• Journal of Welding and Joining
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• 제23권5호
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• pp.55-60
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• 2005

A precise bonding technique, transmission laser bonding using energy transfer, for polymer micro devices is presented. The irradiated IR laser beam passes through the transparent part and absorbed on the opaque part. The absorbed energy is converted into heat and bonding takes place. In order to optimize the bonding quality, the temperature profile on the interface must be obtained. Using optical measurements of the both plates, the absorbed energy can be calculated. At the wavelength of 1100nm $87.5\%$ of incident laser energy was used for bonding process from the calculation. A heat transfer model was applied for obtaining the transient temperature profile. It was found that with the power of 29.5 mW, the interface begins to melt and bond each other in 3 sec and it is in a good agreement with experiment results. The transmission IR laser bonding has a potential in the local precise bonding in MEMS or Lab-on-a-chip applications.

• Journal of Welding and Joining
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• 제22권4호
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• pp.7-11
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• 2004

현재 우리나라의 주력산업은 자동차, 선박, 항공 및 건설/토목과 같은 거시적인 산업과 전자, 반도체, 정보통신과 같은 미시적인 산업으로 나눌 수 있다. 이들 산업에 있어서 접합기술의 역할은 각종 부품 및 제품을 제조하는데 필요한 핵심 조립기술을 제공하는 것이다. 현대의 국제 산업의 큰 흐름을 살펴보면 첨단 ITㆍ나노 기술의 급속한 개발과 더불어 이들 기술을 응용한 부ㆍ제품들이 다기능, 소형 경량화 되어 가는 추세에 있다.(중략)

• Journal of Welding and Joining
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• 제29권5호
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• pp.95-98
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• 2011

Recently, there is a growing tendency that fine-pitch electronic devices are increased due to higher density and very large scale integration. Finer pitch printed circuit board(PCB) is to be decrease insulation resistance between circuit patterns and electrical components, which will induce to electrical short in electronic circuit by electrochemical migration when it exposes to long term in high temperature and high humidity. In this research, the effect of soldering flux acting as an electrical carrier between conductors on electrochemical migration was investigated. The PCB pad was coated with OSP finish. Sn3.0Ag0.5Cu solder paste was printed on the PCB circuit and then the coupon was treated by reflow process. Thereby, specimen for ion migration test was fabricated. Electrochemical migration test was conducted under the condition of DC 48 V, $85^{\circ}C$, and 85 % relative humidity. Their life time could be increased about 22% by means of removal of flux. The fundamentals and mechanism of electrochemical migration was discussed depending on the existence of flux residues after reflow process.

• Proceedings of the KWS Conference
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• 대한용접접합학회 2009년 추계학술발표대회
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• pp.77-77
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• 2009

ELV(; End of Life Vehicles)를 비롯한 최근 환경 동향은 자동차 전장 모듈에 대하여 다양한 무연 솔더 적용을 요구하고 있다. 특히 자동차 엔진룸과 트랜스미션은 가동 중 고온 및 진동의 지속적인 영향을 받기 때문에 이와 유사한 환경에서의 신뢰성 연구가 필요한 시점이다. 이에 본 연구에서는 Sn3.5Ag, Sn0.7Cu, Sn5.0Sb 솔더 조성에 대하여 복합환경 조건하에서 접합부 신뢰성을 평가하였다. 복합환경을 구현하기 위하여 $-40{\sim}150^{\circ}C$ 범위의 온도 사이클과 랜덤 진동을 동시에 인가하였으며, 진동 가속도 3G, 진동주파수는 10~1000Hz 로 설정하여 자동차 환경을 충족하였다. 복합시험의 1 cycle 은 20 시간이며, 총 120 시간의 시험 동안 진동의 영향 및 진동과 고온이 동시에 작용하였을 경우의 영향에 대해 비교하였다. 테스트 모듈 제작을 위해 450 um 의 솔더볼이 적용되었으며, 각 조성의 솔더볼을 이용하여 BGA test chip 제작하였고, 제작된 BGA test chip 은 다시 daisy chain PCB 위에 실장 및 리플로우 공정을 통해 접합되었다. 테스트 동안 In-situ 로 저항의 변화를 관찰하여 파단의 유무를 판단하였고 전자주사현미경을 통해 파괴 기전을 평가하였다. 복합시험 시간에 따른 전단강도를 측정하였으며, 각 조성에 대하여 상이한 전단강도 변화를 관찰하였다. 계면 IMC 형상은 전단강도 변화에 영향을 주었으며, 특히 높은 온도가 IMC 성장을 촉진시켜 전단강도 감소에 영향을 주었다. 본 복합환경 시험 조건에서는 Sn0.7Cu 가 가장 안정적이었으며, 파단면을 관찰한 결과 연성파괴 모드가 관찰되었다.

• Proceedings of the KWS Conference
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• 대한용접접합학회 2007년 추계학술발표대회 개요집
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• pp.57-59
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• 2007

• Proceedings of the KWS Conference
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• 대한용접접합학회 2001년도 추계학술발표대회 개요집
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• pp.225-228
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• 2001

• Journal of the Korean Society for Precision Engineering
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• 제24권3호
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• pp.108-116
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• 2007

To overcome many defects such as the high product cost, large energy consumption, and big space capacity in conventional mechanical machining, the miniaturization of machine tool and micro factory systems has been envisioned recently. The object of this paper is to research the effect of dynamic characteristic parameters in bolted-joint beams, which is widely applied to the joining of mechanical structures in order to identify structural system characteristics and to predict dynamic behavior according to scale-down from macro to micro system as the development of micro/meso-scale machine tool and micro factories. Modal parameters such as the natural frequency, damping ratio, and mode shape from modal testing and dynamic characteristics from finite element analysis are extracted with all 12 test beam models by materials, by size, and by joining condition, and then the results obtained by both methods are compared.

• Journal of the Korean Society for Precision Engineering
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• 제28권5호
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• pp.578-584
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• 2011

In mechanical cutting process, burr was generated at workpiece by cutting tool generally. It is working disturbance during manufacturing process. Besides burr was taken shape relatively large size more micro scale machining than macro scale machining. Many researches have been studied to remove micro burr(de-burring), because it was negative effect for accuracy of machining shape. However, micro de-burring was constrained by burr height, micro feature and so on. In this paper, experimental research was carried out to compare de-burring characteristics of $Al_2O_3$ abrasive and polymer.

• Journal of Welding and Joining
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• 제23권6호
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• pp.43-48
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• 2005

This work was carried out to obtain sound welds and to select a most suitable binary metal joint among three different dissimilar binary metal combinations such as Zr-4/Ta, Mo/Ta and Ti/Ta(seal tube/sensor sheath) joints fur the instrumented nuclear fuel irradiation test. To do this, Taguchi experimental method was employed to optimize the experimental data. In addition, metallography, micro-focus x-ray radiography and hardness test were conducted to examine the welds. From the weld bead appearance, penetration depth and bead width as well as weld defects standpoint, Zr-4/Ta joint is suggested for the circumferential joining between a seal tube and a sensor sheath. The optimized welding parameters based on Zr-4/Ta joint are suggested as well.

• Journal of the Microelectronics and Packaging Society
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• 제22권1호
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• pp.69-74
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• 2015

With difficulties during the cleaning of reflow flux residues due to the decrease of the part size and interconnection pitch in the advanced electronic devices, the need for the no-clean solder paste is increasing. In this study, an epoxy curable solder paste was made with SAC305 solder powder and the curable flux of which the main ingredient is epoxy resin and its reflow solderability, flux residue corrosivity and solder joint mechanical properties was investigated with comparison to the commercial rosin type solder paste. The fillet shape of the cured product around the reflowed solder joint revealed that the curing reaction occurred following the fluxing reaction and solder joint formation. The copper plate solderability test result also revealed that the wettability of the epoxy curable solder paste was comparable to those of the commercial rosin type solder pastes. In the highly accelerated temperature and humidity test, the cured product residue of the curable solder paste showed no corrosion of copper plate. From FT-IR analysis, it was considered to be resulted from the formation of tight bond through epoxy curing reaction. Ball shear, ball pull and die shear tests revealed that the adhesive bonding was formed with the solder surface and the increase of die shear strength of about 15~40% was achieved. It was considered that the epoxy curable solder paste could contribute to the improvement of the package reliability as well as the removal of the flux residue cleaning process.