• 제목/요약/키워드: Micro mechanical device

검색결과 267건 처리시간 0.038초

소프트 식각법을 이용한 효율적 제작방식의 마찰전기 에너지 수확소자 개발 (Cost Effective Fabrication of a Triboelectric Energy Harvester Using Soft Lithography)

  • 이준영;성태훈;여종석
    • 한국진공학회지
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    • 제22권4호
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    • pp.198-203
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    • 2013
  • 에너지 수확은 우리주변에 존재하는 버려지는 에너지를 유용한 전기에너지로 변환하는 기술이다. 마찰전기 소자는 접촉을 통한 정전기를 유도하는 원리로 동력학적 에너지를 전기에너지로 전환하는 소자이다. 본 연구에서는 소프트 식각 기술을 활용하여 제작 단계를 최소화한 마찰전기 에너지 수확소자를 개발하고, 그 전기적 특성을 측정하였다. 마찰전기를 통한 발전은 마이크로패턴을 통해 마이크로 거칠기를 가진 알루미늄 층과 PDMS 층 사이에서 발생한다. 이때 PDMS 층의 마이크로 패턴은 마스크리스 식각을 통해 만들어진 알루미늄 층의 마이크로 패턴을 소프트 식각법으로 바로 본뜨는 방식으로 제작되었다. 본 소자는 2 V와 20 nA의 발전 성능을 나타낸다.

엑스선 그레이 스케일 리소그래피를 활용한 반원형 단면의 서브 마이크로 선 패턴의 바이오멤스 플랫폼 응용 (X-ray grayscale lithography for sub-micron lines with cross sectional hemisphere for Bio-MEMS application)

  • 김강현;김종현;남효영;김수현;임근배
    • 센서학회지
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    • 제30권3호
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    • pp.170-174
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    • 2021
  • As the rising attention to the medical and healthcare issue, Bio-MEMS (Micro electro mechanical systems) platform such as bio sensor, cell culture system, and microfluidics device has been studied extensively. Bio-MEMS platform mostly has high resolution structure made by biocompatible material such as polydimethylsiloxane (PDMS). In addition, three dimension structure has been applied to the bio-MEMS. Lithography can be used to fabricate complex structure by multiple process, however, non-rectangular cross section can be implemented by introducing optical apparatus to lithography technic. X-ray lithography can be used even for sub-micron scale. Here in, we demonstrated lines with round shape cross section using the tilted gold absorber which was deposited on the oblique structure as the X-ray mask. This structure was used as a mold for PDMS. Molded PDMS was applied to the cell culture platform. Moreover, molded PDMS was bonded to flat PDMS to utilize to the sub-micro channel. This work has potential to the large area bio-MEMS.

티타늄 초소수성 표면의 수명 향상을 위한 레이저 처리 기법 개발 및 내수명성 평가법 개발 (Development of Laser Processing Technology and Life Evaluation Method for Lifespan Improvement of Titanium Superhydrophobic Surface)

  • 정경은;박경렬;최용석;강성민;김운성;정송이;이경준
    • Tribology and Lubricants
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    • 제40권3호
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    • pp.91-96
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    • 2024
  • Recently, extensive studies have been carried out to enhance various performance aspects such as the durability, lifespan, and hardness by combining diverse materials or developing novel materials. The utilization of superhydrophobic surfaces, particularly in the automotive, textile, and medical device industries, has gained momentum to achieve improved performance and efficiency. Superhydrophobicity refers to a surface state where the contact angle when water droplets fall is above 150°, while the contact angle during sliding motion is smaller than 10°. Superhydrophobic surfaces offer the advantage of water droplets not easily sliding off, maintaining a cleaner state as the droplets leave the surface. Surface modification involves two fundamental steps to achieve superhydrophobicity: surface roughness increase and surface energy reduction. However, existing methods, such as time-consuming processes and toxic organic precursors, still face challenges. In this study, we propose a method for superhydrophobic surface modification using lasers, aiming to create roughness in micro/nanostructures, ensuring durability while improving the production time and ease of fabrication. The mechanical durability of superhydrophobic samples treated with lasers is comparatively evaluated against chemical etching samples. The experimental results demonstrate superior mechanical durability through the laser treatment. Therefore, this research provides an effective and practical approach to superhydrophobic surface modification, highlighting the utility of laser treatment.

MEMS 소자의 비아 홀에 대한 레이저 공정변수의 최적화 (Optimization of Laser Process Parameters for Realizing Optimal Via Holes for MEMS Devices)

  • 박시범;이철재;권희준;전찬봉;강정호
    • 대한기계학회논문집A
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    • 제34권11호
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    • pp.1765-1771
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    • 2010
  • MEMS 소자의 공정에서 가공된 비아 홀 품질은 소자의 성능에 가장 중요한 요소의 하나이다. Nd:$YVO_4$ 레이저로 가공한 비아 홀에 대한 레이저 미세가공의 일반적인 특징을 설명하고 그것의 측정에 대한 효율적인 최적화 방법을 소개한다. 본 논문의 최적화 방법은 직교다항식, 분산분석과 반응표면최적화는 최적 레이저 공정변수를 결정하고 주요 영향을 이해하는데 사용된다. 유의한 레이저 공정변수를 확인하고 이의 비아 홀 품질에 관한 영향을 고찰하였다. 레이저 공정변수의 최적 수준을 가지는 확인 실험은 최적화 방법의 유효성을 설명하기 위해 수행하였다.

사물인터넷 기반 초미세먼지(PM2.5) 측정 장치 개발 (Development of IoT-based PM2.5 Measuring Device)

  • 노병국;최기흥
    • 한국안전학회지
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    • 제32권1호
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    • pp.21-26
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    • 2017
  • An IoT-based particulate matter (PM2.5) sensing device (PSD) is developed. The PSD consists of a PM2.5 sensor, signal processing circuit, and wi-fi enabled-microprocessor along with temperature and humidity sensors. The PSD estimates PM2.5 density by measuring light scattered by PM2.5. To gauge performance of the PSD, PM2.5 density of open air was measured with the PSD and compared with that of the collocated-government-certified measuring station. Measurements were taken at a sampling frequency of 100 Hz and moving-averaged to remove measurement noise. When compared to the result of the measuring station, average percentile error of PM2.5 density from the PSD is found to be 31%. A correlation coefficient is found to be 0.72 which indicates a strong correlation. Instantaneous variation, however, may far exceed average errors, leading to a conclusion that the PSD is more suitable for estimating average trend of PM2.5 density variations than estimating instantaneous PM2.5 density.

피에조를 이용한 초소형 단일 솔더볼 연결부의 전단 시험장치 개발 (Development of a Shear Testing Machine for a Miniature Single Solder Ball Joint using Piezoelectric Loading Device)

  • 권용상;고국종;김호경
    • Tribology and Lubricants
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    • 제26권1호
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    • pp.44-51
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    • 2010
  • A miniature shear testing machine was designed and developed, adopting a piezoelectric actuator with mechanical advantage using 4 levers in order to investigate shear behavior of a small solder ball. The final output displacement was initially expected to be 2.88 mm without load resistance, considering the lever ratio of 24 and the piezo displacement of 0.12 mm with an exciting voltage of 10 V. However, the final plunger displacement ${\Delta}{\upsilon}$ can be expected as ${\Delta}{\upsilon}=2.88-3.04{\times}10^{-4}F$ as a function of piezoelectric force F due to the stiffness of various levers and connectors and piezo actuator. The shear behavior of lead-free solder ball in diameter of $760{\mu}m$ was successfully investigated in a speed range of 2 mm/s~0.0035 mm/s using this designed device.

패키징으로 인한 응력이 MEMS 소자에 미치는 영향 분석 및 개선 (Effects of Package Induced Stress on MEMS Device and Its Improvements)

  • 좌성훈;조용철;이문철
    • 한국정밀공학회지
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    • 제22권11호
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    • pp.165-172
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    • 2005
  • In MEMS (Micro-Electro-Mechanical System), packaging induced stress or stress induced structure deformation becomes increasing concerns since it directly affects the performance of the device. In the decoupled vibratory MEMS gyroscope, the main factor that determines the yield rate is the frequency difference between the sensing and driving modes. The gyroscope, packaged using the anodic bonding at the wafer level and EMC (epoxy molding compound) molding, has a deformation of MEMS structure caused by thermal expansion mismatch. This effect results in large distribution in the frequency difference, and thereby a lower yield rate. To improve the yield rate we propose a packaged SiOG (Silicon On Glass) process technology. It uses a silicon wafer and two glass wafers to minimize the wafer warpage. Thus the warpage of the wafer is greatly reduced and the frequency difference is more uniformly distributed. In addition. in order to increase robustness of the structure against deformation caused by EMC molding, a 'crab-leg' type spring is replaced with a semi-folded spring. The results show that the frequency shift is greatly reduced after applying the semi-folded spring. Therefore we can achieve a more robust vibratory MEMS gyroscope with a higher yield rate.

ILD CMP 공정중 발생하는 Scratch 발생기구에 관한 연구 (Formation mechanism of scratches on ILD CMP)

  • 김인곤;최재건;박진구
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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    • pp.119-120
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    • 2008
  • ILD CMP process has been well accepted for the planarization of the dielectric oxide film and becomes a critical process in ULSI manufacturing due to the rapid shrinkage of the design rule for the device. In total manufacturing process steps for a device, the proportion of ILD CMP process has been gradually increased. Ever since ILD CMP has been introduced, the scratches have been a major defects on polished surfaces which cause the electrical shorts between vias or metal lines [1,2]. It was reported that micro-scratches are caused by large, irregularly shaped particles during CMP process. Therefore, most of the CMP users have used < 5 m POU filter to remove and reduce the scratch source from the slurry. However, the scratch has always been the biggest concern in ILD polishing whatever preventive actions are taken. Silica and ceria slurries are widely used for ILD CMP process. There are not much differences in generated scratches and their formation mechanism. In this study, the scratches were investigated as a function of polishing conditions with possible explanation on formation mechanism in ILD CMP.

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초음파 모터를 이용한 힘 반영 촉각장치 (A Force-Reflecting Haptic interface using Ultrasonic Motors)

  • 신덕;오금곤;김영동
    • 조명전기설비학회논문지
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    • 제13권1호
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    • pp.111-118
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    • 1999
  • 함반영 촉각장치(Force-Reflecting haptic Interface)는 인간이 컴퓨터에 의해 생성한 가상의 세계에 손의 위치 정보를 제공하고 가상의 손이 가상 환경에 접촉했을 때 인간에게 촉각을 전달하는 장치이다. 본 논문에서는 컴플라이언스 제어가 비교적 용이한 초음파 모터 액츄에이터를 사용하여 직접구동 방식으로 촉각장치를 설계하였다. 렌더링 알고리즘을 이용하여 가상의 벽, 가상 버튼, 가상 구멍 등의 기본적인 역감실험을 한 결과 힘 반영에 의한 역감을 제시받을 수 있었다.

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MEMS기술에 의한 탐침용 소자의 제작 (Fabrication of probing device by MEMS technology)

  • 이근우;김창교;이재홍
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2007년도 제38회 하계학술대회
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    • pp.1522-1523
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    • 2007
  • MEMS(Micro Electro Mechanical Systems)기술과 니켈 전기도금 공정을 이용하여 수십 내지 수백개의 탐침소자를 갖는 프르브디바이스(probe device)를 제작하였다. 사용된 기판은 $4000{\AA}$의 oxide가 있는 p-type 실리콘 웨이퍼로서, 기판위에 NiCr과 Au를 증착한 후 PR 패터닝을 통하여 니켈을 전기도금법으로 도금하고 니켈 도금층을 제외한 부분의 NiCr과 Au를 식각함으로서 전류가 흐르는 라인(line)배선과 탐침소자가 세워질 라인을 형성하였다. 그 후 후막의 PR을 코팅하고 탐침소자가 세워질 부분을 패터닝 한 후 전기도금법을 이용하여 니켈 탐침소자를 제작하였다. 제작된 탐침소자 하나의 크기는 $60{\mu}m$의 폭과 $70{\mu}m$의 높이를 보이며, 탐침소자 전체의 크기는 $250{\mu}m$이고 탐침소자와 탐침소자 사이의 간격은 $50{\mu}m$로 제작되었다. 본 연구에서 제작된 탐침소자의 수는 25*2line으로서 총 50개 이지만 이러한 공정방식을 이용하고 탐침소자의 크기를 작게 제작한다면 하나의 프르브 디바이스에 수백 내지수천 개의 탐침소자를 제작할 수 있을 것이다.

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