• Proceedings of the KWS Conference
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• 2003.11a
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• pp.234-236
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• 2003

• Proceedings of the KWS Conference
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• 2002.05a
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• pp.260-262
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• 2002

• Proceedings of the KWS Conference
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• 2005.11a
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• pp.213-215
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• 2005

• Proceedings of the KWS Conference
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• 2001.05a
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• pp.297-299
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• 2001

• Proceedings of the KWS Conference
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• 2001.05a
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• pp.305-307
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• 2001

• Proceedings of the Korean Society of Laser Processing Conference
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• 2004.10a
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• pp.44-49
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• 2004

• Journal of Welding and Joining
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• v.26 no.3
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• pp.37-44
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• 2008

Charpy V-Notch test is commonly used to evaluate fracture toughness. However, since the region to be evaluated is limited to bulk material due to the specimen size required, individual evaluation of micro-structures on weldment is very difficult. In this study, ASP(Advanced Small Punch) test was carried out to evaluate material degradation and fracture toughness on the B.M, W.M and each micro-structures of HAZ for X20CrMoV121 and 2.25Cr1Mo steels with artificial aging time. In addition, to evaluate fracture toughness and material degradation of B.M and W.M of X20CrMoV121 steels with aging times, CVN (Charpy V-notch) test was performed. And then the correlation between ASP and CVN test on X20CrMoV121 steels was obtained. Furthermore, through this correlation, material degradation property of each micro-region of the HAZ in weldment, which was impossible to be evaluated by the CVN test, can be estimated and determined.

• Journal of Welding and Joining
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• v.29 no.1
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• pp.33-35
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• 2011

• Journal of the Microelectronics and Packaging Society
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• v.30 no.1
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• pp.1-16
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• 2023

Recently, the shift to next-generation wide-bandgap (WBG) power semiconductor for electric vehicle is accelerated due to the need to improve power conversion efficiency and to overcome the limitation of conventional Si power semiconductor. With the adoption of WBG semiconductor, it is also required that the packaging materials for power modules have high temperature durability. As an alternative to conventional high-temperature Pb-based solder, Ag sintering die attach, which is one of the power module packaging process, is receiving attention. In this study, we will introduce the recent research trends on the Ag sintering die attach process. The effects of sintering parameters on the bonding properties and methodology on the exact physical properties of Ag sintered layer by the realization 3D image are discussed. In addition, trends in thermal shock and power cycle reliability test results for power module are discussed.

• Proceedings of the KWS Conference
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• 1993.05a
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• pp.132-134
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• 1993

The conventional way of molten nugget size measurement in welding process have utilized the metal-microscope by examining the micro sectioned weld specimen after micro-etching procedure. This paper proposes a new method for exact measurement of molten nugget size with the aid of the digital image processing unit and some developed software. This method proved to be convenient and precise in that resulting resolution and accuracy are as good as that of the conventional method.