured the noise signal. With the sensor and the charge amplifier 20mn of deflection could be detected at a frequency of 10KHz. Reading signal was obtained from the cantilever array and the sensitivity was calculated.

• Journal of Sensor Science and Technology
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• v.18 no.2
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• pp.147-153
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• 2009

A thermal flow sensor has been fabricated and characterized, consisting of a center resistive heater surrounded by two upstream and one downstream temperature sensing resistors. The heater and temperature sensing resistors are fabricated from nitrogen-doped(n-type) polycrystalline silicon carbide(poly-SiC) deposited by LPCVD(low pressure chemical vapor deposition) on LPCVD silicon nitride films on a Si substrate. Cavities were etched into the Si substrate from the front side to create suspended silicon nitride membranes carrying the poly-SiC elements. One upstream sensor is located $50{\mu}m$ from the heater and has a sensitivity of $0.73{\Omega}$/sccm with ${\sim}15\;ms$ rise time in a dynamic range of 1000 sccm. N-type poly-SiC has a linear negative temperature coefficient and a TCR(temperature coefficient of resistance) of $-1.24{\times}10^{-3}/^{\circ}C$ from room temperature to $100^{\circ}C$.

• Journal of computational fluids engineering
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• v.16 no.2
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• pp.88-93
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• 2011

A numerical study of subcooled onset of nucleate boiling (ONB) in a micro-channel under pulsed heating using volume of fluids (VOF) model was conducted. The VOF simulation adopting the existing experimental condition is compared to the experimental data. The time to ONB was determined when the void fraction at the microheater surface first appeared. The theoretical superheat for homogeneous nucleation relatively predicts the transient ONB results of convective flow of water well based on local temperature distribution. It was found that once heat load increases at the heater, transient flow boiling starts to occur faster.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.1286-1289
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• 2004

A new thermal bimorph actuator for large out-of-plane displacement is designed, fabricated and tested. The deflecting beam is composed of polyimide, heater, and polyvinyl difluorides with tetrafluoroethylene(PVDF-TrFE). The large difference of coefficient of thermal expansion(CTE) of two polymer layers (polyimide and PVDF-TrFE) can generate a large deflection with relatively small temperature rising. Compared to the most conventional micro actuators based on MEMS(micro-electro mechanical system) technology, a large displacement, over 1 mm at 20 mW, could be achieved. The proposed actuator can find applications where a large vertical displacement is needed while keeping compact overall device size, such as a micro zooming lens.

• Transactions of the Korean Society of Mechanical Engineers
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• v.19 no.2
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• pp.418-426
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• 1995

A bubble-powered microactuator is designed conceptually. And the actuation mechanism due to bubble growth and collapse is studied numerically and analytically. In this analysis, it is estimated that the time lag for bubble formation on micro line heater, the duration of the bubble growth and collapse and the pressure change in actuator due to the bubble evolution. Based on these calculations, the actuator control scheme is visualized. This actuator may be applicable to the system which needs to pump liquid correctly and regularly.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.1029-1032
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• 2002

This paper describes a design of a tactile sensor, which can measure three components force and temperature due to thermal conductive. The bio-mimetic tactile sensor, alternative to human's finger, is comprised of four micro force sensors and four thermal sensors, and its size being 10mm$\times$10mm. Each micro force sensor has a square membrane, and its force range is 0.1N - 5N in the three-axis directions. On the other hand, the thermal sensor for temperature measurement has a heater and four temperature sensor elements. The thermal sensor is designed to keep the temperature. $36.5^{\circ}C$, constant, like human skin, and measure the temperature $0^{\circ}C$ to $50^{\circ}C$. The MEMS technology is applied to fabricate the sensing element of the tactile sensor.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.11a
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• pp.567-570
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• 2000

Thermal simulation of typical stack-type and newly proposed planar-type micro-gas sensors were studied by FEM method. the thermal analysis for the proposed planar structure including temperature distribution over the sensing layer and power consumption of the heater were carried using finite element method by computer simulation and well compared with those of typical stack-type micro-gas sensor. The thermal properties of the microsensor from thermal simulation were compared with those of an actual device to investigate the acceptability of the computer simulation.