• 제목/요약/키워드: Micro positioning system

검색결과 99건 처리시간 0.027초

3자유도 병렬형 마이크로 로봇 설계 (Design of 3 DOF Parallel Micro Robot)

  • 나흥열;이병주;서일홍;김희국
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 2000년도 제15차 학술회의논문집
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    • pp.429-429
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    • 2000
  • Micro positioning mechanism is the key technology in many fields, such as scanning electron microscopy (SEM), x-ray lithography, mask alignment and micro-machining. In the paper, a 3DOF parallel-type micro-positioning mechanism is proposed. This mechanism uses piezo-actuators and Flexure hinge to control x, y and $\theta$ motion. It is shown both analytically and numerically that 2 DOF flexure hinge model was better precision than 1 DOF flexure hinge design.

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압전전압 궤환에 의한 미세구동 연삭테이블의 개발 (A Development of Micro-Positioning Grinding Table using Piezoelectric Voltage Feedback)

  • 남수룡;김정두
    • 한국정밀공학회지
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    • 제12권2호
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    • pp.48-58
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    • 1995
  • A micro positioning system using piezoelectric actuators have very wide application region such as ultra-precision machine tool, optical device, measurement systen. In order ro keep a high precision displacement resolution, they use a position sensor and feedback the error. From the practical point of view, a high-resolution displacement sensor system are very expensive and difficult to guarantee such sensitive sensors work properly in the hard opera- tion environment of industry. In this study, a micro-positioning grinding table which does not require position sensor but uses piezoelectric voltage feedback, has been developed. It is driven by hystersis-considering reference input voltage which calculated from computer and then uses actuator/sensor characteristics of piezoelectric materials. From the result of experiments we proved a fast and stable response of micro-positioning system and suggested efficient technique to control the piezoelectric actuator. And through grinding experiments, it is revealed that a characteristics of ground surfaces transient to plastic deformation as extremely small depth of grinding.

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초정밀 평면 X-Y 스테이지의 시뮬레이션 및 제어성능 평가 (Simulation and Control performance evaluation of Ultra-Precision Single Plane X-Y Stage)

  • 박기형;김재열;곽이구
    • 한국공작기계학회논문집
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    • 제11권5호
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    • pp.65-72
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    • 2002
  • In this study, actuator, sensor, guide, power transmission element and control method are considered for ultra-precision positioning apparatus. Through previous process, single plane X-Y stage with ultra-precision positioning is manufactured. Global stage for the purpose of materialization with robust system, is combined by using AC servo motor and ball screw and rolling guide. And ultra-precision positioning system is developed by micro stage with elastic hinge type and piezo element. global servo and micro servo for the purpose of materialization positioning accuracy with nm(nanometer) are controlled simultaneously by using incremental encoder and laser interferometer as displacement measurement sensor. Through previous process, ultra-precision positioning system(100mm stroke and $\pm$ l0nm positioning accuracy) with single plane X-Y stage are materialized.

평면 X-Y 스테이지의 초정밀 위치결정을 위한 최적 설계 및 제어시스템 개발 (The Development of Optimal Design and Control System for Ultra-Precision Positioning on Single Plane X-Y Stage)

  • 한재호;김재열;심재기;김창현;조영태;김항우
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2002년도 춘계학술대회 논문집
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    • pp.348-352
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    • 2002
  • a basis such as IT(Information Technology), NT(Nano Technology) and BT(Bio Technology). Recently, NT is applied to various fields that are composed of science, industry, media and semiconductor-micro technology. It has need of IT that is ultra-precision positioning technology with strokes of many hundreds mm and maintenance of nm precision in fields of ultra micro process, ultra precision measurement, photo communication part and photo magnetic memory. This thesis represents optimal design on ultra-precision positioning with single plane X-Y stage and development of artificial control system for adequacy of industrial demand. Also, dynamic simulation on global stage is performed by using ADAMS (Automated Dynamic Analysis of Mechanical System) for the purpose of grasping dynamic characteristic on user designed X-Y global stage. The error between displacements from micro stage and from FEM(Finite Element Method) is 3.53% by verifications of stability on micro stage and control performance. As maximum Von-mises stress on hinge of micro stage is 5.981kg/mm$^2$ that is 1.5% of yield stress, stability on hinge is secured. Preparing previous results, optimal design of micro stage can be possible, and reliance of results with FEM can be secured.

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A Precision Micro-Positioning System by Using Hinge Mechanism

  • Choi, Hyeun-Seok;Lee, Hak-Joon;Han, Chang-Soo;Kim, Seung-Soo;Kim, Eung-Zu;Choi, Tae-Hoon;Na, Kyoung-Hwan
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 2003년도 ICCAS
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    • pp.1344-1348
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    • 2003
  • A precision micro-positioning system with a high displacement resolution and wide motion range has been required for industrialized applications in variety fields. This paper discusses the design of a precision micro-rotation stage with flexure hinges. Proposed system is applied to grinding machine for micro parts. Rotational motion is generated with this system. For this systems having a full rotation motion with high precision, a dual servo system with a coarse stage and a fine stage is proposed.

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The Study of Error Compensation for Repeatability Improvement of Precision Positioning System

  • Lee, Woogeun;Changsoo Han;Park, Hyeunseok;Lee, Kyeyoung
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 2001년도 ICCAS
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    • pp.66.6-66
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    • 2001
  • In this paper, we studied the error compensation using an error budget method for repeatability improvement of the precision positioning system. The precision positioning system is developed for micro-pressing machine. We performed the force and displacement analysis about parts of the system. Proposed system determines the position and orientation of the materials manufactured by micro-pressing machine. It is consisted of x-y-z linear stages setting the position, and the gripper system setting the orientation. We executed kinematic and dynamic modeling of the whole precision positioning system. By generalizing the design variables, precision positioning system has the flexibility of material dimension. As we tried an error compensation using ...

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초정밀 평면 X-Y 스테이지의 시뮬레이션 및 제어성능 평가 (Simulation and Control performance evaluation of Ultra-Precision Single Plane X-Y Stage)

  • 곽이구;김재열;한재호;김영석;안재신;노기웅
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 2002년도 춘계학술대회 논문집
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    • pp.422-428
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    • 2002
  • In this study, actuator, sensor, guide, power transmission element and control method are considered for ultra-precision positioning apparatus. Through previous process, single plane X-Y stage with ultra-precision positioning is manufactured. Global stage for the purpose of materialization with robust system, is combined by using AC servo motor and ball screw and rolling guide. And ultra-precision positioning system is developed by micro stage with elastic hinge type and piezo element. global servo and micro servo for the purpose of materialization positioning accuracy with nm(nanometer) are controlled simultaneously by using incremental encoder and laser interferometer as displacement measurement sensor. Through previous process, ultra-precision positioning system (100mm stroke and ${\pm}$ 10nm positioning accuracy) with single plane X-Y stage are materialized.

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초미세 위치결정시스템을 이용한 실리콘 웨이퍼의 파괴거동에 관한 연구 (A Study on the Fracture behavior in Silicon Wafer using the Ultra-Precision Micro Positioning System)

  • 이병룡
    • 한국생산제조학회지
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    • 제9권1호
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    • pp.38-44
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    • 2000
  • The background of this study lies in he investigation of the formation mechanism of ductile mode(nkanometer-size) chips of brittle materials such as fine ceramics glass and silicon. As the first step to achieve this purpose this paper intends to observe the micro-deformation behavior of these materials in sub${\mu}{\textrm}{m}$ depth indentation tests using a diamond indentor. In this study it was developed Ultra-Micro Indentation. Device using the PZT actuator. Experimentally by using the Ultra-Micro Indentation device the micro fracture behavior of the silicon wafer was investigated. It was possible that ductile-brittle transition point in ultimate surface of brittle material can be detected by adding an acoustic emission sensor system to the Ultra-Micro Indentation appartus.

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미세 부품 조작을 위한 탄성힌지 기반 압전소자 구동형 초정밀 머니플레이션 시스템 (A Piezo-driven Fine Manipulation System Based on Flexure Hinges for Manipulating Micro Parts)

  • 최기봉;이재종;김기홍;고국원
    • 제어로봇시스템학회논문지
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    • 제15권9호
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    • pp.881-886
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    • 2009
  • This paper presents a manipulation system consisting of a coarse/fine XY positioning system and an out-of-plane manipulator. The object of the system is to conduct tine positioning and manipulation of micro parts. The fine stage and the out-of-plane manipulator have compliant mechanisms with flexure hinges, which are driven by stack-type piezoelectric elements. In the fine stage, the compliant mechanism plays the roles of motion guide and displacement amplification. The out-of-plane manipulator contains three piezo-driven compliant mechanisms for large working range and fine resolution. For large displacement, the compliant mechanism is implemented by a two-step displacement amplification mechanism. The compliant mechanisms are manufactured by wire electro-discharge machining for flexure hinges. Experiments demonstrate that the developed system is applicable to a fine positioning and fine manipulation of micro parts.

이중서보제어루프를 통한 서보모터-압전구동기의 초정밀위치결정 시스템 (Ultra precision positioning system for Servo Motor-Piezo actualtor using dual servo loop)

  • 이동성;박종호;박희재
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1995년도 추계학술대회 논문집
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    • pp.437-441
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    • 1995
  • In this paper, the ultra precision positioning system for servo motor and piezo actuator using dual servo loop control has been developed. For positioning system having long distance with ultra precision, the combination of global stage and micro stage is required. Servo moter and ball screw are used as a master stage and piezo acuator as a fine stage. By using this system, an positional precision witin .+-. 30nm has been achieved at dual servo loop control. When using micro stage, an positional precision within .+-. 10nm has been achieved. This result can be applied to develop semiconductor equipment such as wafer stepper.

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