• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11b
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• pp.185-188
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• 2001

Chemical mechanical polishing(CMP) process is widely used for global planarization of inter-metal dielectric (IMD) layer and inter-layer dielectric (ILD) for deep sub-micron technology. However, as the IMD and ILD layer gets thinner, defects such as micro-scratch lead to severe circuit failure, which affect yield. In this paper, for the improvement of CMP process, deionized water (DIW) pressure, purified $N_2 \; (PN_2)$ gas, slurry filter and high spray bar were installed. Our experimental results show that DIW pressure and $PN_2$ gas factors were not related with removal rate, but edge hot-spot of patterned wafer had a serious relation. Also, the filter installation in CMP polisher could reduce defects after CMP process, it is shown that slurry filter plays an important role in determining consumable pad lifetime. The filter lifetime is dominated by the defects. However, the slurry filter is impossible to prevent defect-causing particles perfectly. Thus, we suggest that it is necessary to install the high spray bar of de-ionized water (DIW) with high pressure, to overcome the weak-point of slurry filter. Finally, we could expect the improvements of throughput, yield and stability in the ULSI fabrication process.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.51 no.5
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• pp.191-195
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• 2002

Chemical mechanical Polishing (CMP) process is widely used for the global planarization of inter-metal dielectric (IMD) layer and inter-layer dielectric (ILD) for deep sub-micron technology. However, as the IMD and ILD layer gets thinner, defects such as micro-scratch lead to severe circuit failure, which affect yield. In this paper, for the improvement of CMP process, deionized water (DIW) pressure, purified $N_2$ ($PN_2$) gas, point of use (POU) slurry filler and high spray bar (HSB) were installed. Our experimental results show that DW pressure and P$N_2$ gas factors were not related with removal rate, but edge hot-spot of patterned wafer had a serious relation. Also, the filter installation in CMP polisher could reduce defects after CMP process, it is shown that slurry filter plays an important role in determining consumable pad lifetime. The filter lifetime is dominated by the defects. However, the slurry filter is impossible to prevent defect-causing particles perfectly. Thus, we suggest that it is necessary to install the high spray bar of de-ionized water (DIW) with high pressure, to overcome the weak-point of slurry filter Finally, we could expect the improvements of throughput, yield and stability in the ULSI fabrication process.

• The Journal of Korean Academy of Prosthodontics
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• v.48 no.4
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• pp.301-307
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• 2010

Purpose: The objectives of the current study are to assess the accuracy of X-Ray Micro Computed Tomography (microCT) in measuring enamel thickness and to evaluate enamel thickness in maxillary incisors of Koreans. Materials and methods: Five maxillary incisors were embedded in resin block. These teeth were longitudinally sectioned labiolingually through the medial axis. After polishing, the teeth were scanned using a microCT (X-EYE SYSTEM; DRGEM, Seoul, Korea). On a scanning electron microscope (S-4300; Hitachi, Tokyo, Japan) (${\times}20$) and a microCT, nearly identical planes were reconstructed. In each tooth, the thickness of labial enamel was measured 1, 3 and 5 mm above the cementoenamel junction (CEJ). Thus, the accuracy of the microCT was evaluated. In addition, using 26 maxillary central incisors and 11 maxillary lateral incisors, in the medial axis and 2 mm remote areas mesially and distally from the medial axis, the thickness of labial enamel was measured 1, 3 and 5 mm above the CEJ along the long axis of the teeth. Results: Measurements from nearly identical planes in physical and microCT sections differed by 3.81%. An independent t-test was performed and this showed that there were no significant differences in the measurements between the two methods. Mean values of labial enamel thickness in maxillary central incisors 1, 3 and 5 mm above the CEJ were $0.32{\pm}0.01$, $0.50{\pm}0.0.2$ and $0.70{\pm}0.02\;mm$, respectively. Mean values of labial enamel thickness in maxillary lateral incisors 1, 3 and 5 mm above the CEJ were $0.30{\pm}0.01$, $0.55{\pm}0.03$ and $0.80{\pm}0.02\;mm$, respectively. Conclusion: In measuring enamel thickness, microCT is one of useful way of measurement. So according to the results of this research, when restoring a porcelain laminate veneer on maxillary incisors in Koreans, careful consideration is needed in the amount of enamel reduction.

• Restorative Dentistry and Endodontics
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• v.32 no.2
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• pp.138-150
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• 2007

The purpose of this study was to evaluate the difference of surface roughness of composite resin according to composite resin type, polishing methods, and use of resin sealant. Two hundred rectangular specimens, sized $8{\times}3{\times}2mm$, were made of Micro-new (Bisco, Inc., Schaumburg, IL, U.S.A) and Filtek Supreme (3M ESPE Dental Products, St. Paul, MN, U.S.A.), and divided into two groups; Micronew-M group, Filtek Supreme-S group. Specimens for each composite group were subdivided into five groups by finishing and polishing instruments used; M1 & S1(polyester strip), M2 & S2 (Sof-Lex disc), M3 & S3 (Enhance disc and polishing paste), M4 & S4(Astropol) and M5 & S5 (finishing bur), Polished groups were added letter B after the application of resin surface sealant (Biscover), eg, M1B and S1B. After specimens were stored with distilled water for 24hr, average surface roughness (Ra) was taken using a surface roughness tester. Representative specimens of each group were examined by FE-SEM (S-4700: Hitachi High Technologies Co., Tokyo, Japan). The data were analysed using paired t-test, ANOVA and Duncan's tests at the 0.05 probability level. The results of this study were as follows ; 1. The lowest Ra was achieved in all groups using polyester strip and the highest Ra was achieved in M5, S5 and M5B groups using finishing bur. On FE-SEM, M1 and S1 groups provided the smoothest surfaces, M5 and S5 groups were presented the roughest surfaces and voids by debonding of filler on the polished specimens. 2. There was no significant difference in Ra between Micronew and Filtek Supreme before the application of resin sealant, but Micronew was smoother than Filek Supreme after the application of resin sealant. 3. There was significant corelation between Ra of type of composite resin and polishing methods before the application of resin sealant (p=0.000), but no significant interaction between them after the application of resin sealant. On FE-SEM, most of composite resin surfaces were smooth after the application of resin sealant on the polished specimens. 4. Compared with before and after the application of resin sealant in group treated in the same composite and polishing methods, Ra of M4B and M5B was statistically lower than that of M4 and M5, and S5B was lower than that of S5, respectively (p<0.05). In conclusion, surface roughness by polishing instruments was different according to type of composite resin. Overall, polyester strip produced the smoothest surface, but finishing bur produced the roughest surface. Application of resin sealant provided the smooth surfaces in specimens polished with Enhance, Astropol and finishing bur, but not provided them in specimens polished with Sof-Lex disc.

• Journal of Sensor Science and Technology
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• v.11 no.1
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• pp.39-47
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• 2002

Optical disk drives read information by replacing a laser beam on the disk track. As information has become larger, the more accurate position control of a laser beam is necessary. In this paper, we report the analysis and fabrication of the micro mirror for optical disk drivers. The mirror was fabricated by using MEMS technology. Especially, the Process using the lapping and polishing step after the bonding of the mirror and electrode plates was employed for the process reliability. The mirror size was $2.5mm{\times}3mm$ and it needed about 35V for displacement of $3.2{\mu}m$.

• Safety and Health at Work
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• v.15 no.1
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• pp.96-101
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• 2024

Background: Silicosis among workers who fabricate engineered stone products in micro or small-sized enterprises (MSEs) was reported from several countries. Workplace exposure data of these workers at high risk of exposure to respirable crystalline silica (RCS) dust are limited. Methods: We surveyed workers performing cutting, shaping and polishing tasks at 6 engineered stone fabricating MSEs in Sydney, Australia prior to regulatory intervention. Personal exposure to airborne RCS dust in 34 workers was measured, work practices were observed using a checklist and worker demography recorded. Results: Personal respirable dust measurements showed exposures above the Australian workplace exposure standard (WES) of 0.1 mg/m³ TWA-8 hours for RCS in 85% of workers who performed dry tasks and amongst 71% using water-fed tools. Dust exposure controls were inadequate with ineffective ventilation and inappropriate respiratory protection. All 34 workers sampled were identified as overseas-born migrants, mostly from three linguistic groups. Conclusions: Workplace exposure data from this survey showed that workers in engineered stone fabricating MSEs were exposed to RCS dust levels which may be associated with a high risk of developing silicosis. The survey findings were useful to inform a comprehensive regulatory intervention program involving diverse hazard communication tools and enforcing improved exposure controls. We conclude that modest occupational hygiene surveys in MSEs, with attention to workers' demographic factors can influence the effectiveness of intervention programs. Occupational health practitioners should address these potential determinants of hazardous exposures in their workplace surveys to prevent illness such as silicosis in vulnerable workers.

• Journal of Mechanical Science and Technology
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• v.16 no.11
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• pp.1428-1434
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• 2002

The ball-on-disk type sliding tests with boundary lubricated steels were carried out to verify the effect of initial spacing in surface profiles on wear and scuffing. Three kinds of surface spacing, which are closely related with initial surface micro-cracks on sliding surfaces, were produced on AISI 1045 steel surfaces using different grinding and polishing processes. Frictional forces and time to scuffing were measured, and the shape and amount of wear particles were analyzed to compare the with original surface profiles. From the tests, it was confirmed that the size of wear particles are related closely to the original spacing of the surface profile. The time to failure and amount of wear were sensitive to the surface spacing. The wider surface spacing shows much longer sliding life and smaller amount of wear than the others. Time to scuffing was increased with increasing surface pro(lie spacing. The size of wear particles increased while the wear and wear rate K were decreased with an increase in surface spacing. After the sliding tests, surface cracks of inner parts of the wear track formed due to scuffing were observed and compared among the specimens having the different surface spacing.

• Proceedings of the KIEE Conference
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• 1999.07d
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• pp.1888-1890
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• 1999

In this work, we have systematically studied the effects of filtration and the defect trend as a function of polished wafer count using various filters in Inter-Metal Dielectric(IMD) CMP. The filter Installation in CMP polisher makes defect reduced after IMD CMP. As a result of formation micro-scratches, it shows that slurry filter plays an important role in determining consumable pad lifetime. The filter lifetime is dominated by the defects. We have acknowledged slurry filter lifetime is fixed by the degree of generating defects.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.5
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• pp.218-224
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• 2003

This paper describes a novel MEMS integration technique on a CMOS chip. MEMS integration on CMOS circuit has many advantages in view of manufacturing cost and reliability. The surface topography of a CMOS chip from a commercial foundry has 0.9 ${\mu}{\textrm}{m}$ bumps due to the conformal coating on aluminum interconnect patterns, which are used for addressing each MEMS element individually. Therefore, it is necessary to achieve a flat mirror-like CMOS chip fer the microelectromechanical system (MEMS) such as micro mirror array. Such CMOS chip needs an additional thickness of the dielectric passivation layer to ease the subsequent planarization process. To overcome a temperature limit from the aluminum thermal degradation, this study uses RF sputtering of silicon nitride at low temperature and then polishes the CMOS chip together with the surrounding dummy pieces to define a polishing plane. Planarization reduces 0.9 ${\mu}{\textrm}{m}$ of the bumps to less than 25 nm.

• Tribology and Lubricants
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• v.25 no.6
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• pp.404-408
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• 2009

In this paper, the relationship between the material removal rate and the interfacial mechanical properties at particle-surface contact situation, which can be seen in an abrasive machining process using micro/nano-sized particles, was discussed. Friction and stiffnesses were measured experimentally on an atomic force microscope (AFM) by using colloidal probes which have a silica colloid particle in place of tip to simulate a particle-flat surface contact in an abrasive machining process. From the experimental investigation and theoretical contact analysis, the interfacial contact properties such as lateral stiffness of contact, friction, the material removal rate were presented with respect to some of material surfaces and the relationship between the properties as well.